Electronic component module and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10820456-B2
Application number	US-201916367641-A
Country	US
Kind code	B2
Filing date	Mar 28, 2019
Priority date	Sep 14, 2018
Publication date	Oct 27, 2020
Grant date	Oct 27, 2020

Abstract

An electronic device module includes a first substrate, at least one electronic device mounted on a lower surface of the first substrate, a second substrate mounted on a lower surface of the first substrate to electrically connect the first substrate to an external source of power, a connecting conductor bonded to a lower surface of the second substrate, and a sealing portion sealing the electronic device, the second substrate, and the connecting conductor, wherein a mounting height of the second substrate is configured to be lower than a mounting height of the electronic device.

First claim

What is claimed is:

1. An electronic device module comprising:
a first substrate;
an electronic device mounted on a lower surface of the first substrate;
a second substrate mounted on the lower surface of the first substrate, the second substrate being configured to electrically connect the first substrate to an external source of power;
a connecting conductor bonded to a lower surface of the second substrate; and
a sealing portion that seals the electronic device, the second substrate, and the connecting conductor,
wherein a mounting height of the second substrate is lower than a mounting height of the electronic device.

2. The electronic device module of claim 1 , wherein a surface of the connecting conductor and a surface of the electronic device are exposed to an exterior of the sealing portion, and
the exposed surface of the connecting conductor and the exposed surface of the electronic device are disposed on a same plane.

3. The electronic device module of claim 1 , further comprising a protective layer disposed along a surface formed by the electronic device and the sealing portion.

4. The electronic device module of claim 3 , further comprising a shielding layer disposed on the protective layer.

5. The electronic device module of claim 1 , wherein the second substrate comprises a device accommodating portion comprising a through-hole, and
the electronic device is disposed in the device accommodating portion.

6. The electronic device module of claim 1 , wherein the sealing portion covers the lower surface of the second substrate, and
the connecting conductor passes through the sealing portion and is exposed to an exterior of the sealing portion.

7. The electronic device module of claim 6 , wherein the connecting conductor is made of either one or both of a solder and a conductive resin.

8. The electronic device module of claim 6 , wherein a lower surface of the connecting conductor is exposed to the exterior of the sealing portion, and
a side surface of the connecting conductor is covered by the sealing portion all around the connecting conductor.

9. The electronic device module of claim 6 , wherein the second substrate comprises an electrode pad embedded in the lower surface of the second substrate,
the connecting conductor is bonded to the electrode pad, and
the electronic device module further comprises an external connection terminal bonded to a lower surface of the connecting conductor.

10. The electronic device module of claim 1 , further comprising:
a first element mounted on an upper surface of the first substrate; and
a first sealing portion that seals the first element.

11. The electronic device module of claim 10 , wherein a shortest distance from the upper surface of the first substrate to an upper surface of the first sealing portion is greater than a shortest distance from the lower surface of the first substrate to a lower surface of the sealing portion.

12. The electronic device module of claim 1 , wherein the mounting height of the second substrate is a shortest distance from the lower surface of the first substrate to the lower surface of the second substrate, and
the mounting height of the electronic device is a shortest distance from the lower surface of the second substrate to a lower surface of the electronic device.

13. The electronic device module of claim 1 , wherein the second substrate comprises an electrode pad embedded in the lower surface of the second substrate,
the connecting conductor is bonded to the electrode pad, and
the electronic device module further comprises an external connection terminal bonded to a lower surface of the connecting conductor.

Assignees

• Samsung Electro Mech
• Samsung Eiectro Mech Co Ltd

Inventors

• Jung Chul Hwan

Classifications

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W74/01

  Manufacture or treatment · CPC title