Integrated system of an electronic module and conductive fabric and method of making the same

Patent metadata

Field	Value
Publication number	US-2016183367-A1
Application number	US-201414574944-A
Country	US
Kind code	A1
Filing date	Dec 18, 2014
Priority date	Dec 18, 2014
Publication date	Jun 23, 2016
Grant date	—

Abstract

An electronic module assembly and method of assembling an electronic module to a conductive fabric are provided. An electronic module assembly comprises a non-conductive fabric and a conductive fabric covering at least part of a first side of the non-conductive fabric. An electronics module is disposed on the conductive fabric, and a portion of the electronics module includes a wall defining a through hole. A fastener passing through the through hole and passing through the conductive fabric is configured to electronically couple the electronics module to the conductive fabric.

First claim

What is claimed is:

1 . An electronic module assembly comprising:
a non-conductive fabric; a conductive fabric covering at least part of a first side of the non-conductive fabric; an electronics module disposed on the conductive fabric, a portion of the electronics module includes a wall defining a through hole; and a fastener passing through the through hole and passing through the conductive fabric, wherein the fastener is configured to electronically couple the electronics module to the conductive fabric.

2 . The module of claim 1 , wherein the wall is plated with a conductive material.

3 . The module of claim 1 , wherein the portion of the electronics module comprises a top surface and a bottom surface surrounding the through hole, a portion of the top surface and bottom surface is plated with a conductive material.

4 . The module of claim 1 , wherein the conductive fabric is attached to the non-conductive fabric substrate using one or more of stitching or gluing.

5 . The module of claim 1 , wherein the fastener is a metal fastener.

6 . The module of claim 1 , wherein the fastener includes a metal coating.

7 . The module of claim 1 , wherein the conductive fabric is formed from a metal plated yarn.

8 . A method of making an electronics assembly comprising an electronics module and a conductive fabric, comprising:
forming a substrate including a conductive fabric covering at least part of a first side of a non-conductive fabric; disposing an electronics module having one or more through holes on the substrate with the through holes aligned with a portion of the conductive fabric; inserting a fastener to pass through the through hole and through the substrate; and clamping the module to the substrate to form an electrical connection using the fastener.

9 . The method of claim 8 , wherein forming the substrate includes:
attaching the conductive fabric to the non-conductive fabric using one or more of stitching or gluing.

10 . The method of claim 8 , wherein the clamping forms a gas tight connection between the module and the conductive fabric.

Assignees

• Flextronics Ap Llc

Inventors

• Liu Weifeng
• Mohammed Anwar
• Kurwa Murad

Classifications

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W95/00

  Packaging processes not covered by the other groups of this subclass · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title