Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Light emitting diodes and a method of packaging the same
US2016111408A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016111408-A1 |
| Application number | US-201514967629-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 14, 2015 |
| Priority date | Apr 20, 2012 |
| Publication date | Apr 21, 2016 |
| Grant date | — |
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- Title
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Abstract
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Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.
First claim
Opening claim text (preview).
What is claimed: 1 . A method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto a front side of a substrate using magnets that are arranged at pre-determined locations either directly on the backside of the substrate or near the backside of the substrate; and forming permanent electrical and/or mechanical connections between the dies and the substrate thereby constituting an array of LED dies on a substrate, wherein the exposing further comprises exposing the dies to a magnetic force that is arranged either on or beneath the substrate and beneath a surface of the fluid to sink the dies beneath the surface of the fluid and onto respective ones of the magnets that are arranged either on or near the substrate. 2 . The method of claim 1 , wherein the exposing further comprises seating the dies in respective apertures of a mask that is applied over top of the substrate, wherein the apertures correspond in position to the magnets. 3 . The method of claim 2 , wherein prior to the forming, the method further comprises removing the mask while leaving the dies in their respective positions on the substrate.
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Classifications
Subject matter not provided for in other groups of this subclass · CPC title
Means for applying energy, e.g. ovens or lasers · CPC title
comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title
Bond pads specially adapted therefor · CPC title
batch processes · CPC title
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- What does patent US2016111408A1 cover?
- Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED …
- Who is the assignee on this patent?
- Rensselaer Polytech Inst
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Apr 21 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).