Extreme creep resistant nano-crystalline metallic materials

Patent metadata

Field	Value
Publication number	US-10766071-B2
Application number	US-201815896804-A
Country	US
Kind code	B2
Filing date	Feb 14, 2018
Priority date	Feb 15, 2017
Publication date	Sep 8, 2020
Grant date	Sep 8, 2020

Abstract

Novel metallic systems and methods for their fabrication provide an extreme creep-resistant nano-crystalline metallic material. The material comprises a matrix formed of a solvent metal with crystalline grains having diameters of no more than about 500 nm, and a plurality of dispersed metallic particles formed on the basis of a solute metal in the solvent metal matrix and having diameters of no more than about 200 nm. The particle density along the grain boundary of the matrix is as high as about 2 nm2 of grain boundary area per particle so as to substantially block grain boundary motion and rotation and limit creep at temperatures above 35% of the melting point of the material.

First claim

We claim:

1. An extreme creep-resistant nano-crystalline metallic material comprising:
a matrix formed of a solvent metal comprising crystalline grains having diameters of no more than about 500 nm; and
a plurality of dispersed metallic particles formed on the basis of a solute metal in the solvent metal matrix and having diameters of no more than about 200 nm,
wherein the particle density along the grain boundary of the matrix is as high as about 2 nm 2 of grain boundary area per particle so as to substantially block grain boundary motion and rotation and limit creep at temperatures above 35% of the melting point of the material.

2. The material of claim 1 , wherein the solvent metal comprises 50 to 99.9 atomic percent (at. %) of the material, and the dispersed metallic solute metal comprise 0.1 to 50 atomic percent (at. %) of the material.

3. The material of claim 2 , wherein the solvent metal comprises copper (Cu) or a copper alloy, and the solute metal comprises one or more metals selected from the group consisting of: chromium (Cr), vanadium (V), niobium (Nb), tantalum (Ta), iron (Fe), cobalt (Co), molybdenum (Mo), tungsten (W), osmium (Os) antimony (Sb), cadmium (Cd), manganese (Mn), titanium (Ti), zirconium (Zr), hafnium (Hf), scandium (Sc), yttrium (Y), and strontium (Sr).

4. The material of claim 1 , wherein the particles number densities within the volume of material is in the range of 10 15 to 10 30 per cubic meter.

5. The material of claim 1 , wherein the creep rate is less than 10 −6 s −1 at greater than 35% of the melting point of the material.

6. The material of claim 1 , wherein the creep rate is less than 10 −6 s −1 at greater than 20% of their respective yield point values at temperatures greater than 35% of the melting point of the material.

7. The material of claim 1 , wherein at least some of the particles further comprise additional elements.

8. The material of claim 1 , wherein at least some of the particles comprise coherent particles having diameters less than about 5 nm.

9. The material of claim 1 , wherein at least some of the particles comprise semi-coherent particles having diameters between about 5 nm and about 20 nm.

10. The material of claim 1 , wherein at least some of the particles comprise incoherent particles having diameters in excess of about 20 nm but no more than about 200 nm.

11. The material of claim 1 , wherein the solute metal is at least 0.1 atomic percent of the material so as to limit rotation of grains to no more than about 30 degrees.

12. The material of claim 1 , wherein the material has a room temperature yield strength in the range of 300 to 2000 MPa.

13. The material of claim 1 , wherein the material has a room temperature compressive ductility greater than about 3% or a tensile ductility of at least about 0.5%.

14. A process for forming an extreme creep-resistant nano-crystalline metallic material comprised of a solvent metal comprising 50 to 99.9 atomic percent (at. %) of the material, and at least one solute metal dispersed in the solvent metal, comprising 0.1 to 50 at. % of the metallic material, the process comprising:
subjecting metals of the solvent metal and the at least one solute metal to a non-equilibrium processing technique so as to produce:
a matrix formed of a solvent metal or alloy and comprising crystalline grains having diameters of no more than about 500 nm; and
a plurality of dispersed metallic particles formed from a basis of the solute metal in the solvent metal matrix and having diameters of no more than about 200 nm,
wherein the particle density along the grain boundary of the matrix is as high as about 2 nm 2 of grain boundary area per particle so as to substantially block grain boundary motion and rotation and limit creep at temperatures above 35% of the melting point of the material.

15. The process of claim 14 , wherein the non-equilibrium processing technique comprises: milling, melt spinning, spray atomization, inert gas condensation, solution precipitation, physical vapor deposition, and electrodeposition.

16. The process of claim 15 , wherein the milling is high energy milling or low energy milling.

17. The process of claim 14 , further comprising: performing a bulk consolidation process on the material.

Assignees

• U S Army Res Laboratory Attn Rdrl Loc I
• Us Army

Inventors

• Kecskes Laszlo J
• Darling Kristopher A
• Mishra Rajiv S
• Mishin Yuri
• Solanki Kiran N
• Rajagopalan Mansa

Classifications

• C22C1/0425

  Copper-based alloys · CPC title

• C22C9/00 Primary

  Alloys based on copper · CPC title

• B22F1/07

  Metallic powder characterised by particles having a nanoscale microstructure (nanosized particles B22F1/054) · CPC title

• B22F2202/03

  Treatment under cryogenic or supercritical conditions · CPC title

• B22F3/20

  by extruding · CPC title