Photocurable and thermosetting resin composition, dry film solder resist manufactured therefrom, and circuit board including the solder resist

Patent metadata

Field	Value
Publication number	US-9416243-B2
Application number	US-201414411843-A
Country	US
Kind code	B2
Filing date	Jun 17, 2014
Priority date	Jun 17, 2013
Publication date	Aug 16, 2016
Grant date	Aug 16, 2016

Abstract

The present invention relates to a photocurable and thermosetting resin composition, including an acid modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, two or more kinds of spherical alumina particles having different particle diameters from each other, and an organic solvent, a dry film solder resist obtained from the resin composition, and a circuit board including the dry film solder resist.

First claim

What is claimed is:

1. A photocurable and thermosetting resin composition, comprising an acid modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, two or more kinds of spherical alumina particles having different particle diameters from each other, a carbon compound having a surface coated with a thermal conductive ceramic compound, and an organic solvent,
wherein the carbon compound having a surface coated with the thermal conductive ceramic compound contains 0.5% to 20% by weight of the thermal conductive ceramic compound, and 80% to 99.5% by weight of the carbon compound.

2. The photocurable and thermosetting resin composition of claim 1 , wherein at least one kind of the spherical alumina particles has a particle diameter of 0.1 μm or less.

3. The photocurable and thermosetting resin composition of claim 1 , wherein at least one kind of the spherical alumina particles has a particle diameter from 0.2 μm to 0.7 μm.

4. The photocurable and thermosetting resin composition of claim 1 , wherein the carbon compound having a surface coated with the thermal conductive ceramic compound is in a range of 1.1% by weight or less.

5. The photocurable and thermosetting resin composition of claim 1 , wherein the thermal conductive ceramic compound contains one or more selected from the group consisting of alumina (Al 2 O 3 ), boron nitride (BN), aluminum nitride (AlN), silicon carbide (SiC), magnesium oxide (MgO), zinc oxide (ZnO), and aluminum hydroxide (Al(OH) 3 ).

6. The photocurable and thermosetting resin composition of claim 1 , wherein the carbon compound contains one or more selected from the group consisting of graphite, graphene, and carbon nanotubes.

7. The photocurable and thermosetting resin composition of claim 1 , wherein the carbon compound having a surface coated with the thermal conductive ceramic compound has an average particle diameter of 0.5 μm to 4 μm.

8. The photocurable and thermosetting resin composition of claim 1 , wherein the acid modified oligomer includes an epoxy (meth)acrylate-based compound.

9. The photocurable and thermosetting resin composition of claim 8 , wherein the epoxy (meth)acrylate-based compound has a weight average molecular weight of 5000 to 50,000.

10. The photocurable and thermosetting resin composition of claim 1 , wherein the photopolymerizable monomer includes one or more compounds selected from the group consisting of a polyfunctional compound having two or more vinyl groups in a molecule, and a polyfunctional (meth)acrylate compound having two or more (meth)acryloyl groups in a molecule.

11. The photocurable and thermosetting resin composition of claim 1 , wherein the photoinitiator includes one or more selected from the group consisting of a benzoin-based compound, an acetophenone-based compound, an anthraquinone-based compound, a thioxanthone compound, a ketal compound, a benzophenone-based compound, an α-aminoacetophenone compound, an acylphosphine oxide compound, an oxime ester compound, a biimidazole-based compound, and a triazine-based compound.

12. The photocurable and thermosetting resin composition of claim 1 , wherein the thermosetting binder resin includes one or more functional groups selected from the group consisting of an epoxy group, an oxetanyl group, a cyclic ether group, and a cyclic thioether group.

13. The photocurable and thermosetting resin composition of claim 1 , wherein the thermosetting binder resin includes one or more resins selected from the group consisting of a polyfunctional epoxy resin having two or more epoxy groups, a polyfunctional oxetane resin having two or more oxetanyl groups, and an episulfide resin having two or more thioether groups.

14. The photocurable and thermosetting resin composition of claim 1 , comprising the acid modified oligomer is in a range of 5% to 75% by weight;
the photopolymerizable monomer is in a range of 1% to 40% by weight;
the thermosetting binder resin is in a range of 0.5% to 40% by weight;
the photoinitiator is in a range of 0.1% to 20% by weight;
the two or more kinds of spherical alumina particles having different particle diameters from each other are in a range of 1% to 75% by weight;
the carbon compound having a surface coated with the thermal conductive ceramic compound is in a range of 0.2% to 1.0% by weight; and
the organic solvent is in a range of 1% to 90% by weight.

15. The photocurable and thermosetting resin composition of claim 1 , further comprising one or more inorganic fillers selected from the group consisting of barium sulfate, barium titanate, amorphous silica, crystalline silica, fused silica, spherical silica, talc, clay, magnesium carbonate, calcium carbonate, aluminum oxide, aluminum hydroxide, and mica.

16. The photocurable and thermosetting resin composition of claim 15 , wherein a sum of contents of the two or more kinds of spherical alumina particles having different particle diameters from each other and the inorganic filler is 30% to 60% by weight in the solid content except for the organic solvent.

17. A dry film solder resist manufactured by using the photosensitive resin composition of claim 1 .

18. The dry film solder resist of claim 17 , wherein a cured or dried product of the photosensitive resin composition is included.

19. The dry film solder resist of claim 17 , wherein the dry solder resist is used as a protective film for a printed circuit board.

20. The dry film solder resist of claim 17 , wherein the dry solder resist has a thickness of 10 μm to 150 μm, and a thermal conductivity of 1.10 W/mK or more.

21. The dry film solder resist of claim 20 , wherein the dry solder resist has an insulation resistance of 10.0*10 11 Ω or less.

22. A circuit board comprising the dry film solder resist of claim 17 .

Assignees

• Lg Chemical Ltd

Inventors

• Choi Byung Ju
• Jeong Woo Jae
• Choi Bo Yun
• Lee Kwang Joo
• Jeong Min Su
• Ku Se Jin

Classifications

• C09D133/068 Primary

  containing glycidyl groups · CPC title

• C08K3/08

  Metals · CPC title

• G03F7/027

  Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence) · CPC title

• C08L2312/06

  by radiation · CPC title

• C08K3/04 Primary

  Carbon · CPC title