Contactless metal card constructions

US10733494B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10733494-B2
Application numberUS-201815939281-A
CountryUS
Kind codeB2
Filing dateMar 29, 2018
Priority dateAug 10, 2014
Publication dateAug 4, 2020
Grant dateAug 4, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A metal smartcard (SC) having a transponder chip module (TCM) with a module antenna (MA), and a card body (CB) comprising two discontinuous metal layers (ML), each layer having a slit (S) overlapping the module antenna, the slits being oriented differently than one another. One metal layer can be a front card body (FCB, CF1), and the other layer may be a rear card body (RCB, CF2) having a magnetic stripe (MS) and a signature panel (SP).

First claim

Opening claim text (preview).

What is claimed is: 1. A metal smartcard comprising: a first metal layer (ML, FCB) with a first slit (S 1 ) extending from an outer edge thereof to a first module opening (MO 1 ) for accepting a transponder chip module (TCM), the first metal layer functioning as a first coupling frame (CF 1 ); and a second metal layer (ML,RCB) with a second slit (S 2 ) extending from an outer edge thereof to a second module opening (MO 2 ) for accepting the transponder chip module (TCM), the second metal layer functioning as a second coupling frame (CF 2 ); wherein the two coupling frames (CF 1 , CF 2 ) mechanically support one another in particular around the two slits (S 1 , S 2 ) and the module openings (MO 1 , MO 2 ). 2. The metal smartcard of claim 1 , wherein: the slit (S 1 , S 2 ) in each layer (CF 1 , CF 2 ) overlaps a portion of a module antenna (MA) of the transponder chip module (TCM). 3. The metal smartcard of claim 1 , wherein: the slit (S 2 ) of one layer (CF 2 ) and is located in a different position or orientation than the slit (S 1 ) the other layer (CF 1 ) so that the slits of the layers are not aligned with one another. 4. The metal smart card of claim 1 , further comprising: a recess in the first metal layer to accommodate the second metal layer. 5. The metal smartcard of claim 1 , further comprising one or more of the following features disposed on the second metal layer (RCB): a magnetic strip (MS); a signature panel (SP); and a hologram. 6. The metal smartcard of claim 1 , wherein: one or both of the coupling frames (CF 1 , CF 2 ) is connected to a device circuit to power the circuit or improve the read/write performance of the smartcard in conjunction with a reader. 7. The metal smartcard of claim 1 , wherein: the second module opening (MO 2 ) is replaced by an elongated, contoured or looped slit (S 2 ) or multiple slits (S) to improve overall mechanical stability of the smartcard. 8. The metal smartcard of claim 1 , wherein: the smartcard is operable in both contact and contactless modes. 9. The metal smartcard of claim 1 , further comprising: a layer of non-conductive material separating the two metal layers. 10. The metal smartcard of claim 1 , wherein: the two metal layers are joined with one another by an adhesive film. 11. The metal smartcard of claim 1 , wherein: the transponder chip module has contact pads for a contact interface. 12. The metal smartcard of claim 1 , wherein: the transponder chip module is passive, harvesting power from an external reader. 13. The metal smartcard of claim 1 , wherein: the transponder chip module comprises a module antenna (MA); and the module antenna comprises a planar antenna comprising a single long conductive track laid out in a spiral pattern. 14. The metal smartcard of claim 1 , wherein: the front card body (FCB) has a thickness of 760 μm to 800 μm; and the rear card body (RCB) has a thickness of 300 μm to 400 μm.

Assignees

Inventors

Classifications

  • the connection being galvanic · CPC title

  • used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal · CPC title

  • Electricity · mapped topic

  • H04B5/77Primary

    for interrogation · CPC title

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Frequently asked questions

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What does patent US10733494B2 cover?
A metal smartcard (SC) having a transponder chip module (TCM) with a module antenna (MA), and a card body (CB) comprising two discontinuous metal layers (ML), each layer having a slit (S) overlapping the module antenna, the slits being oriented differently than one another. One metal layer can be a front card body (FCB, CF1), and the other layer may be a rear card body (RCB, CF2) having a magne…
Who is the assignee on this patent?
Finn David, Lotya Mustafa, Molloy Darren, and 1 more
What technology area does this patent fall under?
Primary CPC classification G06K19/07754. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 04 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).