Polishing method

Patent metadata

Field	Value
Publication number	US-9539699-B2
Application number	US-201514833727-A
Country	US
Kind code	B2
Filing date	Aug 24, 2015
Priority date	Aug 28, 2014
Publication date	Jan 10, 2017
Grant date	Jan 10, 2017

Abstract

A polishing method which can prevent a contamination of a release nozzle for releasing a substrate, such as a wafer, from a polishing head, is disclosed. The polishing method includes: polishing a substrate by pressing the substrate against a polishing pad on a polishing table by a polishing head while moving the polishing table and the polishing head relative to each other; moving the polishing head, holding the substrate, to a predetermined position above a substrate transfer device; cleaning the substrate by ejecting a cleaning fluid onto the substrate held by the polishing head located at the predetermined position; during cleaning of the substrate, discharging a fluid from a release nozzle located at the substrate transfer device; and after cleaning of the substrate, releasing the substrate from the polishing head by ejecting a releasing shower from the release nozzle into a gap between the polishing head and the substrate.

First claim

What is claimed is:

1. A polishing method comprising:
polishing a substrate by pressing the substrate against a polishing pad on a polishing table by a polishing head while moving the polishing table and the polishing head relative to each other;
moving the polishing head, holding the substrate, to a predetermined position above a substrate transfer device;
cleaning the substrate by ejecting a cleaning fluid onto the substrate held by the polishing head located at the predetermined position;
during cleaning of the substrate, discharging a fluid from a release nozzle located at the substrate transfer device; and
after cleaning of the substrate, releasing the substrate from the polishing head by ejecting a releasing shower from the release nozzle into a gap between the polishing head and the substrate.

2. The polishing method according to claim 1 , further comprising:
after releasing of the substrate from the polishing head, cleaning the polishing head by ejecting a cleaning fluid onto the polishing head.

3. The polishing method according to claim 2 , further comprising:
during cleaning of the polishing head, discharging a fluid from the release nozzle.

4. The polishing method according to claim 1 , wherein discharging of the fluid from the release nozzle is started before or when the polishing head reaches the predetermined position.

5. The polishing method according to claim 1 , wherein:
the release nozzle is a Laval nozzle; and
releasing the substrate comprising releasing the substrate from the polishing head by ejecting a supersonic parallel flow from the Laval nozzle into the gap between the polishing head and the substrate after cleaning of the substrate.

6. A polishing method comprising:
polishing a substrate by pressing the substrate against a polishing pad on a polishing table by a polishing head while moving the polishing table and the polishing head relative to each other;
moving the polishing head, holding the substrate, to a predetermined position above a substrate transfer device;
cleaning the substrate by ejecting a cleaning fluid onto the substrate held by the polishing head located at the predetermined position;
during cleaning of the substrate, ejecting a fluid toward a release nozzle located at the substrate transfer device; and
after cleaning of the substrate, releasing the substrate from the polishing head by ejecting a releasing shower from the release nozzle into a gap between the polishing head and the substrate.

7. The polishing method according to claim 6 , further comprising:
after releasing of the substrate from the polishing head, cleaning the polishing head by ejecting a cleaning fluid onto the polishing head.

8. The polishing method according to claim 7 , further comprising:
during cleaning of the polishing head, ejecting a fluid toward the release nozzle.

9. The polishing method according to claim 6 , wherein ejecting of the fluid toward the release nozzle is started before or when the polishing head reaches the predetermined position.

10. The polishing method according to claim 6 , wherein:
the release nozzle is a Laval nozzle; and
releasing the substrate comprising releasing the substrate from the polishing head by ejecting a supersonic parallel flow from the Laval nozzle into the gap between the polishing head and the substrate after cleaning of the substrate.

11. A polishing method comprising:
polishing a substrate by pressing the substrate against a polishing pad on a polishing table by a polishing head while moving the polishing table and the polishing head relative to each other;
moving the polishing head, holding the substrate, to a predetermined position above a substrate transfer device;
moving a shutter to a position above a release nozzle to cover the release nozzle which is located at the substrate transfer device;
cleaning the substrate by ejecting a cleaning fluid onto the substrate held by the polishing head located at the predetermined position, while the shutter is covering the release nozzle;
after cleaning of the substrate, moving the shutter to a retreat position away from the release nozzle; and then
releasing the substrate from the polishing head by ejecting a releasing shower from the release nozzle into a gap between the polishing head and the substrate.

12. The polishing method according to claim 11 , further comprising:
after releasing of the substrate from the polishing head, cleaning the polishing head by ejecting a cleaning fluid onto the polishing head.

13. The polishing method according to claim 12 , further comprising:
before cleaning of the polishing head, moving the shutter to a position above the release nozzle to cover the release nozzle.

14. The polishing method according to claim 11 , wherein the shutter is moved to the position above the release nozzle to cover the release nozzle before or when the polishing head reaches the predetermined position.

15. The polishing method according to claim 11 , wherein:
the release nozzle is a Laval nozzle; and
releasing the substrate comprising releasing the substrate from the polishing head by ejecting a supersonic parallel flow from the Laval nozzle into the gap between the polishing head and the substrate.

16. A polishing method comprising:
polishing a substrate by pressing the substrate against a polishing pad on a polishing table by a polishing head while moving the polishing table and the polishing head relative to each other;
moving the polishing head, holding the substrate, to a predetermined position above a substrate transfer device;
moving a release nozzle, which is located at the substrate transfer device, to a retreat position away from the substrate transfer device;
cleaning the substrate by ejecting a cleaning fluid onto the substrate held by the polishing head located at the predetermined position, while the release nozzle is located at the retreat position;
after cleaning of the substrate, moving the release nozzle from the retreat position to a shower position; and then
releasing the substrate from the polishing head by ejecting a releasing shower from the release nozzle into a gap between the polishing head and the substrate.

17. The polishing method according to claim 16 , further comprising:
after releasing of the substrate from the polishing head, cleaning the polishing head by ejecting a cleaning fluid onto the polishing head.

18. The polishing method according to claim 17 , further comprising:
before cleaning of the polishing head, moving the release nozzle to the retreat position.

19. The polishing method according to claim 16 , wherein the release nozzle is moved to the retreat position before or when the polishing head reaches the predetermined position.

20. The polishing method according to claim 16 , wherein:
the release nozzle is a Laval nozzle; and
releasing the substrate comprising releasing the substrate from the polishing head by ejecting a supersonic parallel flow from the Laval nozzle into the gap between the polishing head and the substrate.

Assignees

• Ebara Corp

Inventors

• Shinozaki Hiroyuki

Classifications

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• B24B37/042

  operating processes therefor · CPC title