Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Patent metadata

Field	Value
Publication number	US-9776361-B2
Application number	US-201514863409-A
Country	US
Kind code	B2
Filing date	Sep 23, 2015
Priority date	Oct 17, 2014
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.

First claim

The invention claimed is:

1. A polishing article, comprising:
a composite pad body comprising:
a plurality of polishing features forming a polishing surface, wherein the plurality of polishing features are formed from a first polymer material and each of the plurality of polishing features are separated by a groove; and
one or more base features formed from a second polymer material, wherein the one or more base features surround the plurality of polishing features to form a unitary body and the first polymer material has a hardness greater than a hardness of the second polymer material.

2. The polishing article of claim 1 , wherein the first polymer material has a different reactivity with electromagnetic energy when compared with the second polymer material.

3. The polishing article of claim 1 , wherein the second polymer material is a polymer matrix and the first polymer material comprises a plurality of microelements that are dispersed in the first polymer material.

4. The polishing article of claim 3 , wherein a portion of the microelements further comprise a metallic material, a ceramic material, or combinations thereof.

5. The polishing article of claim 3 , wherein each of the microelements include a mean diameter of about 150 microns to about 10 microns, or less.

6. The polishing article of claim 1 , wherein the composite pad body is disposed on a base film.

7. The polishing article of claim 6 , wherein the base film is transparent to electromagnetic energy.

8. A replacement supply roll for a chemical mechanical polishing process, comprising:
a rod having a polishing article wound thereon, the polishing article comprising:
a composite pad body, comprising:
a plurality of polishing features forming a polishing surface, wherein the plurality of polishing features are formed from a first polymer material and each of the plurality of polishing features are separated by a groove; and
one or more base features formed from a second polymer material, wherein the one or more base features surround the plurality of polishing features to form a unitary body and the first polymer material has a hardness greater than a hardness of the second polymer material.

9. The supply roll of claim 8 , wherein the first polymer material has a different reactivity with electromagnetic energy when compared with the second polymer material.

10. The supply roll of claim 8 , wherein the second polymer material is a polymer matrix and the first polymer material comprises a plurality of microelements that are dispersed in the first polymer material.

11. The supply roll of claim 10 , wherein a portion of the microelements further comprise a metallic material, a ceramic material, or combinations thereof.

12. The supply roll of claim 10 , wherein each of the microelements include a mean diameter of about 150 microns to about 10 microns, or less.

13. The supply roll of claim 8 , wherein the composite pad body is disposed on a base film that is transparent to electromagnetic energy.

14. A polishing article, comprising:
a composite pad body comprising:
a base material layer comprising a polymer material; and
a plurality of polishing features extending from the base material layer and forming a polishing surface, wherein the plurality of polishing features comprise a polymer material having a hardness greater than a hardness of the base material layer, wherein each of the plurality of polishing features is separated by a groove.

15. The polishing article of claim 14 , wherein the first polymer material has a different reactivity with electromagnetic energy when compared with the second polymer material.

16. The polishing article of claim 14 , wherein the second polymer material is a polymer matrix and the first polymer material comprises a plurality of microelements that are dispersed in the first polymer material.

17. The polishing article of claim 16 , wherein a portion of the microelements further comprise a metallic material, a ceramic material, or combinations thereof.

18. The polishing article of claim 16 , wherein each of the microelements include a mean diameter of about 150 microns to about 10 microns, or less.

19. The polishing article of claim 14 , wherein a pitch of the polishing features varies across a radius of the composite pad body.

Assignees

• Applied Materials Inc

Inventors

• Krishnan Kasiraman
• Redfield Daniel
• Perry Russell Edward
• Menk Gregory E
• Bajaj Rajeev
• Redeker Fred C
• Patibandla Nag B
• Orilall Mahendra C
• Fung Jason G

Classifications

• B24D11/001

  Manufacture of flexible abrasive materials · CPC title

• B24B37/24 Primary

  characterised by the composition or properties of the pad materials · CPC title

• H10P52/402

  of semiconductor materials · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B37/26 Primary

  characterised by the shape of the lapping pad surface, e.g. grooved · CPC title