Passivation scheme for pad openings and trenches

Patent metadata

Field	Value
Publication number	US-10804231-B2
Application number	US-201916419280-A
Country	US
Kind code	B2
Filing date	May 22, 2019
Priority date	Jul 14, 2017
Publication date	Oct 13, 2020
Grant date	Oct 13, 2020

Abstract

An integrated circuit (IC) comprising an enhanced passivation scheme for pad openings and trenches is provided. In some embodiments, an interlayer dielectric (ILD) layer covers a substrate and at least partially defines a trench. The trench extends through the ILD layer from a top of the ILD layer to the substrate. A conductive pad overlies the ILD layer. A first passivation layer overlies the ILD layer and the conductive pad, and further defines a pad opening overlying the conductive pad. A second passivation layer overlies the ILD layer, the conductive pad, and the first passivation layer, and further lines sidewalls of the first passivation layer in the pad opening and sidewalls of the ILD layer in the trench. Further, the second passivation layer has a low permeability for moisture or vapor relative to the ILD layer.

First claim

What is claimed is:

1. A method for forming an integrated circuit, the method comprising:
forming an interlayer dielectric (ILD) layer covering a substrate;
forming a conductive pad overlying the ILD layer;
performing a first etch into the ILD layer to form a trench, wherein the trench extends through the ILD layer from a top of the ILD layer to the substrate;
depositing a first passivation layer covering the ILD layer and the conductive pad;
performing a second etch into the first passivation layer to form a pad opening overlying and exposing the conductive pad; and
depositing a second passivation layer covering the ILD layer, the conductive pad, and the first passivation layer, and further lining sidewalls of the first passivation layer in the pad opening and sidewalls of the ILD layer in the trench, wherein the second passivation layer has a low permeability for moisture or vapor relative to the ILD layer.

2. The method according to claim 1 , wherein the first passivation layer is deposited before the first etch, wherein the first etch is also performed into the first passivation layer, such that the trench extends through the first passivation layer, and wherein the second passivation layer lines additional sidewalls of the first passivation layer in the trench.

3. The method according to claim 1 , wherein the first passivation layer is deposited after the first etch, wherein the first passivation layer lines the sidewalls of the ILD layer in the trench, and wherein the second passivation layer lines the sidewalls of the ILD layer over the first passivation layer.

4. The method according to claim 1 , further comprising:
performing a third etch into the second passivation layer to partially clear the pad opening and to expose the conductive pad.

5. The method according to claim 1 , wherein the substrate comprises a group III-V layer, and wherein the method further comprises:
forming a semiconductor device overlying and partially defined by the group III-V layer, wherein the ILD layer is formed covering the semiconductor device and the group III-V layer.

6. The method according to claim 1 , wherein the trench is formed with a ring-shaped top layout and extends laterally in a closed path to completely enclose the conductive pad.

7. The method according to claim 1 , wherein the ILD layer directly contacts the first passivation layer and the conductive pad, and wherein the second passivation layer directly contacts the first passivation layer and the conductive pad.

8. A method for forming an integrated circuit, the method comprising:
forming a semiconductor device overlying and partially defined by a substrate;
forming a dielectric layer covering the semiconductor device and the substrate;
forming a plurality of wires and a plurality of vias in the dielectric layer while forming the dielectric layer, wherein the wires and the vias define a conductive path from the semiconductor device to a top of the dielectric layer;
forming a conductive pad on the dielectric layer and electrically coupled to the semiconductor device through the conductive path;
depositing a first passivation layer covering the dielectric layer and the conductive pad;
performing a first etch into the first passivation layer to form a pad opening overlying and exposing the conductive pad; and
depositing a second passivation layer covering the dielectric layer, the conductive pad, and the first passivation layer, and further lining a sidewall of the first passivation layer in the pad opening, wherein the second passivation layer has a high resistance to moisture or vapor relative to the dielectric layer.

9. The method according to claim 8 , wherein the substrate comprises a group III-V layer, and where the semiconductor device is partially defined by the group III-V layer.

10. The method according to claim 8 , further comprising:
performing a second etch into the second passivation layer to partially clear the second passivation layer from the pad opening and to expose the conductive pad.

11. The method according to claim 10 , wherein the second passivation layer has, after the second etch, an L-shaped profile directly contacting the conductive pad and the sidewall of the first passivation layer.

12. The method according to claim 8 , wherein the dielectric layer and the first passivation layer comprise oxide, and wherein the second passivation layer comprises silicon nitride, aluminum oxide, or polyimide.

13. The method according to claim 8 , further comprising:
a plurality of peripheral pads on the dielectric layer and comprising the conductive pad, wherein the peripheral pads are arranged along a boundary of the integrated circuit.

14. The method according to claim 8 , further comprising:
performing a third etch into the dielectric layer to form a trench extending vertically through the dielectric layer to the substrate, and further extending laterally in a closed path along an edge of the integrated circuit, wherein the second passivation layer lines a sidewall of the dielectric layer in the trench.

15. A method for forming an integrated circuit, the method comprising:
forming a dielectric layer covering a substrate;
performing a first etch into the dielectric layer to form a trench, wherein the trench extends vertically through the dielectric layer from a top of the dielectric layer to the substrate and further extends laterally in a closed path along an edge of the integrated circuit;
depositing a first passivation layer covering the dielectric layer; and
depositing a second passivation layer covering the dielectric layer and the first passivation layer, and further lining sidewalls respectively of the first passivation layer and the dielectric layer in the trench, wherein the second passivation layer has a low permeability for moisture or vapor relative to the dielectric layer;
wherein the first passivation layer is deposited lining and directly contacting a sidewall of the dielectric layer in the trench, and wherein the second passivation layer is deposited lining the sidewall of the dielectric layer in the trench and over the first passivation layer.

16. The method according to claim 15 , wherein a portion of the second passivation layer in the trench has a U-shaped profile or a V-shaped profile.

17. The method according to claim 16 , wherein a portion of the first passivation layer in the trench also has a U-shaped profile or a V-shaped profile.

18. The method according to claim 15 , further comprising:
forming a plurality of wires and a plurality of vias alternatingly stacked in the dielectric layer while forming the dielectric layer.

19. The method according to claim 15 , wherein the substrate comprises a silicon layer and a group III-V layer overlying the silicon layer, and wherein the first etch extends through the group III-V layer and stops on the silicon layer.

20. The method according to claim 15 , further comprising:
forming a conductive pad overlying the dielectric layer, wherein the first passivation layer is deposited covering the conductive pad; and
performing a second etch into the first passivation layer to form a pad opening exposing the conductive pad, wherein the second etch is performed before the depositing of the second passivation layer.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chang Ming-Hong
• Yang Chun-Yi
• Huang Kun-Ming
• Chu Po-Tao
• Wang Shen-Ping
• Kuo Chien-Li

Classifications

• H10W72/9445

  Top-view layouts, e.g. mirror arrays · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W74/129

  forming a chip-scale package [CSP] · CPC title