Cooling methods for electronic components

Patent metadata

Field	Value
Publication number	US-10834852-B2
Application number	US-201916386405-A
Country	US
Kind code	B2
Filing date	Apr 17, 2019
Priority date	Nov 15, 2012
Publication date	Nov 10, 2020
Grant date	Nov 10, 2020

Abstract

A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.

First claim

What is claimed is:

1. A method for conveying heat away from a circuit board having at least one integrated circuit mounted thereon, the method comprising:
installing a connector of the circuit board into a receptacle; and
fitting a conformable thermal interface sleeve over the circuit board by inserting the circuit board through an opening to an interior portion of the conformable thermal interface sleeve such that the interior portion embraces both a first side surface of the circuit board and a second side surface of the circuit board,
wherein, after the conformable thermal interface sleeve is fitted over the circuit board and the circuit board is installed, heat generated by the at least one integrated circuit of the circuit board during use is conducted away from the circuit board through the conformable thermal interface sleeve.

2. The method of claim 1 , wherein the circuit board has at least one memory module.

3. The method of claim 1 , wherein the conformable thermal interface sleeve is elastically conformable such that it elastically conforms about the at least one integrated circuit mounted on the circuit board as the sleeve is being fitted over the circuit board.

4. The method of claim 3 , wherein the conformable thermal interface sleeve is a one-piece structure.

5. The method of claim 1 , wherein the integrated circuit extends outwardly from a portion of the first side surface of the circuit board, and wherein the interior portion of the conformable thermal interface sleeve elastically conforms around the integrated circuit and embraces substantially the entire first side surface once the circuit board is inserted through the opening to the interior portion of the conformable thermal interface sleeve.

6. The method of claim 1 , wherein the conformable thermal interface sleeve is made from a polymeric composite material.

7. The method of claim 1 , wherein the conformable thermal interface sleeve is made from a material having a Young's modulus of less than 200 kPa.

8. The method of claim 1 , wherein the interior portion of the thermal interface sleeve has a width that is less than a width of the circuit board, and wherein the interior portion having a width that is less than the width of the circuit board causes the thermal interface sleeve to be displaced as the circuit board is inserted through the opening.

9. A method for removing heat generated by a circuit board having at least one integrated circuit mounted thereon, wherein a conformable thermal interface sleeve is fitted over the circuit board such that an interior portion of the conformable thermal interface sleeve embraces both a first side surface of the circuit board and a second side surface of the circuit board, the method comprising:
conducting the heat generated by the at least one integrated circuit of the circuit board, over which the conformable thermal interface sleeve is fitted, away from the circuit board through the conformable thermal interface sleeve.

10. The method of claim 9 , wherein the circuit board has at least one memory module.

11. The method of claim 9 , wherein the conformable thermal interface sleeve is elastically conformable such that it is elastically conformed about the at least one integrated circuit mounted on the circuit board while fitted over the circuit board.

12. The method of claim 11 , wherein the conformable thermal interface sleeve is a one-piece structure.

13. The method of claim 9 , wherein the integrated circuit extends outwardly from a portion of the first side surface of the circuit board, and wherein the interior portion of the conformable thermal interface sleeve elastically conforms around the integrated circuit and embraces substantially the entire first side surface.

14. The method of claim 9 , wherein the conformable thermal interface sleeve is made from a polymeric composite material.

15. The method of claim 9 , wherein the conformable thermal interface sleeve is made from a material having thermal conductivity of greater than 0.65 W/m-K and a Young's modulus of less than 200 kPa.

16. A method for conveying heat away from an electronic component, the method comprising:
installing a connector of the electronic component into a receptacle; and
fitting a conformable thermal interface sleeve over the electronic component by inserting the electronic component through an opening to an interior portion of the conformable thermal interface sleeve such that the interior portion embraces both a first side surface of the electronic component and a second side surface of the electronic component,
wherein, after the conformable thermal interface sleeve is fitted over the electronic component and the electronic component is installed, heat generated by the electronic component during use is conducted away from the electronic component through the conformable thermal interface sleeve,
wherein a memory module extends outwardly from a portion of the first side surface of the electronic component, and wherein a first contact surface of the interior portion of the conformable thermal interface sleeve elastically conforms around the memory module and embraces substantially the entire first side surface once the electronic component is inserted through the opening to the interior portion of the conformable thermal interface sleeve.

Assignees

• IBM

Inventors

• Cox Aaron R
• Grady Iv William J
• Matteson Jason A
• Minyard Jason E

Classifications

• H10W40/237

  attached to additional arrangements for cooling · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W40/40

  involving heat exchange by flowing fluids · CPC title

• H10W40/22 Primary

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H05K7/20309

  Evaporators · CPC title