Substrate processing method

Patent metadata

Field	Value
Publication number	US-10835908-B2
Application number	US-201815988129-A
Country	US
Kind code	B2
Filing date	May 24, 2018
Priority date	Aug 27, 2013
Publication date	Nov 17, 2020
Grant date	Nov 17, 2020

Abstract

Productivity can be improved. A substrate processing method includes a processing liquid supplying process of supplying a processing liquid, which contains a volatile component and forms a film on a substrate, onto the substrate on which a pre-treatment, which requires atmosphere management or time management after the pre-treatment, is performed; and an accommodating process of accommodating, in a transfer container, the substrate on which the processing liquid is solidified or cured by volatilization of the volatile component.

First claim

We claim:

1. A substrate processing method, comprising:
a pre-treatment process of performing dry etching or ashing on a substrate;
a processing liquid supplying process of supplying a processing liquid, which contains a volatile component and forms a film on the substrate, onto the substrate after the pre-treatment process;
a solidifying or curing process of solidifying or curing the processing liquid by volatilization of the volatile component;
an other surface process of cleaning, in a state that an entire main surface of the substrate is covered with the solidified or cured processing liquid, an other surface of the substrate by jetting gas clusters to the other surface of the substrate; and
an accommodating process of accommodating, in a transfer container, the substrate after the other surface process.

2. The substrate processing method of claim 1 ,
wherein the pre-treatment is a process in which a portion to be modified by being exposed to the atmosphere is formed on a surface of the substrate.

3. The substrate processing method of claim 1 , further comprising:
an unloading process of taking out the substrate accommodated in the transfer container after the processing liquid supplying process; and
a removing process of removing the solidified or cured processing liquid from the substrate after the unloading process.

4. The substrate processing method of claim 3 , further comprising:
a post-treatment process of performing a preset post-treatment on the substrate after the removing process.

5. The substrate processing method of claim 4 ,
wherein the post-treatment is a process in which wet cleaning is performed on the substrate after the removing process.

6. The substrate processing method of claim 4 ,
wherein the post-treatment is a process in which dry etching is performed on the substrate after the removing process.

7. The substrate processing method of claim 4 ,
wherein in the pre-treatment process, a metal film is formed in the substrate before the processing liquid supplying process, and
the post-treatment is a process in which a metal film is formed on the substrate after the removing process.

8. The substrate processing method of claim 4 ,
wherein in the pre-treatment process, wet cleaning is performed on the substrate before the processing liquid supplying process, and
the post-treatment is a process in which a metal film is formed on the substrate after the removing process.

9. The substrate processing method of claim 4 ,
wherein in the pre-treatment process, wet cleaning is performed on the substrate before the processing liquid supplying process,
the processing liquid is a liquid of a sublimation material, and
in the removing process, the solidified or cured processing liquid is removed from the substrate by sublimation.

10. The substrate processing method of claim 3 ,
wherein, in the removing process, the solidified or cured processing liquid is removed from the substrate by supplying a removing liquid.

11. The substrate processing method of claim 10 ,
wherein the removing liquid contains an anticorrosive material for a metal wiring formed in the substrate.

Assignees

• Tokyo Electron Ltd

Inventors

• Kaneko Miyako
• Orii Takehiko
• Kanno Itaru

Classifications

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P70/234 Primary

  the processing being the formation of vias or contact holes · CPC title

• H10W20/081

  by forming openings in the dielectric parts · CPC title

• B05B7/2497

  several liquids from different sources being supplied to the discharge device · CPC title

• B05B13/0228

  the movement of the objects being rotative (B05B13/0242 takes precedence) · CPC title