Mirror blank for EUV lithography without expansion under EUV radiation

US10732519B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10732519-B2
Application numberUS-201415024236-A
CountryUS
Kind codeB2
Filing dateSep 10, 2014
Priority dateSep 30, 2013
Publication dateAug 4, 2020
Grant dateAug 4, 2020

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Abstract

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A substrate for an EUV mirror which contains a zero crossing temperature profile that departs from the statistical distribution is provided. A method for producing a substrate for an EUV mirror is also provided, in which the zero crossing temperature profile in the substrate is adapted to the operating temperature of the mirror. A lithography method using the substrate is also described.

First claim

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We claim: 1. A substrate for an EUV mirror, wherein the substrate comprises a surface, wherein the substrate comprises zero crossing temperatures at the surface which depart from a statistical distribution, and wherein the substrate comprises a minimal zero crossing temperature (T zcmin ) and a maximal zero crossing temperature (T zcmax ) at the surface which differ from each other by more than 1.5 K; wherein the substrate comprises a zero crossing temperature T zc1 in regions far from an edge and a zero crossing temperature T zc2 at the edge, wherein T zc1 is at least 1.5° C. higher than T zc2 ; wherein a profile of the zero crossing temperature across the surface of the substrate is adapted to the profile of the operating temperature of the mirror; wherein an OH profile across the surface of the substrate corresponds to the zero crossing temperature profile across the surface of the substrate; and wherein a profile of a fictive temperature across the surface of the substrate corresponds to the zero crossing temperature profile across the surface of the substrate. 2. The substrate according to claim 1 , wherein the substrate comprises titanium oxide-doped quartz glass. 3. The substrate according to claim 1 , wherein the substrate comprises 5% by weight to 12% by weight titanium dioxide relative to a total weight of the substrate. 4. The substrate according to claim 1 , wherein the substrate comprises multiple layers. 5. The substrate according to claim 1 , wherein the difference between T zcmax and T zcmin is at least 2 K. 6. The substrate according to claim 5 , wherein the difference between T zcmax and T zcmin is in a range of from 2 to 10 K. 7. The substrate according to claim 1 , wherein the distribution of the zero crossing temperature comprises, at least partly, an essentially steady profile. 8. An EUV mirror comprising the substrate according to claim 1 . 9. The mirror according to claim 8 , wherein the profile of the zero crossing temperature across the surface of the substrate is adapted to a profile of the operating temperature of the mirror. 10. A method for producing a substrate for an EUV mirror, comprising the following steps: a) pre-defining an inhomogeneous nominal temperature profile of a zero crossing temperature for the substrate; and b) producing the substrate while adjusting a pre-defined location-dependent nominal profile of the zero crossing temperature, wherein the profile of the nominal temperature extends laterally; wherein the substrate comprises a surface, wherein the substrate comprises zero crossing temperatures at the surface which depart from a statistical distribution, and wherein the substrate comprises a minimal zero crossing temperature (T zcmin ) and a maximal zero crossing temperature (T zcmax ) at the surface which differ from each other by more than 1.5 K; wherein the substrate comprises a zero crossing temperature T zc1 in regions far from an edge and a zero crossing temperature T zc2 at the edge, wherein T zc1 is at least 1.5° C. higher than T zc2 ; wherein a profile of the zero crossing temperature across the surface of the substrate is adapted to the profile of the operating temperature of the mirror; wherein an OH profile across the surface of the substrate corresponds to the zero crossing temperature profile across the surface of the substrate; and wherein a profile of a fictive temperature across the surface of the substrate corresponds to the zero crossing temperature profile across the surface of the substrate. 11. The method according to claim 10 , wherein step (b) comprises: i) depositing silicon-containing starting substances and titanium-containing starting substances while forming a TiO 2 -doped soot body; ii) drying the soot body; iii) sintering the soot body while forming a blank; iv) homogenizing the blank; and v) optionally forming a substrate. 12. The method according to claim 11 , wherein the starting substances are deposited layer-by-layer on a cylinder-shaped blank. 13. The method according to claim 11 , wherein the quantity of the titanium-containing starting substance is varied during the deposition process. 14. The method according to claim 13 , wherein the adjustment of the distribution of the zero crossing temperature is effected through doping with titanium oxide which departs from a statistical distribution. 15. The method according to claim 10 , wherein the adjustment of the distribution of the zero crossing temperature is effected through a distribution of an OH content in the soot body which departs from a statistical distribution. 16. The method according to claim 10 , wherein the adjustment of the distribution of the zero crossing temperature is effected through a distribution of a halogen co-doping agent which departs from a statistical distribution. 17. The method according to claim 10 , wherein the adjustment of the distribution of the zero crossing temperature is effected through fictive temperatures of the substrate. 18. The method according to claim 17 , wherein the adjustment of the fictive temperatures is effected through heat treatment with rings, artificial over-dimensioning and/or forced cooling. 19. An EUV mirror produced by the method according to claim 10 . 20. A lithography method comprising the following steps: a) providing an EUV mirror having a substrate; and b) providing at least one light source, which acts on the EUV mirror during operation, wherein the substrate comprises zero crossing temperatures at the surface which depart from a statistical distribution, and wherein the substrate comprises a minimal zero crossing temperature (T zcmin ) and a maximal zero crossing temperature (T zcmax ) at the surface which differ from each other by more than 1.5 K; wherein the substrate comprises a zero crossing temperature T zc1 in regions far from an edge and a zero crossing temperature T zc2 at the edge, wherein T zc1 is at least 1.5° C. higher than T zc2 ; wherein a distribution of the zero crossing temperature across the surface of the substrate is adapted to a distribution of an operating temperature of the mirror; wherein an OH profile across the surface of the substrate corresponds to the zero cross temperature profile across the surface of the substrate; and wherein a profile of a fictive temperature across the surface of the substrate corresponds to the zero crossing temperature profile across the surface of the substrate.

Assignees

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Classifications

  • doped with hydroxyl groups · CPC title

  • doped with titanium · CPC title

  • Thermal after-treatment of glass products not provided for in groups {C03B19/00} , C03B25/00 - C03B31/00 {or C03B37/00}, e.g. crystallisation, eliminating gas inclusions or other impurities; {Hot-pressing vitrified, non-porous, shaped glass products} · CPC title

  • Reactant delivery systems · CPC title

  • doped with fluorine (C03B2201/14 takes precedence) · CPC title

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What does patent US10732519B2 cover?
A substrate for an EUV mirror which contains a zero crossing temperature profile that departs from the statistical distribution is provided. A method for producing a substrate for an EUV mirror is also provided, in which the zero crossing temperature profile in the substrate is adapted to the operating temperature of the mirror. A lithography method using the substrate is also described.
Who is the assignee on this patent?
Heraeus Quarzglas
What technology area does this patent fall under?
Primary CPC classification G03F7/70958. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 04 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).