Methods and apparatus for embedding wire in substrates for secure documents

Patent metadata

Field	Value
Publication number	US-9449269-B2
Application number	US-201514714290-A
Country	US
Kind code	B2
Filing date	May 16, 2015
Priority date	Aug 12, 2010
Publication date	Sep 20, 2016
Grant date	Sep 20, 2016

Abstract

A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).

First claim

What is claimed is:

1. A method of embedding a wire in a surface of a substrate, comprising:
with an embedding tool, feeding wire onto the surface of the substrate while applying a given downward force and while imparting an ultrasonic vibration to the embedding tool;
controlling at least one of the downward force which is exerted by the embedding tool and a power of the ultrasonic vibration while embedding the wire in the surface of the substrate; and
establishing a force profile and applying different forces at different positions, during the embedding process, in a controlled manner.

2. The method of claim 1 , wherein the embedding tool comprises:
a linear actuator for urging at least a portion of the embedding tool downward.

3. The method of claim 1 , further comprising:
while controlling the force, controlling a power of the ultrasonic vibration imparted to the embedding tool.

4. The method of claim 1 , wherein the substrate is a card body of a smart card.

5. The method of claim 1 , wherein the substrate is an inlay substrate.

6. The method of claim 1 , wherein the substrate is a substrate of a secure document.

7. The method of claim 1 , wherein the substrate comprises one or more layers of material selected from the group consisting of Polyvinyl Chloride (PVC), Polycarbonate (PC), PET-G (Polyethylene Terephtalate Glycol-modified), Copolyester (Tritan), Teslin™, synthetic paper, paper and the like.

8. A method of embedding a wire in a surface of a substrate, comprising:
with an embedding tool, feeding wire onto the surface of the substrate while applying a given downward force and while imparting an ultrasonic vibration to the embedding tool; and
controlling at least one of the downward force which is exerted by the embedding tool and a power of the ultrasonic vibration while embedding the wire in the surface of the substrate;
wherein:
different downward forces are applied by the embedding tool at different positions being embedded.

9. The method of claim 8 , wherein the substrate is a card body of a smart card.

10. The method of claim 8 , wherein the substrate is an inlay substrate.

11. The method of claim 8 , wherein the substrate is a substrate of a secure document.

12. The method of claim 8 , wherein the substrate comprises one or more layers of material selected from the group consisting of Polyvinyl Chloride (PVC), Polycarbonate (PC), PET-G (Polyethylene Terephtalate Glycol-modified), Copolyester (Tritan), Teslin™, synthetic paper, paper and the like.

13. The method of claim 8 , wherein the embedding tool comprises:
a linear actuator for urging at least a portion of the embedding tool downward.

14. A method of embedding a wire in a surface of a substrate, comprising:
with an embedding tool, feeding wire onto the surface of the substrate while applying a given downward force and while imparting an ultrasonic vibration to the embedding tool; and
controlling at least one of the downward force which is exerted by the embedding tool and a power of the ultrasonic vibration while embedding the wire in the surface of the substrate;
wherein the wire forms a booster antenna component having a plurality of turns, and further comprising:
applying different downward forces depending upon which of the plurality of turns is being embedded.

15. The method of claim 14 , wherein the substrate is a card body of a smart card.

16. The method of claim 14 , wherein the substrate is an inlay substrate.

17. The method of claim 14 , wherein the substrate is a substrate of a secure document.

18. The method of claim 14 , wherein the substrate comprises one or more layers of material selected from the group consisting of Polyvinyl Chloride (PVC), Polycarbonate (PC), PET-G (Polyethylene Terephtalate Glycol-modified), Copolyester (Tritan), Teslin™, synthetic paper, paper and the like.

19. The method of claim 14 , wherein the embedding tool comprises:
a linear actuator for urging at least a portion of the embedding tool downward.

Assignees

• Finn David
• Czornack Jan Thomas
• Féinics Amatech Teoranta

Inventors

• Finn David
• Czornack Jan Thomas

Classifications

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• G06K19/07783

  the coil being planar · CPC title

• Y10T29/49018

  with other electrical component · CPC title

• G06K19/07794 Primary

  the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit · CPC title

• G06K19/07769

  the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface · CPC title