Electronic component incorporated substrate
US-9036362-B2 · May 19, 2015 · US
Semiconductor device and method of manufacturing the same
US2015228551A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015228551-A1 |
| Application number | US-201414554550-A |
| Country | US |
| Kind code | A1 |
| Filing date | Nov 26, 2014 |
| Priority date | Feb 10, 2014 |
| Publication date | Aug 13, 2015 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
A semiconductor device includes a wiring substrate including a first electrode in which a cross-sectional shape is an inverted trapezoidal shape, a semiconductor chip including a second electrode in which a cross-sectional shape is an inverted trapezoidal shape, a metal bonding material bonding a tip end of the first electrode and a tip end of the second electrode which face each other, and an underfill resin filled between the wiring substrate and the semiconductor chip, the underfill resin covering a side face of each of the first electrode and the second electrode and a side face of the metal bonding material.
First claim
Opening claim text (preview).
What is claimed is: 1 . A semiconductor device, comprising; a wiring substrate including a first electrode in which a cross-sectional shape is an inverted trapezoidal shape; a semiconductor chip including a second electrode in which a cross-sectional shape is an inverted trapezoidal shape; a metal bonding material bonding a tip end of the first electrode and a tip end of the second electrode which face each other; and an underfill resin filled between the wiring substrate…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2015228551A1 cover?
- A semiconductor device includes a wiring substrate including a first electrode in which a cross-sectional shape is an inverted trapezoidal shape, a semiconductor chip including a second electrode in which a cross-sectional shape is an inverted trapezoidal shape, a metal bonding material bonding a tip end of the first electrode and a tip end of the second electrode which face each other, and an …
- Who is the assignee on this patent?
- Shinko Electric Ind Co
- What technology area does this patent fall under?
- Primary CPC classification H10W90/701. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Aug 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).