Board level shield including an integrated heat sink

Patent metadata

Field	Value
Publication number	US-10172265-B2
Application number	US-201815947120-A
Country	US
Kind code	B2
Filing date	Apr 6, 2018
Priority date	Nov 20, 2015
Publication date	Jan 1, 2019
Grant date	Jan 1, 2019

Abstract

A shielding assembly is disclosed, the assembly including at least a board level shield and a heat sink. The assembly may include a board level shield that includes both a lid and a fence, and may also include a thermal interface material, where the assembly may be mounted on a printed circuit board to provide both EMI shielding and thermal management of heat-generating electronic components or heat sources on the circuit board. The heat sink includes at least one pin, and the shield includes at least one complementary perforation relative to the pin, such that an assembled device of the disclosure provides both EMI shielding and thermal management while permitting the transfer of thermal energy via the heat sink pin through the board level shield perforation.

First claim

What is claimed:

1. A shielding assembly comprising:
a heat sink including a top, a bottom, and sides;
a board level shield including a fence and a lid, the fence including a perimeter of material around the sides of the heat sink, and the lid including a piece of material having a shape complementary to the perimeter of the fence, the lid being attachable to the fence to substantially enclose the top of the heat sink;
wherein:
the lid includes at least one perforation;
the heat sink includes a thermally conductive material having at least one pin on the top of the heat sink, where the at least one pin is a protrusion of the thermally conductive material from the heat sink; and
the at least one pin and the at least one perforation are complementary in shape such that when the lid is attached to the fence, the at least one pin at least partially protrudes through the at least one perforation;

wherein:
the lid comprises a top and a lid sidewall depending from and/or generally perpendicular to the top of the lid;
the lid sidewall substantially surrounds the fence when the lid is attached to the fence;
the fence comprises a fence sidewall and a rail;
the fence sidewall is generally perpendicular to the top of the heat sink;
the rail is generally parallel to the top of the heat sink; and
the rail meets the fence sidewall at a bend and proceeds from the fence sidewall towards the heat sink;
the lid sidewall further comprises a plurality of tabs that bend inward towards a concave portion of the lid and generally perpendicular to the lid sidewall; and
when the lid is attached to the fence, the plurality of tabs rests on the rail.

2. The shielding assembly of claim 1 , wherein:
the at least one pin comprises a plurality of pins that are protrusions of the thermally conductive material from the heat sink;
the at least one perforation comprises a plurality of perforations in the lid; and
the plurality of pins and the plurality of perforations are arranged in a complementary manner such that when the lid is attached to the fence, each of the plurality of pins protrudes through a corresponding one of the plurality of perforations.

3. The shielding assembly of claim 2 , wherein the assembly further comprises at least one latching mechanism to securably attach the lid to the fence.

4. The shielding assembly of claim 3 , wherein the at least one latching mechanism is a removable directional latching mechanism.

5. The shielding assembly of claim 1 , wherein:
the shielding assembly further comprises one or more thermal interface materials along the bottom of the heat sink; and/or
the lid further comprises at least one press fit perforation.

6. An assembly comprising a board level shield, a heat sink including at least one protrusion, and a printed circuit board including at least one heat source in thermal contact with the heat sink, wherein the board level shield comprises:
a fence affixed to the printed circuit board and surrounding the at least one heat source and the heat sink; and
a lid including a top having a shape complementary to a perimeter of the fence, a lid sidewall depending from and/or generally perpendicular to the top of the lid, and at least one opening configured for receiving at least a portion of the at least one protrusion of the heat sink;
wherein the lid is attachable to the fence such that the lid sidewall substantially surrounds the fence and such that the at least one protrusion of the heat sink at least partially protrudes through the at least one opening of the lid;
wherein:
the lid sidewall further comprises a plurality of tabs generally perpendicular to the lid sidewall; and
the plurality of tabs comprise material bent inwardly towards a concave portion of the lid.

7. The assembly of claim 6 , wherein:
the at least one protrusion comprises a plurality of protrusions of a thermally conductive material from the heat sink;
the at least one opening comprises a plurality of openings in the top of the lid; and
the plurality of protrusions and the plurality of openings are arranged in a complementary manner such that when the lid is attached to the fence, each of the plurality of protrusions protrudes through a corresponding one of the plurality of openings.

8. The assembly of claim 6 , wherein the lid is removably attachable to the fence via at least one latching mechanism.

9. The assembly of claim 8 , wherein the at least one latching mechanism is a removable directional latching mechanism.

10. The assembly of claim 6 , further comprising one or more thermal interface materials between and in thermal contact with the heat sink and the heat source.

11. The assembly of claim 6 , wherein:
the fence comprises a fence sidewall and a rail generally parallel to a top of the heat sink;
the rail meets the fence sidewall at a bend and proceeds from the fence sidewall towards the heat sink; and
when the lid is attached to the fence, the plurality of tabs rests on the rail.

12. The assembly of claim 6 , wherein:
the lid sidewall comprises a flared rim; and
a bottom portion of the lid sidewall is at least partially bent away from a concave region of the lid along at least a portion of a bottom of the lid sidewall.

13. The assembly of claim 6 , wherein the lid further comprises at least one press fit perforation.

14. A assembly comprising a board level shield, a heat sink including at least one protrusion, and a printed circuit board including at least one heat source in thermal contact with the heat sink, wherein the board level shield comprises:
a fence affixed to the printed circuit board and surrounding the at least one heat source and the heat sink; and
a lid including a top having a shape complementary to a perimeter of the fence, a lid sidewall depending from and/or generally perpendicular to the top of the lid, and at least one opening configured for receiving at least a portion of the at least one protrusion of the heat sink;
wherein the lid is attachable to the fence such that the lid sidewall substantially surrounds the fence and such that the at least one protrusion of the heat sink at least partially protrudes through the at least one opening of the lid; and
wherein the assembly further comprises one or more thermal interface materials between and in thermal contact with the heat sink and the at least one heat source, wherein:
the lid sidewall further comprises a plurality of tabs that bend inward towards a concave portion of the lid and that are generally perpendicular to the lid sidewall;
the fence comprises a sidewall and a rail generally parallel to a top of the heat sink;
the rail meets the fence sidewall at a bend and proceeds from the fence sidewall towards the heat sink;
when the lid is attached to the fence, the plurality of tabs rests on the rail; and
the lid further comprises at least one press fit perforation.

15. The assembly of claim 14 , wherein
the plurality of tabs comprise material bent inwardly towards the concave portion of the lid.

16. A shielding assembly comprising a board level shield including at least one opening and a heat sink including at least one protrusion, wherein the at least one opening and the one protrusion are complementary in shape such that the at least one protrusion at least partially protrudes through the at least one opening when the board level shield mates with the heat sink to at least partially cover the heat sink, wherein the board level shield comprises a lid including a lid sidewall, and wherein the lid sidewall comprises a plurality of tabs that bend inward towards a conca

Assignees

• Laird Technologies Inc

Inventors

• Wrona Timothy M
• English Gerald R
• Jacklinski Daniel

Classifications

• H05K9/0032

  having multiple parts, e.g. frames mating with lids · CPC title

• H05K9/0024

  Shield cases mounted on a PCB, e.g. cans or caps or conformal shields · CPC title

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K9/0081 Primary

  Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K9/0003 takes precedence) · CPC title

• H05K7/20945

  Thermal management, e.g. inverter temperature control · CPC title