Composition for bonding

US10731233B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10731233-B2
Application numberUS-201815951424-A
CountryUS
Kind codeB2
Filing dateApr 12, 2018
Priority dateOct 16, 2015
Publication dateAug 4, 2020
Grant dateAug 4, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A composition for bonding includes tin, germanium, and nickel. A contained amount of germanium is less than or equal to 10 mass %. A contained amount of nickel in mass % is less than or equal to a product of 2.8 multiplied by a term that is the contained amount of germanium in mass % to the power of 0.3.

First claim

Opening claim text (preview).

What is claimed is: 1. A composition for bonding consisting of tin, iridium, germanium, nickel, optionally zinc, optionally oxygen, and an unavoidable component, wherein a contained amount of iridium is greater than or equal to 0.0005 mass % and less than or equal to 0.1 mass %; wherein a contained amount of germanium is less than or equal to 10 mass %, wherein a contained amount of nickel in mass % is greater than or equal to 0.1 mass % and less than or equal to a product of 2.8 multiplied by a term that is the contained amount of germanium in mass % to the power of 0.3, wherein, if zinc is present, a contained amount of zinc is greater than or equal to 0 mass % and less than or equal to 0.5 mass %, and wherein, if oxygen is present, a contained amount of oxygen is greater than or equal to 0.0001 mass % and less than or equal to 2 mass %. 2. The composition of claim 1 , wherein the contained amount of iridium is less than or equal to 0.025 mass %. 3. The composition of claim 1 , wherein the contained amount of germanium is greater than 0.5 mass %, wherein a sum of the contained amount of germanium and the contained amount of nickel is greater than 1.2 mass %, and wherein a value obtained by dividing the contained amount of nickel in mass % by the contained amount of germanium in mass % is less than 2.0. 4. A method of bonding a material to be bonded provided with a bonding portion containing an oxide, the method comprising contacting the material with the composition for bonding according to claim 1 . 5. The method of claim 4 , wherein the bonding portion of the material to be bonded contains at least one type of oxide selected from the group consisting of a glass, a chrome oxide, and an aluminum oxide. 6. The composition of claim 1 , wherein in a cross section of the composition, a number of circles in a region with an area of 1.0×10 6 μm 2 , each circle inscribing a eutectic substance at a minimum diameter that is greater than or equal to 220 μm, is less than or equal to two, or a number of circles in the region with an area of 1.0×10 6 μm 2 , each circle inscribing a eutectic substance at a minimum diameter that is greater than or equal to 350 μm, is less than or equal to one. 7. The composition of claim 1 , wherein the contained amount of iridium is greater than or equal to 0.001 mass %. 8. The composition of claim 1 , wherein the contained amount of iridium is less than or equal to 0.005 mass %. 9. The composition of claim 1 , wherein a total amount of Fe, Co, Cr, V, Mn, Sb, Pb, Bi, Zn, As and Cd is less than or equal to 500 ppm. 10. The composition of claim 9 , wherein the contained amount of germanium is greater than 0.5 mass %, wherein a sum of the contained amount of germanium and the contained amount of nickel is greater than 1.2 mass %, and wherein a value obtained by dividing the contained amount of nickel in mass % by the contained amount of germanium in mass % is less than 2.0. 11. The composition of claim 9 , which does not contain Ag. 12. The composition of claim 9 , wherein the contained amount of germanium is greater than 0.5 mass %, and wherein a sum of the contained amount of germanium and the contained amount of nickel is greater than 1.2 mass %. 13. The composition of claim 1 , wherein the contained amount of germanium is greater than 0.5 mass %, and wherein a sum of the contained amount of germanium and the contained amount of nickel is greater than 1.2 mass %. 14. The composition of claim 1 , which does not contain Ag. 15. The composition of claim 14 , wherein the contained amount of iridium is greater than or equal to 0.001 mass %. 16. The composition of claim 14 , wherein the contained amount of iridium is less than or equal to 0.005 mass %. 17. The composition of claim 14 , wherein the contained amount of germanium is greater than 0.5 mass %, wherein a sum of the contained amount of germanium and the contained amount of nickel is greater than 1.2 mass %.

Assignees

Inventors

Classifications

  • with the principal constituent melting at less than 400°C · CPC title

  • B23K35/262Primary

    Sn as the principal constituent · CPC title

  • C22C13/00Primary

    Alloys based on tin · CPC title

  • with the aid of intervening metal · CPC title

Patent family

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Frequently asked questions

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What does patent US10731233B2 cover?
A composition for bonding includes tin, germanium, and nickel. A contained amount of germanium is less than or equal to 10 mass %. A contained amount of nickel in mass % is less than or equal to a product of 2.8 multiplied by a term that is the contained amount of germanium in mass % to the power of 0.3.
Who is the assignee on this patent?
Agc Inc
What technology area does this patent fall under?
Primary CPC classification B23K35/262. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 04 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).