Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components

Patent metadata

Field	Value
Publication number	US-10827626-B2
Application number	US-201715807110-A
Country	US
Kind code	B2
Filing date	Nov 8, 2017
Priority date	Nov 8, 2016
Publication date	Nov 3, 2020
Grant date	Nov 3, 2020

Abstract

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

First claim

What is claimed is:

1. An assembly during manufacture of a printed circuit board assembly, the assembly comprising:
a circuit board;
a plurality of components on the circuit board, at least one of the components being a thermally-sensitive component having a maximum temperature threshold; and
a customized protective heat shield removably disposed on and configured to cover an individual thermally-sensitive component, the customized protective heat shield surrounding at least a portion of the thermally-sensitive component and shaped complementary to at least a portion of the thermally-sensitive component and to thermally insulate the thermally-sensitive component from a high-temperature environment having temperatures above the maximum temperature threshold such that a temperature of the thermally-sensitive component is maintained below the maximum temperature threshold.

2. The assembly according to claim 1 , wherein the customized protective heat shield is 3D printed and formed of a high temperature grade plastic.

3. The assembly according to claim 1 , wherein the customized protective heat shield includes an engagement finger configured to engage a portion of the thermally-sensitive component.

4. The assembly according to claim 1 , wherein the customized protective heat shield defines an opening configured to receive a connector of the thermally-sensitive component.

Assignees

• Flex Ltd

Inventors

• Mehkri Zohair
• Mohammed Anwar
• Tan Jesus
• Geiger David
• Kurwa Murad

Classifications

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title

• H05K2203/044

  Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering · CPC title

• H05K2203/0195

  Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure · CPC title

• B23K1/20

  Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating · CPC title

• H05K2201/10522

  Adjacent components · CPC title