Thin plastic polishing article for CMP applications

US10786885B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10786885-B2
Application numberUS-201815875867-A
CountryUS
Kind codeB2
Filing dateJan 19, 2018
Priority dateJan 20, 2017
Publication dateSep 29, 2020
Grant dateSep 29, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or “micro-features” and/or a plurality of grooves or “macro-features” formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polishing article, comprising a polymeric sheet that comprises: a thickness that is defined between a polishing surface and an opposing bottom surface; a length that extends in a first direction that is substantially parallel to the polishing surface; a width that extends in a second direction, which is substantially parallel to the polishing surface and is perpendicular to the first direction, wherein the width is at least two times smaller than the length; a solid polymeric material that is substantially pore free; a plurality of discrete elements that are formed on the polishing surface; and an array of grooves that are formed in the polishing surface, wherein the array of grooves are aligned relative to the first direction or the second direction, wherein the discrete elements have: a feature span of less than 40 μm; and an arithmetical mean height (Sa) from 2 to 7 μm, and wherein the opposing bottom surface includes a surface roughness that has an arithmetical mean height (Sa) from 2 micro-inches (0.05 micrometers) to 200 micro-inches (5.08 micrometers). 2. The polishing article of claim 1 , wherein each of the grooves in the array of grooves extend from the polishing surface to a depth below the polishing surface, and the thickness is less than or equal to about 0.48 mm. 3. The polishing article of claim 1 , wherein the polymeric sheet comprises a material selected from a group consisting of polypropylene and polytetrafluoroethylene (PTFE). 4. The polishing article of claim 1 , further comprising a releasable bonding layer that is disposed on the opposing bottom surface, and the releasable bonding layer has an interface surface that is on a side of the releasable bonding layer that is opposite to the opposing bottom surface, wherein the interface surface has a static friction coefficient of greater than 1.51, and wherein the static friction coefficient is measured by urging a surface of an object that has an arithmetical mean height (Sa) of 200 micro-inches (5.08 micrometers) against the interface surface. 5. The polishing article of claim 1 , wherein the array of grooves extend from the polishing surface toward the opposing bottom surface, and the grooves define a repeating groove pattern in the polishing surface. 6. The polishing article of claim 1 , wherein the array of grooves extend from the polishing surface toward the opposing bottom surface, and the grooves comprise a first sidewall and a second sidewall that are each positioned adjacent to and extend from the polishing surface, and have a length that extends within a plane that is parallel to the polishing surface, wherein the first sidewall and the second sidewall are curved. 7. The polishing article of claim 1 , wherein the discrete elements formed in the polishing surface further comprise: an interfacial area ratio of 45% to 65%; an average peak density of 30 to 35 per one millimeter; a maximum peak height (Sp) of 30 to 50 μm; and a maximum pit height (Sv) of 30 to 80 μm. 8. The polishing article of claim 1 , wherein the discrete elements formed in the polishing surface further comprise: an average peak density of 30 to 35 per one millimeter. 9. A polishing article, comprising: a polymeric sheet having a pad body that comprises: a solid polymeric material that is substantially pore free; a thickness that is defined between a polishing surface and an opposing bottom surface, and the thickness is less than about 0.46 mm; and a plurality of discrete elements that are formed in the polishing surface, wherein the discrete elements formed in the polishing surface have: a feature span of less than 40 μm; and an arithmetical mean height (Sa) from 2 to 7 μm, wherein the opposing bottom surface includes a surface roughness that has an arithmetical mean height (Sa) from 2 micro-inches (0.05 micrometers) to 200 micro-inches (5.08 micrometers). 10. The polishing article of claim 9 , wherein the pad body comprises a material selected from a group consisting of polypropylene and polytetrafluoroethylene (PTFE). 11. The polishing article of claim 9 , further comprising a releasable bonding layer that is disposed on the opposing bottom surface, and the releasable bonding layer has an interface surface that is on a side of the releasable bonding layer that is opposite to the opposing bottom surface, wherein the interface surface has a static friction coefficient of greater than 1.51, and wherein the static friction coefficient is measured by urging a surface of an object that has an arithmetical mean height (Sa) of 200 micro-inches (5.08 micrometers) against the interface surface. 12. The polishing article of claim 9 , wherein the polymeric sheet further comprises a plurality of grooves that extend from the polishing surface to a depth within the pad body, and the grooves define a repeating groove pattern in the polishing surface. 13. The polishing article of claim 9 , wherein the polymeric sheet further comprises a plurality of grooves extending from the polishing surface toward the opposing bottom surface, and the grooves comprise a first sidewall and a second sidewall that are each positioned adjacent to and extend from the polishing surface, and have a length that extends within a plane that is parallel to the polishing surface, wherein the first sidewall and the second sidewall are curved. 14. The polishing article of claim 9 , wherein the discrete elements formed in the polishing surface further comprise: an interfacial area ratio of 45% to 65%; an average peak density of 30 to 35 per one millimeter; a maximum peak height (Sp) of 30 to 50 μm; and a maximum pit height (Sv) of 30 to 80 μm. 15. The polishing article of claim 9 , wherein the discrete elements formed in the polishing surface further comprise: an average peak density of 30 to 35 per one millimeter. 16. A polishing article, comprising: a polymeric sheet that comprises: a thickness that is defined between a polishing surface and an opposing bottom surface; a length that extends in a first direction that is substantially parallel to the polishing surface; a width that extends in a second direction, which is substantially parallel to the polishing surface and is perpendicular to the first direction, wherein the width is at least two times smaller than the length; a solid polymeric material that is substantially pore free; a plurality of discrete elements that are formed on the polishing surface; an array of grooves that are formed in the polishing surface, wherein the array of grooves are aligned relative to the first direction or the second direction; and a releasable bonding layer that is disposed on the opposing bottom surface, and the releasable bonding layer has an interface surface that is on a side of the releasable bonding layer that is opposite to the opposing bottom surface, wherein the interface surface has a static friction coefficient of greater than 1.51, and wherein the static friction coefficient is measured by urging a surface of an object that has an arithmetical mean height (Sa) of 200 micro-inches (5.08 micrometers) against the interface surface. 17. The polishing article of claim 16 , wherein each of the grooves in the array of grooves extend from the polishing surface to a depth below the polishing surface, and the thickness is less than or equal to about 0.48 mm. 18. The polishing article of claim 16 , wherein the polymeric sheet comprises a material selected from a group consisting of polypropylene and polytetrafluoroethylene (PTFE).

Assignees

Inventors

Classifications

  • of semiconductor materials · CPC title

  • comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

  • Manufacture of flexible abrasive materials · CPC title

  • characterised by the shape of the lapping pad surface, e.g. grooved · CPC title

  • Lapping plates for working plane surfaces · CPC title

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What does patent US10786885B2 cover?
A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implement…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification B24B21/06. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 29 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).