Method and device for self-assembling semiconductor light-emitting diodes

Patent metadata

Field	Value
Publication number	US-10825702-B2
Application number	US-201916388394-A
Country	US
Kind code	B2
Filing date	Apr 18, 2019
Priority date	Apr 19, 2018
Publication date	Nov 3, 2020
Grant date	Nov 3, 2020

Abstract

The present invention relates to a device and method for self-assembling semiconductor light-emitting diodes. Particularly, a method for manufacturing a display device according to the present invention includes: feeding a substrate to an assembly site and putting semiconductor light-emitting diodes having a magnetic material into a fluid chamber; applying a magnetic force to the semiconductor light-emitting diodes so that the semiconductor light-emitting diodes move in one direction within the fluid chamber; and guiding the semiconductor light-emitting diodes to preset positions on the substrate by applying an electric field, so that the semiconductor light-emitting diodes are mounted at the preset positions while in the process of being moved.

First claim

What is claimed is:

1. A device for self-assembling a plurality of semiconductor light-emitting diodes, the device comprising:
a fluid chamber with a space configured to contain a fluid to allow movement of the plurality of semiconductor light-emitting diodes having a magnetic material;
a feeder to feed a substrate to an assembly site;
a magnet placed at a distance from the fluid chamber and configured to apply a magnetic force to the plurality of semiconductor light-emitting diodes; and
a position controller connected to the magnet and configured to control positions of the magnet,
wherein the substrate is configured to form an electric field so that the plurality of semiconductor light-emitting diodes will be mounted at preset positions on the substrate while in a process of being moved by changes in the positions of the magnet, and
wherein the substrate comprises:
a base portion;
a plurality of electrodes placed on the substrate, and
a dielectric layer that covers the plurality of electrodes when power is applied to the plurality of electrodes, so that the electric field is formed;
wherein the substrate is placed in the fluid chamber so that an assembly surface where the plurality of semiconductor light-emitting diodes are assembled faces downwards;
wherein the assembly surface of the substrate is dipped in the fluid in the fluid chamber;
wherein the magnet is placed to face the opposite side of the assembly surface of the substrate.

2. The device of claim 1 , wherein the magnet is configured to rotate in a horizontal, clockwise, or counterclockwise directions to the substrate.

3. The device of claim 1 , wherein the substrate further comprises:
a plurality of cells sequentially arranged in one direction along barrier walls protruding from the base portion, and
wherein the plurality of electrodes are placed on undersides of the plurality of cells.

4. The device of claim 3 ,
wherein the dielectric layer forms a bottom of the plurality of cells, and the dielectric layer is interposed between the plurality of semiconductor light-emitting diodes and the plurality of electrodes so that the plurality of semiconductor light-emitting diodes are not in direct contact with the plurality of the electrodes.

5. The device of claim 3 , further comprising a power supply that is electrically connected to the plurality of electrodes so as to generate the electric field by applying power to the plurality of electrodes.

6. The device of claim 1 , wherein the fluid chamber includes a light-transmissive bottom plate, and the plurality of semiconductor light-emitting diodes are placed between the light-transmissive bottom plate and the substrate.

7. The device of claim 6 , further comprising an image sensor that is placed opposite the light-transmissive bottom plate so as to monitor the inside of the fluid chamber through the light-transmissive bottom plate.

8. The device of claim 1 , wherein the magnetic material is provided in a form of particles in a layer, or a layer of the magnetic material.

9. The device of claim 1 , wherein a spacing between the plurality of semiconductor light-emitting diodes is controlled by adjusting a strength of the magnetic force.

Assignees

• Lg Electronics Inc

Inventors

• Shim Bongchu
• Kim Dohee
• Park Changseo
• Cho Hyunwoo

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10P72/0446 Primary

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10H20/0364

  of interconnections · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/018

  Bonding of wafers · CPC title