Method for fabricating a hybrid display using inorganic micro light emitting diodes (uLEDs) and organic LEDs (OLEDs)

Patent metadata

Field	Value
Publication number	US-10811403-B2
Application number	US-201916508414-A
Country	US
Kind code	B2
Filing date	Jul 11, 2019
Priority date	Oct 31, 2014
Publication date	Oct 20, 2020
Grant date	Oct 20, 2020

Abstract

A hybrid light emitting diode (LED) display and fabrication method are provided. The method forms a stack of thin-film layers overlying a top surface of a substrate. The stack includes an LED control matrix and a plurality of pixels. Each pixel is made up of a first subpixel enabled using an inorganic micro LED (uLED), a second subpixel enabled using an organic LED (OLED), and a third subpixel enabled using an OLED. The first subpixel emits a blue color light, the second subpixel emits a red color light, and the third subpixel emits a green color light. In one aspect, the stack includes a plurality of wells in a top surface of the stack, populated by the LEDs. The uLEDs may be configured vertical structures with top and bottom electrical contacts, or surface mount top surface contacts. The uLEDs may also include posts for fluidic assembly orientation.

First claim

We claim:

1. A method for fabricating a hybrid light emitting diode (LED) emissive display, the method comprising:
providing a substrate;
forming a stack of thin-film layers overlying a top surface of the substrate, with a plurality of wells formed in a top surface of the thin film stack, and with adjacent wells separated by well sidewalls, the stack comprising an LED control matrix and a plurality of pixels
populating the wells with LEDs;
wherein each pixel comprises:
a first subpixel enabled using an inorganic micro LED (uLED) populating a well;
a second subpixel enabled using an organic LED (OLED) populating a well;
a third subpixel enabled using an OLED populating a well; and,

the method further comprising:
forming an electrical interface matrix layer overlying the stack, connected to each OLED.

2. The method of claim 1 wherein the first subpixel emits a blue color light;
wherein the second subpixel emits a red color light; and,
wherein the third subpixel emits a green color light.

3. The method of claim 1 wherein the uLEDs are gallium nitride (GaN) LEDs.

4. The method of claim 1 wherein the uLEDs are configured with an electrical connection interface selected from the group consisting of vertical structure contacts and surface mount top surface contacts.

5. The method of claim 1 wherein each uLED includes a post.

6. The method of claim 1 wherein the LED control matrix is an active matrix (AM) of control circuits, each control circuit electrically connected to a corresponding LED.

7. The method of claim 1 wherein forming the stack of thin films includes
forming a light blocking material over the well sidewalls.

8. The method of claim 7 wherein the light blocking material is selected from the group consisting of a light absorbing material and a light reflector material.

9. The method of claim 1 wherein forming the stack of thin films includes:
forming each uLED well comprising a bottom surface, sidewalls, a first electrical interface formed on the uLED bottom surface and connected to the LED control matrix, and a second electrical interface formed on the uLED well bottom surface and connected to a reference voltage;
fluidically depositing surface mount uLEDs into the uLED wells, where each surface mount uLED comprising;
a top surface deposited overlying a corresponding uLED well bottom surface;
a bottom surface;
a first electrical contact formed on the uLED top surface; and,
a second electrical contact formed on the uLED top surface; and,

annealing the substrate to electrically connect each uLED first electrical contact to a corresponding uLED well first electrical interface, and to electrically connect each uLED second electrical contact to a corresponding uLED well second electrical interface.

10. The method of claim 9 wherein forming the stack of thin films includes:
forming each OLED well comprising a bottom surface, sidewalls, and a first electrode formed on the OLED well bottom surface and connected to the LED control matrix;
forming an OLED heterostructure overlying the first electrode in each OLED well; and,
wherein forming the electrical interface matrix layer includes forming a second electrode overlying each OLED heterostructure, connected to a reference voltage.

11. The method of claim 10 wherein the OLED heterostructures are formed subsequent to annealing the substrate.

12. The method of claim 9 wherein fluidically depositing the surface mount uLEDs includes each surface mount uLED comprising:
the first electrical contact configured as a ring with a first diameter;
the second electrical contact formed within a first electrical contact ring perimeter;
wherein forming the uLED wells includes:
forming each uLED well first electrical interface as a partial ring with the first diameter, and having a mouth opening; and,
forming each uLED well second electrical interface as a trace extending into the mouth of a corresponding first electrical interface partial ring.

13. The method of claim 9 wherein fluidically depositing the surface mount uLEDs includes each surface mount uLED top surface being bi-planar with a first level and a second level, and comprising:
the first electrical contact being formed on the first level of the top surface;
the second electrical contact being formed on the second level of the top surface;
wherein forming the uLED wells includes forming bi-planar uLED well bottom surfaces, with a first level and a second level, and including:
forming each first electrical interface on the uLED well bottom first level; and,
forming each second electrical interface on the uLED well bottom second level.

14. The method of claim 1 wherein forming the stack of thin films includes:
forming each uLED well comprising a bottom surface, sidewalls, and a first electrical interface formed on the uLED well bottom surface connected to the LED control matrix;
fluidically depositing vertical structure uLEDs in the uLED wells, each vertical structure uLED comprising;
a bottom surface deposited overlying a corresponding uLED well bottom surface;
a top surface;
a first electrical contact formed on the uLED bottom surface;
a second electrical contact formed on the uLED top surface;

annealing the substrate to electrically connect each uLED first electrical contact to a corresponding uLED well first electrical interface;
forming a plurality of OLED wells in the top surface of the stack, each OLED well comprising a bottom surface, sidewalls, and a first electrode formed on the OLED well bottom surface and connected to the LED control matrix;
forming an OLED heterostructure overlying the first electrode of each OLED well; and,
wherein forming the electrical interface matrix layer includes forming a second electrode overlying each OLED heterostructure connected to a reference voltage, and forming reference voltage connection to the second electrical contact of each uLED.

15. The method of claim 14 wherein the OLED heterostructures are formed subsequent to annealing the substrate.

16. The method of claim 1 wherein populating the wells with LEDs includes populating the wells with LEDs having a flat circular disk shape.

17. A method for fabricating a hybrid light emitting diode (LED) emissive display, the method comprising:
providing a substrate;
forming a stack of thin-film layers overlying a top surface of the substrate, with a plurality of wells formed in a top surface of the thin film stack, and with adjacent wells separated by well sidewalls;
using a fluidic deposition method, populating a first plurality of wells with inorganic micro LEDs (μLEDs);
fabricating organic LEDs (OLEDs) in a second plurality of wells; and,
forming an electrical interface matrix layer overlying the stack, connected to each LED.

18. The method of claim 17 wherein the step of fabricating the OLEDs occurs before the step of fluidically depositing the μLEDs; and,
the method further comprising:
electrically connecting each μLED to at least one electrical interface formed on a well bottom surface using a process selected from the group consisting of cold welding and low temperature ultrasonic bonding.

19. The method of claim 17 wherein the step of fabricating the OLEDs occurs after the step of fluidically depositing the μLEDs; and,
the method further comprising:
electrically connecting each μLED to at least one electrical interface formed on a well bottom surface using an annealing process.

20. The method of claim 17 wherein the step of fabri

Assignees

• Elux Inc

Inventors

• Sasaki Kenji
• Schuele Paul J
• Ulmer Kurt
• Lee Jong-Jan

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/874

  On different surfaces · CPC title

• H10W70/682

  comprising holes having chips therein · CPC title