Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic apparatus, electronic apparatus, and manufacturing method of mounting structure

Patent metadata

Field	Value
Publication number	US-10818834-B2
Application number	US-201715674950-A
Country	US
Kind code	B2
Filing date	Aug 11, 2017
Priority date	Aug 19, 2016
Publication date	Oct 27, 2020
Grant date	Oct 27, 2020

Abstract

A mounting structure includes a first substrate which has a first surface on which a functional element is provided, a second substrate that has a second surface facing the first surface, a wiring portion that is provided at a position which is different from a position of the functional element on the first surface, has a third surface facing the second surface, and is electrically connected to the functional element, and a conduction portion that is provided on the second surface, protrudes toward the first surface, and is connected to the third surface so as to be electrically connected to the functional element, in which an area of the third surface is larger than an area of a first end section of the wiring portion on the first substrate side in a plan view which is viewed from a thickness direction of the first substrate and the second substrate.

First claim

What is claimed is:

1. A mounting structure comprising:
a first substrate which has a first surface on which a functional element is provided;
a second substrate that has a second surface facing the first surface;
a wiring portion that is provided at a position which is different from a position of the functional element on the first surface, has a third surface facing the second surface, and is electrically connected to the functional element; and
a conduction portion that is provided on the second surface, protrudes toward the first surface, and is connected to the third surface so as to be electrically connected to the functional element,
wherein an area of the third surface is larger than an area of a first end section of the wiring portion on the first substrate side in a plan view which is viewed from a thickness direction of the first substrate and the second substrate.

2. The mounting structure according to claim 1 ,
wherein a second end section of the wiring portion on the second substrate side protrudes along the first surface.

3. The mounting structure according to claim 2 ,
wherein the wiring portion has a side surface ranging between the first end section and the second end section, and
wherein the side surface is a depressed surface which is depressed in a direction of becoming distant from the functional element on a side on which the functional element is disposed.

4. An electronic apparatus comprising:
the mounting structure according to claim 2 ; and
a control unit that controls the functional element.

5. An electronic apparatus comprising:
the mounting structure according to claim 3 ; and
a control unit that controls the functional element.

6. The mounting structure according to claim 1 ,
wherein the third surface has a projection protruding toward the second surface side.

7. An electronic apparatus comprising:
the mounting structure according to claim 6 ; and
a control unit that controls the functional element.

8. The mounting structure according to claim 1 ,
wherein the third surface has a depression which is depressed toward the first surface side.

9. The mounting structure according to claim 8 ,
wherein the conduction portion has a protrusion protruding toward the first surface side.

10. The mounting structure according to claim 9 ,
wherein the depression includes a spherical depression section which is curved at a first curvature,
wherein the protrusion includes a spherical projection section which is curved at a second curvature, and
wherein the first curvature is equal to or less than the second curvature.

11. An electronic apparatus comprising:
the mounting structure according to claim 10 ; and
a control unit that controls the functional element.

12. The mounting structure according to claim 9 ,
wherein the depression includes a spherical depression section which is curved at a first curvature,
wherein the protrusion includes a spherical projection section which is curved at a second curvature, and
wherein the first curvature is more than the second curvature.

13. An electronic apparatus comprising:
the mounting structure according to claim 12 ; and
a control unit that controls the functional element.

14. An electronic apparatus comprising:
the mounting structure according to claim 4 ; and
a control unit that controls the functional element.

15. An electronic apparatus comprising:
the mounting structure according to claim 8 ; and
a control unit that controls the functional element.

16. The mounting structure according to claim 1 ,
wherein the conduction portion has a fourth surface connected to the third surface, and
wherein at least one of the third surface and the fourth surface has a sliding preventing section preventing sliding between the third surface and the fourth surface.

17. The mounting structure according to claim 16 ,
wherein the sliding preventing section has irregularities.

18. The mounting structure according to claim 1 ,
wherein the conduction portion includes a resin section and a conductive film covering the resin section.

19. An electronic apparatus comprising:
the mounting structure according to claim 1 ; and
a control unit that controls the functional element.

Assignees

• Seiko Epson Corp

Inventors

• Suzuki Hironori
• Matsuda Hiroshi
• Ohashi Koji

Classifications

• H10W72/072

  of bump connectors · CPC title

• H10W72/234

  Cross-sectional shape, i.e. in side view · CPC title

• B06B1/0688

  with foil-type piezoelectric elements, e.g. PVDF · CPC title

• B06B2201/56

  Foil type, e.g. PVDF · CPC title

• B06B1/0622 Primary

  on one surface · CPC title