Multi-compartment electrical apparatus with shared cooling assembly
US-11864358-B2 · Jan 2, 2024 · US
US10798850B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10798850-B2 |
| Application number | US-201715799500-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 31, 2017 |
| Priority date | Oct 31, 2016 |
| Publication date | Oct 6, 2020 |
| Grant date | Oct 6, 2020 |
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An electronic device includes an electronic component and a protective shield including a phase change material having a phase change temperature of between 20° C. and 90° C., an antivibration gel having hyperelastic and/or viscoelastic behavior at 20° C., and a separation barrier positioned so as to separate the phase change material and the antivibration gel. The antivibration gel is positioned, at least partly, in contact with the electronic component, and has a thermal conductivity of greater than 1 W/m·K at 20° C.
Opening claim text (preview).
The invention claimed is: 1. An electronic device to be used in a vibration environment having acceleration peaks of greater than 0.1 G and a temperature of which may exceed 90° C. for a period of more than 10 minutes, the electronic device comprising: an electronic component; a protective shield comprising: a phase change material having a phase change temperature of between 20° C. and 90° C., the phase change material forming an inner layer, an antivibration gel having at least one of hyperelastic or viscoelastic behavior at 20° C., the antivibration gel forming an outer layer, and a separation barrier positioned so as to separate the phase change material inner layer and the antivibration gel outer layer, the antivibration gel outer layer being positioned, at least partly, in contact with the electronic component, and having a thermal conductivity of greater than 1 W/m·K at 20° C. 2. The electronic device according to claim 1 , in which the antivibration gel has a thermal conductivity of greater than 2 W/m·K at 20° C. 3. The electronic device according to claim 2 , in which the antivibration gel has a thermal conductivity of greater than 2.5 W/m·K at 20° C. 4. The electronic device according to claim 1 , in which the antivibration gel has a modulus of elasticity at 20° C. of less than 1 MPa. 5. The electronic device according to claim 1 , in which the phase change material has a phase change temperature of greater than 60° C. 6. The electronic device according to claim 1 , in which the phase change material is selected from the group formed by paraffins, fatty acids and salt hydrates. 7. The electronic device according to claim 1 , in which the antivibration gel outer layer is positioned, at least partly, between the electronic component and the phase change material inner layer. 8. The electronic device according to claim 1 , in which the antivibration gel outer layer is positioned, at least partly, between the electronic component and the phase change material inner layer, the separation barrier having the shape of an inner shell having a thickness of less than 3 mm, a material of said inner shell having a thermal conductivity of greater than 5 W/m·K. 9. The electronic device according to claim 1 , in which the separation barrier is made of a material having a thermal conductivity of greater than 10 W/m·K. 10. The electronic device according to claim 1 , further comprising an outer shell containing the electronic component, the phase change material inner layer, the antivibration gel outer layer, and said separation barrier. 11. The electronic device according to claim 10 , in which a portion of the electronic component juts out beyond the outer shell. 12. The electronic device according to claim 10 , in which the outer shell or an inner shell have ribs that promote heat exchanges between the phase change material inner layer and the outside environment, and between the antivibration gel outer layer and the phase change material inner layer, respectively. 13. The electronic device according to claim 10 , in which the outer shell or an inner shell have electromagnetic shielding. 14. The electronic device according to claim 1 , in which the electronic component comprises an infrared video camera. 15. The electronic device according to claim 1 , in which the electronic component is embedded in the antivibration gel outer layer. 16. The electronic device according to claim 1 , in which the electronic device is configured to monitor operation of an engine. 17. The electronic device according to claim 1 , in which the electronic device is positioned in a motor vehicle, aircraft or spacecraft. 18. The electronic device according to claim 1 , in which the acceleration peaks of the vibration environment are greater than 10 G and the temperature of the vibration environment exceeds 90° C. for a period of more than 30 minutes. 19. The electronic device according to claim 1 , in which the acceleration peaks of the vibration environment are greater than 50 G and the temperature of the vibration environment exceeds 90° C. for a period of more than 60 minutes. 20. The electronic device according to claim 1 , in which the electronic device is configured to thermally protect the electronic component from said vibration environment. 21. The electronic device according to claim 1 , in which a portion of the electronic component passes through the protective shield, and the antivibration gel outer layer is free of direct contact with the electronic component except for said portion of the electronic component passing through the protective shield.
by melting or evaporation of solids · CPC title
Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title
Housings · CPC title
from near infrared [NIR] radiation · CPC title
Environment with strong vibrations or shocks · CPC title
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