Higher density multi-component and serial packages

Patent metadata

Field	Value
Publication number	US-10178770-B1
Application number	US-201715852799-A
Country	US
Kind code	B1
Filing date	Dec 22, 2017
Priority date	Dec 22, 2017
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive.

First claim

The invention claimed is:

1. A high density multi-component package comprising:
at least two electronic components wherein each electronic component of said electronic components comprises a first external termination and a second external termination;
at least one first adhesive between adjacent first external terminations of adjacent electronic components;
at least one second adhesive between said adjacent electronic components;
wherein at least two said adjacent electronic components are connected serially; and
wherein said first adhesive and said second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive.

2. The high density multi-component package of claim 1 wherein said second adhesive is said high temperature insulating adhesive and said second adhesive is between adjacent second external terminations.

3. The high density multi-component package of claim 1 further comprising a spacer between adjacent second external terminations.

4. The high density multi-component package of claim 3 wherein said spacer is selected from an air gap and a non-conducting material.

5. The high density multi-component package of claim 1 further comprising a secondary adhesive.

6. The high density multi-component package of claim 1 wherein each said electronic component is independently selected from the group consisting of capacitor, resistor, varistor, inductor, diode, fuse, overvoltage discharge device, sensor, switch, electrostatic discharge suppressor, semiconductor and integrated circuit.

7. The high density multi-component package of claim 6 wherein said capacitor is an MLCC.

8. The high density multi-component package of claim 6 wherein said electronic component is selected from the group consisting of MLCC, resistor, varistor, inductor, diode, fuse, overvoltage discharge device, sensor, switch and electrostatic discharge suppressor.

9. The high density multi-component package of claim 8 wherein at least one said electronic component is an MLCC.

10. The high density multi-component package of claim 8 wherein said diode is a light emitting diode.

11. The high density multi-component package of claim 1 wherein all electronic components are serially connected.

12. The high density multi-component package of claim 1 wherein at least two additional electronic components are electrically connected in parallel.

13. The high density multi-component package of claim 1 wherein said electronic components form at least one stack.

14. The high density multi-component package of claim 13 further comprising a secondary electrical component.

15. The high density multi-component package of claim 14 comprising at least two stacks wherein said secondary electrical component spans said stacks.

16. The high density multi-component package of claim 14 wherein said secondary electrical component is in electrical parallel with at least two said electronic components.

17. The high density multi-component package of claim 16 wherein said secondary electrical component is selected from the group consisting of interposer, capacitor, resistor, varistor, inductor, diode, fuse, overvoltage discharge device, sensor, switch, electrostatic discharge suppressor, semiconductor and integrated circuit.

18. The high density multi-component package of claim 1 wherein said high temperature conductive adhesive is selected from the group consisting of solder, conductive adhesive, polymer solder, transient liquid phase sintering adhesive, diffusion solder and nano-metal.

19. The high density multi-component package of claim 18 wherein said transient liquid phase sintering adhesive comprises a high melting point metal and a low melting point metal.

20. The high density multi-component package of claim 19 wherein said low melting point metal is selected from the group consisting of indium, tin, lead, antimony, bismuth, cadmium, zinc, gallium, tellurium, mercury, thallium, selenium, or polonium.

21. The high density multi-component package of claim 19 wherein said high melting point metal is selected from the group consisting of silver, copper, aluminum, gold, platinum, palladium, beryllium, rhodium, nickel, cobalt, iron and molybdenum.

22. The high density multi-component package of claim 19 wherein said transient liquid phase sintering adhesive comprises tin and copper or indium and silver.

23. The high density multi-component package of claim 1 wherein said high temperature insulating adhesive is selected from epoxy resins, phenolic formaldehyde resins, phenolic melamine formaldehyde resins, phenolic neoprene, resorcinol formaldehydes, polyesters, polyimides, cyanoacrylates, acrylics, styrene block copolymers, styrene butadiene copolymers, polyarylenes, polyurethanes, polysulfides, polyamides, silicones and waxes.

24. The high density multi-component package of claim 1 wherein at least one said external termination comprises a metal selected from the group consisting of silver, tin, gold, copper, platinum, palladium and nickel.

25. The high density multi-component package of claim 1 selected from the group consisting of a Pi filter, a T filter and an LC filter.

26. The high density multi-component package of claim 1 further comprising a substrate.

27. The high density multi-component package of claim 26 wherein said substrate comprises at least two circuit traces.

28. The high density multi-component package of claim 27 wherein said substrate comprises at least three circuit traces.

29. The high density multi-component package of claim 1 wherein said electronic components form at least two stacks.

30. The high density multi-component package of claim 1 further comprising a flexible circuit.

31. The high density multi-component package of claim 1 further comprising overmolding.

32. A method for forming an electronic circuit comprising:
attaching said high density multi-component package of claim 1 to a circuit board.

33. The method for forming an electronic circuit of claim 32 wherein said high density multi-component package is mounted vertically on said circuit board.

34. The method for forming an electronic circuit of claim 33 further comprising a connector between one said external termination and one said active trace.

35. The method for forming an electronic circuit of claim 34 wherein said connector is selected the group consisting of an electrical connection and a functional connection.

36. The method for forming an electronic circuit of claim 35 wherein said connector is an additional electronic component.

37. The method for forming an electronic circuit of claim 36 wherein said additional electronic component is selected from capacitor, resistor, varistor, inductor, diode, fuse, overvoltage discharge device, sensor, switch, electrostatic discharge suppressor, semiconductor and integrated circuit.

38. The method for forming an electronic circuit of claim 37 wherein said capacitor is an MLCC.

39. The method for forming an electronic circuit of claim 37 wherein said additional electronic component is selected from resistor, inductor and fuse.

40. The method

Assignees

• Kemet Electronics Corp

Inventors

• Burk James A
• Bultitude John
• Miller Galen

Classifications

• H01G4/228 Primary

  Terminals · CPC title

• H05K2201/10053

  Switch · CPC title

• H05K2201/10174

  Diode · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K1/18 Primary

  structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title