High mobility transport layer structures for rhombohedral Si/Ge/SiGe devices
US-10256305-B2 · Apr 9, 2019 · US
US10797193B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10797193-B2 |
| Application number | US-201916253475-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 22, 2019 |
| Priority date | Jan 23, 2018 |
| Publication date | Oct 6, 2020 |
| Grant date | Oct 6, 2020 |
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According to some implementations, an avalanche photodiode may include a photon absorbing layer to absorb photons of an optical beam and to provide a response. The avalanche photodiode may include a gain response layer to provide a gain to the response. The avalanche photodiode may include a bias control structure connected to the gain response layer to control an electric field in the photon absorbing layer and the gain response layer.
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What is claimed is: 1. An avalanche photodiode, comprising: a photon absorbing layer to absorb photons of an optical beam and to provide a response; a gain response layer to provide a gain to the response; and a bias control structure connected to the gain response layer to control an electric field in the photon absorbing layer and the gain response layer. 2. The avalanche photodiode of claim 1 , wherein a top portion of the photon absorbing layer is p-doped to form an ohmic contact to receive an anode. 3. The avalanche photodiode of claim 1 , wherein a portion of the gain response layer is p-doped to form a charge medium. 4. The avalanche photodiode of claim 1 , wherein a gain value of the avalanche photodiode is optimized based on a first width of a charge region of the gain response layer and a second width of the photon absorbing layer. 5. The avalanche photodiode of claim 1 , wherein a portion of the gain response layer is n-doped to form an ohmic contact to receive a cathode. 6. The avalanche photodiode of claim 1 , wherein a portion of the gain response layer is p-doped to form an ohmic contact to receive the bias control structure. 7. A photodiode, comprising: a substrate; a buffer layer; a silicon layer, comprising: a set of p-doped silicon sections, comprising: a first p-doped silicon section, and a second p-doped silicon section, a set of intrinsic silicon sections sandwiching the set of p-doped silicon sections, and a set of n-doped silicon sections sandwiching the set of intrinsic silicon sections; a set of germanium layers, comprising: an intrinsic germanium layer disposed on the set of intrinsic silicon sections and the first p-doped silicon section, and a p-doped germanium layer disposed on the intrinsic germanium layer; a set of cathodes disposed on the set of n-doped silicon sections; an anode disposed on the p-doped germanium layer; and a bias control structure disposed on the second p-doped silicon section. 8. The photodiode of claim 7 , wherein the set of germanium layers is epitaxially grown on the silicon layer. 9. The photodiode of claim 7 , wherein a total thickness of the set of germanium layers is less than 800 nanometers (nm). 10. The photodiode of claim 7 , further comprising: a spiral inductor connected to the bias control structure to isolate a radio frequency signal and a direct current signal. 11. The photodiode of claim 7 , further comprising: a silicon waveguide coupled to the first p-doped silicon section. 12. The photodiode of claim 7 , wherein the anode is to provide a first negative voltage to the intrinsic germanium layer and the bias control structure is to apply a second negative voltage to control an electric field in the intrinsic germanium layer. 13. The photodiode of claim 7 , wherein the anode, the set of cathodes, and the bias control structure are to induce a first electric field in the intrinsic germanium layer and a second electric field in the set of intrinsic silicon sections. 14. The photodiode of claim 13 , wherein the second electric field is greater than the first electric field. 15. The photodiode of claim 7 , further comprising: a cladding material to enclose the set of cathodes, the anode, the set of germanium layers, and the silicon layer. 16. An optical detector, comprising: an avalanche photodiode, comprising: a first layer to absorb photons of an optical beam and to provide a response; a second layer to provide a gain to the response; and a bias control structure connected to the first layer to control a first electric field in the first layer and a second electrical field in the second layer; and a waveguide coupled to the avalanche photodiode to direct the optical beam to the second layer. 17. The optical detector of claim 16 , further comprising an anode and a cathode separate from the bias control structure. 18. The optical detector of claim 16 , wherein the first layer is germanium and the second layer is silicon. 19. The optical detector of claim 16 , wherein the optical detector is a III-V semiconductor optical detector. 20. The optical detector of claim 16 , wherein the avalanche photodiode further comprises: a substrate, wherein the substrate is indium-gallium-arsenide (InGaAs) or indium phosphide (InP).
comprising only Group IV materials · CPC title
the potential barrier being a PIN barrier · CPC title
for devices having potential barriers · CPC title
the potential barrier working in avalanche mode, e.g. avalanche photodiodes · CPC title
in which the active layers form heterostructures, e.g. SAM structures · CPC title
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