Ultrasonic device, method for producing ultrasonic device, ultrasonic probe, ultrasonic measurement apparatus, and electronic device

Patent metadata

Field	Value
Publication number	US-10085720-B2
Application number	US-201514839056-A
Country	US
Kind code	B2
Filing date	Aug 28, 2015
Priority date	Aug 29, 2014
Publication date	Oct 2, 2018
Grant date	Oct 2, 2018

Abstract

An ultrasonic device includes an element substrate and a wiring substrate. The element substrate includes an ultrasonic element and an element interconnect terminal connected to the ultrasonic element. The wiring substrate includes a wiring terminal and an opening portion that defines an opening extending through the wiring substrate. The element interconnect terminal and the wiring terminal are connected so as to oppose each other. The opening portion encloses the ultrasonic element in plan view as seen from a thickness direction of the wiring substrate.

First claim

What is claimed is:

1. An ultrasonic device comprising:
an element substrate including an ultrasonic element and an element interconnect terminal connected to the ultrasonic element; and
a wiring substrate including a wiring terminal and an opening portion that defines an opening extending through the wiring substrate,
the element interconnect terminal and the wiring terminal being connected so as to oppose each other, and
the opening portion enclosing the ultrasonic element in plan view as seen from a thickness direction of the wiring substrate.

2. The ultrasonic device according to claim 1 , further comprising an acoustic matching layer and an acoustic lens that are stacked in order in the opening of the opening portion from a side of the element substrate.

3. The ultrasonic device according to claim 2 , further comprising a sealing member packed into a gap between the opening portion and the acoustic lens.

4. The ultrasonic device according to claim 1 , further comprising an acoustic matching layer that fills the opening of the opening portion and is in contact with the element substrate, and
an acoustic lens attached to the wiring substrate so as to be in contact with the acoustic matching layer at a position overlapping the opening portion.

5. The ultrasonic device according to claim 4 , wherein
a surface of the acoustic lens that is in contact with the acoustic matching layer is larger than the opening of the opening portion.

6. A method for producing an ultrasonic device, the method comprising:
providing an element substrate including an ultrasonic element and an element interconnect terminal connected to the ultrasonic element, and a wiring substrate including a wiring terminal and an opening portion that defines an opening extending through the wiring substrate; and
mounting the element substrate to the wiring substrate such that the ultrasonic element and the opening of the opening portion oppose each other, and the element interconnect terminal and the wiring terminal are connected.

7. The method for producing the ultrasonic device according to claim 6 , further comprising
forming an acoustic matching layer on a plane of an acoustic lens, the acoustic lens including a convex lens surface and the plane opposing the lens surface, and
incorporating, into the opening of the opening portion of the wiring substrate, the acoustic lens on which the acoustic matching layer is formed such that the acoustic matching layer is in contact with the element substrate.

8. The method for producing the ultrasonic device according to claim 7 , further comprising packing a sealing member into a gap between the opening portion and the acoustic lens.

9. The method for producing the ultrasonic device according to claim 6 , further comprising
packing an acoustic matching layer forming member so as to fill the opening of the opening portion of the wiring substrate to which the element substrate is mounted,
removing the acoustic matching layer forming member extruded from an opposite surface opposite to a surface of the wiring substrate to which the wiring terminal is provided, and
disposing an acoustic lens on the opposite surface of the wiring substrate at a position overlapping the opening portion.

10. The method for producing the ultrasonic device according to claim 9 , further comprising disposing a sealing member at an outer peripheral portion of the acoustic lens and fixing the acoustic lens to the opposite surface of the wiring substrate.

11. An ultrasonic probe comprising the ultrasonic device according to claim 1 .

12. An ultrasonic probe comprising the ultrasonic device produced by the method according to claim 6 .

13. An ultrasonic measurement apparatus comprising:
the ultrasonic probe according to claim 11 ;
a processing portion configured to form an image by processing an output from the ultrasonic device of the ultrasonic probe; and
a display portion configured to display the image.

14. An electronic device comprising the ultrasonic device according to claim 1 .

15. An electronic device comprising the ultrasonic device produced by the method according to claim 6 .

Assignees

• Seiko Epson Corp

Inventors

• Kiyose Kanechika
• Hashimoto Nobuaki

Classifications

• B06B1/0629

  Square array · CPC title

• B06B1/067

  which is used as, or combined with, an impedance matching layer · CPC title

• G01S7/52079

  Constructional features (constructional features of transducers B06B; mounting transducers G10K11/00; constructional features of ultrasonic medical diagnostic devices A61B8/44) · CPC title

• A61B8/4427

  Device being portable or laptop-like · CPC title

• G01S15/8925

  the array being a two-dimensional transducer configuration, i.e. matrix or orthogonal linear arrays · CPC title