Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags

Patent metadata

Field	Value
Publication number	US-9390364-B2
Application number	US-201414551376-A
Country	US
Kind code	B2
Filing date	Nov 24, 2014
Priority date	Aug 8, 2011
Publication date	Jul 12, 2016
Grant date	Jul 12, 2016

Abstract

A capacitive coupling enhanced (CCE) transponder chip module (TCM) comprises an RFID chip (CM, IC), optionally contact pads (CP), a module antenna (MA), and a coupling frame (CF), all on a common substrate or module tape (MT). The coupling frame (CF, 320 A) may be in the form of a ring, having an inner edge (IE), an outer edge IE, 324 ) and a central opening (OP), disposed closely adjacent to and surrounding the module antenna (MA). A slit (S) may extend from the inner edge (IE) to the outer edge (OE) of the coupling frame (CF) so that the coupling frame (CF) is “open loop”. An RFID device may comprise a transponder chip module (TCM) having a module antenna (MA), a device substrate (DS), and an antenna structure (AS) disposed on the device substrate (DS) and connected with the module antenna (MA). A portion of a conductive layer (CL, 904 ) remaining after etching a module antenna (MA) may be segmented to have several smaller isolated conductive structures.

First claim

The invention claimed is:

1. A capacitive coupling enhanced (CCE) transponder chip module (TCM) comprising:
a module tape (MT);
an area for mounting an RFID chip (IC) on the module tape (MT); and
a module antenna (MA, PA) disposed on the module tape (MT);
characterized by:
a conductive coupling frame (CF) disposed on the module tape (MT) having an opening (OP) defined by an inner edge (IE), an outer edge (OE) and a discontinuity comprising a slit (S) or a non-conductive stripe (NCS) extending from the opening (OP) to the outer edge (OE);
wherein the opening (OP) is disposed surrounding and closely adjacent to the module antenna (MA);
wherein: the coupling frame (CF) is formed from a conductive layer (CL) on the module tape (MT) which is one of the (i) conductive layer used to form contact pads (CP) on the face-up side of the module tape (MT) and (ii) the conductive layer used to form the module antenna on the face-down side of the module tape (MT).

2. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1 , wherein:
the coupling frame (CF) is disposed on the same side of the module tape (MT) as the module antenna (MA, PA).

3. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1 , wherein:
the coupling frame (CF) is disposed on an opposite side of the module tape (MT) from the module antenna (MA, PA).

4. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1 , wherein:
the coupling frame (CF) comprises wire (EW) embedded in the module tape (MT).

5. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1 , wherein:
the module antenna (MA) comprises an etched planar antenna (PA) having a number of tracks (traces) separated by spaces;
wherein:
a track width is less than 100 μm; and
a spacing between adjacent tracks is less than 75 μm.

6. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1 , wherein:
the module antenna (MA) comprises two antenna structures (PA-1, PA-2).

7. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1 , further comprising:
a capacitor (CAP) connected with the module antenna (MA).

8. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1 , wherein:
there are two coupling frames (CF-1, CF-2), one disposed on a face-up side of the module tape (MT) the other disposed on a face-down side of the module tape (MT).

9. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1 , wherein:
the coupling frame (CF) is disposed around the module antenna (MA) with its opening (OP) surrounding the module antenna (MA) and closely adjacent thereto.

10. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1 , wherein:
the coupling frame (CF) overlaps at least a portion of the module antenna (MA).

11. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1 , wherein:
the coupling frame (CF) extends a few millimeters beyond the module antenna (MA) on one side thereof, and extends a few centimeters beyond the module antenna (MA) on an opposite side thereof.

12. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1 , wherein:
the coupling frame (CF) has a geometry defined by a shape of its outer edge (OE) which is different than a geometry of the transponder chip module (TCM).

13. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1 , further comprising:
a plating line (PL) extending from outside of the coupling frame (CF), through the slit (S) in the coupling frame (CF) to the module antenna (MA).

14. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1 , further comprising:
conductive traces (CT) extending between at least some contact pads (CP) and connection bridges (CBR) of the contact pad array (CPA).

15. A capacitive coupling enhanced transponder chip module (CCE-TCM, 400 ) comprising:
a module tape (MT);
an RFID chip (IC) disposed on the module tape (MT);
an etched module antenna (MA) disposed on the module tape (MT); and
a coupling frame (CF) disposed on the module tape (MT), closely adjacent to the module antenna (MA), having an opening (OP) aligned with the module antenna (MA) and a slit (S) extending from the opening (OP) to an outer edge (OE) of the coupling frame (CF) so that the coupling frame (CF) is an open loop;
wherein: the coupling frame (CF) is formed from a conductive layer (CL) on the module tape (MT) which is one of the (i) conductive layer used to form contact pads (CP) on the face-up side of the module tape (MT) and (ii) the conductive layer used to form the module antenna on the face-down side of the module tape (MT).

16. The capacitive coupling enhanced transponder chip module (CCE-TCM) of claim 15 , further comprising:
contact pads (CP) so that the capacitive coupling enhanced transponder chip module (CCE-TCM) can function with dual interfaces (contactless and contact).

Assignees

• Finn David
• Lotya Mustafa
• Molloy Darren
• Féinics Amatech Teoranta

Inventors

• Finn David
• Lotya Mustafa
• Molloy Darren

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title

• G06K19/07747 Primary

  at least one of the integrated circuit chips being mounted as a module · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01L2224/05554

  Electricity · mapped topic