Electronic part and electronic control unit
US-9224563-B2 · Dec 29, 2015 · US
Surface mount device
US9106005B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9106005-B2 |
| Application number | US-201213356791-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 24, 2012 |
| Priority date | Jan 31, 2011 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead.
First claim
Opening claim text (preview).
What is claimed is: 1. A surface mount device to be mounted on a base member, comprising: a plurality of leads each including a body portion extending in a first direction, and a foot bent from a first end of the body portion to be positioned at an end of the lead and provided with a flat surface that faces toward the base member, the lead being formed by a conductive portion formed at a center, a surface layer formed at a surface, and a base layer formed between the c…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H05K3/3426Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9106005B2 cover?
- Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for …
- Who is the assignee on this patent?
- Okuyama Takeshi, Kusagaya Toshihiro, Yamakami Tohru, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H05K3/3426. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).