Film forming method for metal film and film forming apparatus therefor

Patent metadata

Field	Value
Publication number	US-10760172-B2
Application number	US-201916395544-A
Country	US
Kind code	B2
Filing date	Apr 26, 2019
Priority date	May 23, 2016
Publication date	Sep 1, 2020
Grant date	Sep 1, 2020

Abstract

In a film forming method, in a state where a metal solution is sealed in a first accommodation chamber of a housing with a solid electrolyte membrane and a fluid is sealed in a second accommodation chamber of a placing table with a thin film, a substrate is placed on the placing table and the placing table and the housing are moved relative to each other to cause the substrate to be interposed between the solid electrolyte membrane and the thin film, the solid electrolyte membrane and the thin film are pressed against the substrate interposed therebetween to cause the solid electrolyte membrane and the thin film to conform to a surface and a rear surface of the substrate, thereby forming a metal film.

First claim

What is claimed is:

1. A film forming apparatus for a metal film comprising:
an anode;
a solid electrolyte membrane which is disposed between the anode and a substrate which is a cathode, and contains metal ions;
a power supply which applies a voltage between the anode and the substrate;
a housing having a first accommodation chamber which accommodates a metal solution containing metal ions;
a placing table on which the substrate is placed and which has a second accommodation chamber that accommodates a fluid;
a thin film having flexibility; and
a pressing portion which presses the solid electrolyte membrane and the thin film against the substrate in a state of being interposed between the solid electrolyte membrane and the thin film, wherein
the metal solution is disposed between the anode and the solid electrolyte membrane, and the metal solution is sealed in the first accommodation chamber with the solid electrolyte membrane so as to cause the metal solution to be disposed on a surface of the substrate via the solid electrolyte membrane,
the fluid is sealed in the second accommodation chamber with the thin film so as to cause the fluid to be disposed on a rear surface of the substrate positioned on a side opposite to the surface on which the metal film is formed, via the thin film,
at least one of the housing and the placing table is movable to cause the substrate to be interposed between the solid electrolyte membrane and the thin film, and
the thin film is a thin film in which a surface on which the substrate is placed has conductivity.

2. The film forming apparatus according to claim 1 , wherein
the pressing portion is a pump which pressurizes the metal solution in the first accommodation chamber or a pump which pressurizes the fluid in the second accommodation chamber.

3. The film forming apparatus according to claim 2 , further comprising:
a restricting section which restricts relative displacement between the housing and the placing table in the state in which the substrate is interposed between the solid electrolyte membrane and the thin film.

Assignees

• Toyota Motor Co Ltd

Inventors

• Sato Yuki
• Hiraoka Motoki
• Iisaka Hirofumi

Classifications

• C25D3/00 Primary

  Electroplating: Baths therefor · CPC title

• C25D17/14

  for pad-plating · CPC title

• C25D7/00

  Electroplating characterised by the article coated · CPC title

• C25D17/002 Primary

  Cell separation, e.g. membranes, diaphragms · CPC title

• C25D3/38

  of copper · CPC title