Flaw inspection device and flaw inspection method

Patent metadata

Field	Value
Publication number	US-10816484-B2
Application number	US-201916661305-A
Country	US
Kind code	B2
Filing date	Oct 23, 2019
Priority date	Mar 30, 2016
Publication date	Oct 27, 2020
Grant date	Oct 27, 2020

Abstract

The present invention aims at providing a defect inspection technique capable of setting parameters used for detecting a defect with a less burden to a user. A defect inspection device according to the present invention receives multiple reference values input by the user and calculates a defect extraction condition so as to optimize an evaluation value calculated with the use of the reference values, the number of actual reports, and the number of false reports.

First claim

The invention claimed is:

1. A defect inspection device for inspecting a defect of an inspection target, comprising:
a feature amount calculator that calculates a feature amount of a defect candidate of the inspection target;
a storage device that stores extraction condition data describing an initial value of a con the defect of the inspection target;
a defect determination processor that compares the feature amount with the condition to extract the defect of the inspection target;
a display that outputs information representing the defect extracted by the defect determination processor; and
an interface that receives a designation input for designating whether the defect extracted by the defect determination processor is an actual report or a false report,
wherein the defect determination processor receives a plurality of reference values though the interface and calculates the condition which an evaluation value calculated using the number of actual reports, the number of false reports, and the reference values becomes optimum for each of the reference values,
wherein the defect determination processor extracts the defect of the inspection target by using the condition calculated for each of the reference values, and
wherein the display outputs the condition calculated by the defect determination processor for each of the reference values and outputs the defects extracted using the conditions calculated for each of the reference values, and outputs information representing the extracted defect by using the condition calculated by the defect determination processor for each of the reference values.

2. The defect inspection device according to claim 1 ,
wherein the defect determination processor calculates an actual report rate representing a rate of the number of actual reports to a total of the number of actual records and the number of false reports and calculates the evaluation value by using the actual report rate.

3. The defect inspection device according to claim 2 ,
wherein the defect determination processor receives, as each of the reference values, a numerical value designating a weight of the actual report rate at the evaluation value, and calculates the evaluation value using the weight.

4. The defect inspection device according to claim 1 ,
wherein the defect determination processor receives a numerical value of a defect capture rate indicating a rate of the number of actual reports to the number of actual reports detected by using the initial value of the condition as the reference value, and
the defect determination processor calculates the evaluation value by using the defect capture rate.

5. The defect inspection device according to claim 1 ,
wherein the defect determination processor receives a numerical value of a false report rate representing a rate of the number of false reports to a total of the number of actual reports and the number of false reports as the reference value, and
the defect determination processor calculates the evaluation value by using the false report rate.

6. The defect inspection device according to claim 1 ,
wherein the defect determination processor receives a numerical value of a defect residual rate representing a rate of the number of false reports to the number of false reports detected by using the initial value of the condition as the reference value, and
the defect determination processor calculates the evaluation value by using the defect residual rate.

7. The defect inspection device according to claim 1 ,
wherein the defect determination processor receives an instruction to designate which of the conditions calculated for each of the reference values is to be used and extracts the defect of the inspection target by using the designated condition.

8. A defect inspection method for inspecting a defect of an inspection target, comprising:
calculating a feature amount from an exterior appearance of the inspection target;
reading detection condition data describing an initial value of a condition for extracting the defect of the inspection target from a storage processor;
comparing the feature amount with the condition to extract the defect of the inspection target;
outputting information representing the defect that is extracted when comparing the feature amount to extract the defect; and
receiving a designation input for designating whether the defect that is extracted when comparing the feature amount to extract the defect is an actual report or a false report,
wherein comparing the feature amount to extract the defect further comprises: receiving a plurality of reference values; and calculating the condition under which an evaluation value calculated using the number of actual reports, the number of false reports, and the reference values becomes optimum for each of the reference values,
wherein comparing the feature amount to extract the defect further comprises: extracting the defect of the inspection target by using the condition calculated for each of the reference values, and
wherein outputting information representing the defect further comprises: outputting the condition that is calculated when comparing the feature amount to extract the defect for each of the reference values; and outputting information representing the defect that is extracted when comparing the feature amount to extract the defect by using the condition calculated for each of the reference values.

Assignees

• Hitachi High Tech Corp

Inventors

• Honda Toshifumi
• Urano Takahiro
• Kobayashi Mamoru
• Hatano Hisashi
• Sakurai Hironori

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/20

  characterised by the properties tested or measured, e.g. structural or electrical properties · CPC title

• G05B19/41875 Primary

  characterised by quality surveillance of production · CPC title

• G01N21/956 Primary

  Inspecting patterns on the surface of objects {(contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)} · CPC title

• Y02P90/02

  Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS] · CPC title