Fabric with embedded electrical components

Patent metadata

Field	Value
Publication number	US-10772209-B2
Application number	US-201515514440-A
Country	US
Kind code	B2
Filing date	Sep 16, 2015
Priority date	Sep 30, 2014
Publication date	Sep 8, 2020
Grant date	Sep 8, 2020

Abstract

Apparatus, comprising fabric (62) formed from fibers (74); and an electrical component (20) having first and second perpendicular fiber guiding structures, wherein a first of the fibers is soldered in the first fiber guiding structure and a second of the fibers is soldered in the second fiber guiding structure.

First claim

What is claimed is:

1. An apparatus, comprising:
fabric formed from fibers; and
an electrical component having opposing upper and lower surfaces, a first fiber guiding structure in the upper surface, and a second fiber guiding structure in the lower surface, wherein the first and second fiber guiding structures are perpendicular, and wherein a first fiber of the fibers is soldered in the first fiber guiding structure and a second fiber of the fibers is soldered in the second fiber guiding structure.

2. The apparatus defined in claim 1 wherein the first and second fiber guiding structures are first and second grooves and wherein the first and second fibers are conductive fibers.

3. The apparatus defined in claim 2 wherein the first fiber is soldered to a first metal contact in the first groove using a first type of solder and wherein the second fiber is soldered to a second metal contact in the second groove using a second type of solder that has a lower melting point than the first type of solder.

4. The apparatus defined in claim 3 further comprising circuitry that controls the component using signals carried over the first and second fibers.

5. The apparatus defined in claim 4 wherein the electrical component is one of an array of electrical components soldered to the fibers of the fabric.

6. The apparatus defined in claim 4 wherein the fabric comprises woven fabric, wherein the fibers include weft fibers and warp fibers, wherein the first fiber is one of the weft fibers, and wherein the second fiber is one of the warp fibers.

7. The apparatus defined in claim 6 wherein the electrical component comprises:
an electrical device; and
a plastic package encasing the electrical device, wherein the first and second grooves are formed in the plastic package.

8. The apparatus defined in claim 7 wherein the plastic package has an elongated shape that extends along a longitudinal axis and wherein the first groove runs parallel to the longitudinal axis.

9. The apparatus defined in claim 8 wherein the plastic package further comprises a third groove that runs parallel to the second groove and that receives one of the warp fibers.

10. The apparatus defined in claim 7 wherein the electrical component comprises a light-emitting diode.

11. The apparatus defined in claim 7 wherein the electrical component comprises a sensor.

12. An apparatus, comprising:
woven fabric formed from warp and weft fibers; and
an electrical component having first and second opposing surfaces and having first and second contacts on the first surface, wherein a first of the warp fibers is soldered to the first contact in a first fiber guiding structure and a second of the warp fibers is soldered to the second contact in a second fiber guiding structure and wherein at least one of the warp fibers in the fabric is an insulating warp fiber that lies between the first and second warp fibers and that contacts the second surface of the electrical component.

13. The apparatus defined in claim 12 wherein the first and second warp fibers are conductive warp fibers, and wherein the insulating warp fiber that contacts the electrical component is one of at least three insulating warp fibers that lie between the first and second fibers and that overlap the electrical component.

14. The apparatus defined in claim 13 wherein the electrical component comprises a light-emitting diode.

15. The apparatus defined in claim 13 wherein the electrical component comprises a sensor.

16. An electronic device, comprising:
control circuitry; woven fabric having warp and weft fibers including non-conductive fibers, conductive warp fibers, and conductive weft fibers; and
an array of electrical components controlled by signals that are provided by the control circuitry over the conductive warp fibers and the conductive weft fibers, each electrical component having a first groove with a first contact that is soldered to one of the conductive weft fibers, each having a second groove with a second contact that is soldered to one of the conductive warp fibers, and each having a non-conductive groove that guides a non-conductive fiber, wherein the first groove overlaps the second groove and is parallel to the non-conductive groove.

17. The electronic device defined in claim 16 wherein the electrical component has an elongated package that extends along a longitudinal axis that is perpendicular to the first groove.

18. The electronic device defined in claim 17 wherein the first contact is soldered using a solder of a first type and wherein the second contact is soldered using a solder of a second type that has a lower melting temperature than the solder of the first type.

19. The electronic device defined in claim 18 wherein the electrical component comprises a light-emitting diode.

20. The electronic device defined in claim 19 wherein the second groove runs perpendicular to the first groove, wherein the first groove is formed on one surface of a plastic package, and wherein the second groove is formed on an opposing surface of the plastic package.

21. An apparatus, comprising:
fabric formed from fibers; and
an electrical component mounted in the fabric during formation of the fabric, wherein the electrical component has first and second opposing sides, wherein the electrical component has at least a first contact coupled to a first of the fibers with a first electrical connection and a second contact coupled to a second of the fibers with a second electrical connection, wherein the first and second fibers are perpendicular, wherein the electrical component has a groove in the first side, wherein the first electrical connection is formed in the groove, and wherein the second electrical connection is formed at the second side.

22. The apparatus defined in claim 21 wherein the first and second electrical connections are selected from the group consisting of: welded connections, solder connections, conductive adhesive connections, crimped metal connections, clamped-fiber contact connections, fastener-based connections, molded connections, wrapped-fiber connections, and press-fit connections.

23. The apparatus defined in claim 22 wherein the first fiber is a warp fiber and wherein the second fiber is a weft fiber.

24. The apparatus defined in claim 23 wherein the fabric comprises woven fabric and wherein the electrical component is mounted to the fibers during weaving of the fabric.

25. The apparatus defined in claim 24 wherein the electrical component comprises a component selected from the group consisting of: an integrated circuit, a light-emitting diode, a light-emitting diode that is packaged with transistor-based circuitry, a resistor, a capacitor, an inductor, an audio component, a touch sensor, an accelerometer, a temperature sensor, a force sensor, a microelectromechanical systems device, a transducer, a solenoid, an electromagnet, a pressure sensor, a light sensor, a proximity sensor, a button, and a switch.

26. The apparatus defined in claim 25 wherein the first and second electrical connections comprise solder connections formed from solders with first and second respective melting points.

27. A method for forming a fabric-based item, comprising:
with fiber intertwining equipment, intertwining fibers to produce fabric; and
while intertwining the fibers, mounting electrical components within the fabric by electrically connec

Assignees

• Apple Inc

Inventors

• Sunshine Daniel D
• Podhajny Daniel A
• Crews Kathryn P
• Hamada yohji

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W70/657

  on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers · CPC title

• H10W70/68

  Shapes or dispositions thereof · CPC title

• D10B2401/16

  antistatic; conductive · CPC title