Cooling structure and mounting structure

Patent metadata

Field	Value
Publication number	US-10794639-B2
Application number	US-201916291074-A
Country	US
Kind code	B2
Filing date	Mar 4, 2019
Priority date	Mar 13, 2018
Publication date	Oct 6, 2020
Grant date	Oct 6, 2020

Abstract

A cooling structure includes a plurality of heat radiation parts configured to cool a heat generating component and a holding member configured to hold the plurality of heat radiation parts. Moreover, the heat radiation parts of the cooling structure each include a base portion located on the side of the heat generating component and a fin portion extending from the base portion and radiating heat. Furthermore, the base portions of the heat radiation parts abut on each other.

First claim

The invention claimed is:

1. A cooling structure comprising:
a plurality of heat radiation parts configured to cool a heat generating component;
a holding member configured to hold the plurality of heat radiation parts, wherein:
the heat radiation parts each include a base portion located on a side of the heat generating component and a fin portion extending from the base portion and radiating heat; and
the plurality of base portions abut on each other; and

a pressing member configured to press the base portion toward the heat generating component, wherein the pressing member includes a transforming member configured to transform in accordance with shapes of the plurality of heat radiation parts to be pressed and presses the base portions with the transforming member toward the heat generating component.

2. The cooling structure according to claim 1 , wherein the holding member is configured to hold the heat radiation part so that a contact face of the base portion with the heat generating component can move in accordance with a shape of the heat generating component.

3. The cooling structure according to claim 1 , wherein the transforming member is configured to press the fin portion toward the heat generating component and thereby press the base portion toward the heat generating component.

4. The cooling structure according to claim 1 , wherein the transforming member is heat radiation grease filled inside the holding member.

5. The cooling structure according to claim 1 , wherein the heat radiation part includes the fin portion formed like a plate having a substantially rectangular shape in plan view and the base portion having a broader width than the fin portion.

6. The cooling structure according to claim 1 , wherein the heat radiation part includes the fin portion formed like a column having a rectangular shape or a circular shape in plan view and the base portion having a broader width than the fin portion.

7. The cooling structure according to claim 1 , wherein the heat radiation part includes the fin portion formed like a plate having a substantially rectangular shape in plan view and the base portion having a comparable width with the fin portion.

8. The cooling structure according to claim 7 , wherein the heat radiation part has a configuration in which the base portion and the fin portion are connected to each other.

9. The cooling structure according to claim 1 , wherein a through hole is formed in a thickness direction of the fin portion.

Assignees

• Nec Corp

Inventors

• Fushimi Makoto

Classifications

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title

• H05K1/0209 Primary

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

• H05K2201/066

  Heatsink mounted on the surface of the printed circuit board [PCB] · CPC title