Cooling system for electronics

Patent metadata

Field	Value
Publication number	US-2016374231-A1
Application number	US-201615253925-A
Country	US
Kind code	A1
Filing date	Sep 1, 2016
Priority date	Nov 15, 2012
Publication date	Dec 22, 2016
Grant date	—

Abstract

A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.

First claim

What is claimed is:

1 . A method for conveying heat away from an electronic component, the method comprising:
positioning an interior portion of a conformable thermal interface sleeve over the electronic component in an installed position, whereby the interior portion embraces both a first side surface of the electronic component and a second side surface of the electronic component; positioning a first angular surface of a first heat conducting wedge against a first angular outer surface of the conformable thermal interface sleeve; positioning a second angular surface of a second heat conducting wedge against a second angular outer surface of the conformable thermal interface sleeve; positioning a first thermal channel adapted to conduct heat away from the first heat conducting wedge in contact with the first heat conducting wedge; positioning a second thermal channel adapted to conduct heat away from the second heat conducting wedge in contact with the second heat conducting wedge; and positioning a manifold in contact with the first thermal channel and the second thermal channel.

2 . The method of claim 1 , wherein the electronic component is a circuit board having at least one memory module.

3 . The method of claim 1 , wherein the first thermal channel is a first heat pipe and wherein
the second thermal channel is a second heat pipe.

4 . The method of claim 1 , wherein the first thermal channel includes a first fluid channel and wherein the second thermal channel includes a second fluid channel.

5 . The method of claim 1 , wherein positioning an interior portion of a conformable thermal interface sleeve over the electronic component in an installed position comprises:
inserting the electronic component into the interior portion.

6 . The method of claim 1 , wherein the interior portion of the conformable thermal interface sleeve includes a first contact surface having a profile sculpted to conform to a configuration of the first side surface of the electronic component.

7 . The method of claim 1 , further comprising:
positioning a latching mechanism that secures the conformable thermal interface sleeve to the first heat conducting wedge and the second heat conducting wedge.

8 . The method of claim 1 , wherein the conformable thermal interface sleeve is a one-piece structure.

9 . The method of claim 1 , wherein a memory module extends outwardly from a portion of the first side surface of the electronic component, and wherein a first contact surface of the interior portion of the conformable thermal interface sleeve elastically conforms around the memory module and embraces substantially the entire first side surface when the interior portion of the conformable thermal interface sleeve is positioned over the electronic component in the installed position.

10 . The method of claim 1 , wherein the conformable thermal interface sleeve is made from a polymeric composite material.

11 . The method of claim 1 , wherein the conformable thermal interface sleeve is made from a material having thermal conductivity of greater than 0.65 W/m-K and a Young's modulus of less than 200 kPa.

12 . The method of claim 1 , wherein the interior portion of the thermal interface sleeve has a width that is less than a width of the electronic component, and wherein the interior portion of the thermal interface sleeve is displaced as it is positioned over the electronic component in the installed position.

13 . The method of claim 1 , wherein a metal shell encompasses an outside of the conformable thermal interface sleeve and is adapted to maintain a shape of the conformable thermal interface sleeve.

14 . A method for conveying heat away from an electronic component, the method comprising:
installing a connector of the electronic component into a receptacle; fitting an conformable thermal interface sleeve over the electronic component such that an interior portion of the conformable thermal interface sleeve embraces both a first side surface of the electronic component and a second side surface of the electronic component; positioning a first angular surface of a first heat conducting wedge against a first angular outer surface of the conformable thermal interface sleeve, wherein the first heat conducting wedge is in contact with a first thermal channel adapted to conduct heat away from the first heat conducting wedge; and positioning a second angular surface of a second heat conducting wedge against a second angular outer surface of the conformable thermal interface sleeve, wherein the second heat conducting wedge is in contact with a second thermal channel adapted to conduct heat away from the first heat conducting wedge.

15 . The method of claim 14 , wherein the electronic component is a circuit board having at least one memory module.

16 . The method of claim 14 , wherein the first thermal channel includes a first fluid channel and wherein the second thermal channel includes a second fluid channel.

17 . The method of claim 14 , wherein fitting an conformable thermal interface sleeve over the electronic component such that an interior portion of the conformable thermal interface sleeve embraces both a first side surface of the electronic component and a second side surface of the electronic component comprises:
inserting the electronic component into the interior portion.

18 . The method of claim 14 , wherein the interior portion of the thermal interface sleeve has a width that is less than a width of the electronic component, and wherein the interior portion of the thermal interface sleeve is displaced as it is fitted over the electronic component.

19 . A method for removing heat generated by an electronic component, wherein a conformable thermal interface sleeve is fitted over the electronic component such that an interior portion of the conformable thermal interface sleeve embraces both a first side surface of the electronic component and a second side surface of the electronic component, the method comprising:
conducting the heat generated by the electronic component, over which the conformable thermal interface sleeve is fitted, away from a first heat conducting wedge and toward a manifold by circulating a fluid through a first thermal channel coupled to both the first heat conducting wedge and the manifold, wherein a first angular surface of the first heat conducting wedge is positioned against a first angular outer surface of the conformable thermal interface sleeve; and conducting the heat generated by the electronic component, over which the conformable thermal interface sleeve is fitted, away from a second heat conducting wedge and toward the manifold by circulating the fluid through a second thermal channel coupled to both the second heat conducting wedge and the manifold, wherein a second angular surface of the second heat conducting wedge is positioned against a second angular outer surface of the conformable thermal interface sleeve.

Assignees

• IBM

Inventors

• Cox Aaron R
• Grady Iv William J
• Matteson Jason A
• Minyard Jason E

Classifications

• H10W40/237

  attached to additional arrangements for cooling · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W40/40

  involving heat exchange by flowing fluids · CPC title

• H10W40/22 Primary

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title