Optoelectronic Device Including a Buried Metal Grating for Extraordinary Optical Transmission (EOT)

Patent metadata

Field	Value
Publication number	US-2017005207-A1
Application number	US-201615200345-A
Country	US
Kind code	A1
Filing date	Jul 1, 2016
Priority date	Jul 1, 2015
Publication date	Jan 5, 2017
Grant date	—

Abstract

An optoelectronic device includes an etched body comprising a buried metal contact layer on a top surface of a semiconductor structure, which comprises one or more semiconductor layers. The buried metal contact layer includes an arrangement of holes therein. A plurality of nanopillar structures protrude from the top surface of the semiconductor structure and pass through the arrangement of holes. Each nanopillar structure is surrounded at a base thereof by a portion of the buried metal contact layer. When the etched body is exposed to incident radiation having a wavelength in the range from about 300 nm to about 10 microns, at least about 50% of the incident radiation is transmitted through the etched body at a peak transmission wavelength λ max .

First claim

1 . An optoelectronic device including a buried extraordinary optical transmission (EOT) structure, the optoelectronic device comprising:
an etched body comprising:
a buried metal contact layer disposed on a top surface of a semiconductor structure comprising one or more semiconductor layers, the buried metal contact layer comprising an arrangement of holes therein; and
a plurality of nanopillar structures protruding from the top surface of the semiconductor structure and passing through the arrangement of holes, each nanopillar structure being surrounded at a base thereof by a surrounding portion of the buried metal contact layer,
wherein, when the etched body is exposed to incident radiation having a wavelength in the range from about 300 nm to about 10 microns, at least about 50% of the incident radiation is transmitted through the etched body at a peak transmission wavelength λ max .

2 . The optoelectronic device of claim 1 , wherein at least about 70% of the incident radiation is transmitted at the peak transmission wavelength λ max .

3 . The optoelectronic device of claim 1 , wherein the peak transmission wavelength lies in a predetermined wavelength range selected from the group consisting of: near-ultraviolet wavelengths from about 300 nm to about 400 nm, visible wavelengths from about 400 nm to about 700 nm, near-infrared wavelengths from about 700 nm to about 2 microns, and mid-infrared wavelengths from about 2 microns to about 10 microns.

4 . The optoelectronic device of claim 1 , wherein the buried metal contact layer is a top metal contact layer, and further comprising a bottom metal contact layer disposed on a bottom surface of the semiconductor structure for electrical connection to the optoelectronic device.

5 . The optoelectronic device of claim 1 , wherein the buried metal contact layer comprises a metal selected from the group consisting of: Ag, Al, Au, Co, Cr, Cu, Fe, Hf, Ir, Mn, Mo, Pd, Pt, Rb, Re, Rh, Ta, Ti, V, W, Zn, and Zr.

6 . The optoelectronic device of claim 1 , wherein the buried metal contact layer does not comprise a conductive oxide.

7 . The optoelectronic device of claim 1 , wherein the one or more semiconductors are selected from the group consisting of Si, Ge, GaAs, InAs, InSb, GaN, GaP, GaSb, GaAsP, GaAsN, GaInAs, GaInP, AlGaAs, AlGaIn, AlGaP, AlGaInP, InGaAs, InGaN, InGaSb, InGaP, InAsSb, AlN, AlGaN, ZnSe, diamond (C), SiC and Ga 2 O 3 .

8 . The optoelectronic device of claim 1 , wherein the base of each nanopillar structure is in physical contact with an entirety of the surrounding portion of the buried metal contact layer.

9 . The optoelectronic device of claim 1 , wherein the arrangement of holes in the buried metal contact layer is a periodic arrangement of holes.

10 . The optoelectronic device of claim 1 , wherein each hole comprises a width or diameter D from about 10 nm to about 5 microns.

11 . The optoelectronic device of claim 1 , wherein a height h of the nanopillar structures is at least about 50 nm.

12 . The optoelectronic device of claim 1 , wherein a pitch Λ defining a hole spacing in the buried metal contact layer is in the range from 50 nm to 5 microns.

13 . The optoelectronic device of claim 1 , wherein the buried metal contact layer comprises a thickness in the range from about 5 nm to about 200 nm.

14 . The optoelectronic device of claim 1 , wherein the buried metal contact layer covers from about 30% to about 90% of the top surface of the semiconductor structure.

15 . The optoelectronic device of claim 1 , wherein the one or more semiconductor layers comprise one or more of the following: an n-doped semiconductor layer, a p-doped semiconductor layer, and an intrinsic semiconductor layer.

16 . The optoelectronic device of claim 1 , wherein the one or more semiconductor layers comprise an active region.

17 . The optoelectronic device of claim 16 , wherein the active region comprises a p-n junction, a p-i-n junction, a double heterostructure, a multiple quantum well structure or a quantum dot structure.

18 . The optoelectronic device of claim 1 being selected from a photodetector and a light emitting diode (LED).

19 . The optoelectronic device of claim 1 comprising two of the etched bodies disposed facing each other with a liquid-crystal material therebetween, each of the etched bodies being disposed on a transparent substrate, the optoelectronic device being a liquid crystal display (LCD).

20 . The optoelectronic device of claim 1 comprising a stack of the etched bodies, adjacent facing etched bodies being separated by an adhesion layer, the optoelectronic device being a multi-terminal tandem solar cell.

21 . A method of producing an optoelectronic device including a buried EOT structure, the method comprising:
forming a patterned metal contact layer on a top surface of a semiconductor structure comprising one or more semiconductor layers, the patterned metal contact layer including an arrangement of holes therein; immersing the semiconductor structure into an etchant, the top contact layer sinking into the semiconductor structure as portions thereof directly under the top contact layer are etched, wherein, during etching, unetched portions of the semiconductor structure are extruded through the holes of the patterned metal contact layer to form an array of nanopillar structures protruding from the top surface of the semiconductor structure, each nanopillar structure passing through one of the holes, thereby forming an optoelectronic device including a buried EOT structure.

22 . The method of claim 21 , further comprising depositing a continuous metal contact layer on a bottom surface of the semiconductor structure.

Assignees

• Univ Illinois

Inventors

• Li Xiuling
• Wasserman Daniel M
• Zhao Xiang

Classifications

• G02F2001/133302

  Physics · mapped topic

• H01L2933/0058

  Electricity · mapped topic

• H01L33/06

  Electricity · mapped topic

• H01L31/18

  Electricity · mapped topic

• G02F1/13394

  spacers regularly patterned on the cell subtrate, e.g. walls, pillars (G02F1/133377 takes precedence) · CPC title