Resonant cavity enhanced image sensor
US-2020194474-A1 · Jun 18, 2020 · US
US10818807B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10818807-B2 |
| Application number | US-201916253191-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 21, 2019 |
| Priority date | Jan 21, 2019 |
| Publication date | Oct 27, 2020 |
| Grant date | Oct 27, 2020 |
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The present disclosure generally relates to semiconductor detectors for use in optoelectronic devices and integrated circuit (IC) chips, and methods for forming same. More particularly, the present disclosure relates to integration of semiconductor detectors with Bragg reflectors. The photodetector of the present disclosure includes a substrate, a Bragg reflector disposed on the substrate, and a semiconductor detector disposed on the Bragg reflector. The Bragg reflector includes alternating layers of a semiconductor material and a dielectric material.
Opening claim text (preview).
What is claimed is: 1. A photodetector comprising: a substrate; a Bragg reflector disposed on the substrate, wherein the Bragg reflector comprises alternating layers of a semiconductor material and a dielectric material; and a semiconductor detector disposed on the Bragg reflector. 2. The photodetector of claim 1 , wherein the alternating layers of the Bragg reflector include the semiconductor material as a top layer and the dielectric material as a bottom layer disposed on the substrate. 3. The photodetector of claim 2 , wherein the semiconductor detector is disposed in a recessed portion of the top layer of the Bragg reflector. 4. The photodetector of claim 3 , wherein the substrate includes a bulk semiconductor substrate or a semiconductor-on-insulator substrate. 5. The photodetector of claim 2 , wherein the top layer of the Bragg reflector includes doped regions. 6. The photodetector of claim 1 , wherein the semiconductor detector includes a germanium containing compound. 7. The photodetector of claim 1 , further comprising an anti-reflection layer disposed on the semiconductor detector. 8. The photodetector of claim 7 , wherein the semiconductor detector has top and side surfaces that are covered by the anti-reflection layer, wherein the anti-reflection layer generates stress on the semiconductor detector. 9. The photodetector of claim 8 , wherein the anti-reflection layer includes a nitride compound. 10. A photodetector comprising: a substrate; a plurality of Bragg reflectors disposed on the substrate, wherein each Bragg reflector comprises alternating layers of a semiconductor material and a dielectric material; an inter-array dielectric layer separating each Bragg reflector; and one or more semiconductor detectors disposed on each Bragg reflector.
for devices having potential barriers · CPC title
The active layers comprising only Group IV materials · CPC title
directly associated or integrated with the devices, e.g. back reflectors (directly associated or integrated with photovoltaic cells H10F77/42) · CPC title
using inorganic layer materials only · CPC title
Multilayer mirrors, i.e. having two or more reflecting layers (G02B5/0883, G02B5/0891 take precedence) · CPC title
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