Chip packages with sintered interconnects formed out of pads

Patent metadata

Field	Value
Publication number	US-10777496-B2
Application number	US-201715726526-A
Country	US
Kind code	B2
Filing date	Oct 6, 2017
Priority date	Oct 6, 2017
Publication date	Sep 15, 2020
Grant date	Sep 15, 2020

Abstract

The present invention is directed to a method for interconnecting two components. The first component includes a first substrate and a set of structured metal pads arranged on a main surface. Each of the pads includes one or more channels, extending in-plane with an average plane of the pad, so as to form at least two raised structures. The second interconnect component includes a second substrate and a set of metal pillars arranged on a main surface. The structured metal pads are bonded to a respective, opposite one of the metal pillars, using metal paste. The paste is sintered to form porous metal joints at the level of the channels. Metal interconnects are obtained between the substrates. During the bonding, the metal paste is sintered by exposing the structured metal pads and metal pillars to a reducing agent. The channels and raised structures improve the penetration of the reducing agent.

First claim

What is claimed is:

1. A set including:
a first interconnect component, comprising a first substrate and a set of structured metal pads arranged on a first main surface of said first substrate, wherein each of the structured metal pads comprises one or more channels, each extending in-plane with an average plane of said each of the structured metal pads, so as to form at least two raised structures thereon; and
a second interconnect component, comprising a second substrate and a set of metal pillars arranged on a second main surface of said second substrate, wherein the pads are adapted for fabricating metal interconnects with respective metal pillars on the second substrate, wherein each of the structured metal pads is bonded to a respective, opposite one of the metal pillars, using metal paste, the metal paste sintered so as to form one or more porous metal joint at a level of said one or more channels, wherein the bonded structured metal pads and opposite metal pillars form metal interconnects between the first substrate and the second substrate, wherein the first substrate further comprises redistribution lines formed on or in the first substrate, said redistribution lines connecting to the metal interconnects at a level of respective structured metal pads, so as to form an electrical current path from each of the redistribution lines to a respectively connected metal interconnect, via a respective structured metal pad, in operation, and wherein the one or more channels are arranged so as for said electrical current path to pass through one of said at least two raised structures, and wherein each of the structured metal pads comprises a plurality of channels, each extending in-plane with an average plane of each of the structured metal pads, so as to form a plurality of raised structures thereon, the metal paste sintered so as to form a porous metal joint at the level of each of the channels, the plurality of channels arranged so as for said electrical current path to pass through one structure within the plurality of raised structures.

2. The set of claim 1 , wherein a first average in-plane dimension of said metal structured metal pads is substantially equal to or larger than a second average in-plane dimension of said metal pillars, wherein the first average in-plane dimension and the second average in-plane dimension are measured in-plane with the first substrate and the second substrate, respectively.

3. The set of claim 1 , wherein the second interconnect component further comprises electronic components in electrical communication with at least some of the metal pillars.

Assignees

• IBM

Inventors

• Brunschwiler Thomas J
• Del Carro Luca
• Zürcher Jonas

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07253

  changes in shapes · CPC title

• H10W72/07252

  changes in structures or sizes · CPC title

• H10W72/07232

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/07211

  Treating the bond pad before connecting, e.g. by applying flux or cleaning · CPC title