Three dimensional microstructures and fabrication process

Patent metadata

Field	Value
Publication number	US-10730748-B2
Application number	US-201715709568-A
Country	US
Kind code	B2
Filing date	Sep 20, 2017
Priority date	Dec 31, 2014
Publication date	Aug 4, 2020
Grant date	Aug 4, 2020

Abstract

A method for fabricating three-dimensional microstructures is presented. The method includes: disposing a substantially planar reflow material between two molds; heating the reflow material while the reflow material is disposed between the two molds; and reflowing the reflow material towards the bottom surface of one of the molds by creating a pressure gradient across the reflow material. At least one of molds includes geometrics features that help to shape the reflow material and thereby form a complex three-dimensional microstructure.

First claim

What is claimed is:

1. A method for fabricating three-dimensional microstructures, comprising:
placing a solid member into a recess of a first mold, wherein the recess is formed in a top surface of the first mold and defines a bottom surface and at least one side surface, such that the solid member is releasably supported by the first mold;
disposing a substantially planar reflow material on the first mold, such that the reflow material covers the recess and the solid member disposed in the recess, wherein the reflow material is the same material as a material comprising the solid member;
heating the reflow material while the reflow material is disposed on the first mold; and
creating a pressure gradient across the reflow material to reflow the reflow material towards and in contact with the solid member, whereby the reflow material bonds with the solid member to form a unitary three-dimensional microstructure.

2. The method of claim 1 further comprises controlling the pressure gradient across the reflow material independently from heating the reflow material.

3. The method claim 1 further comprises heating the reflow material using a heat source and creating a pressure gradient across the reflow material using a vacuum that differs from the heat source.

4. The method of claim 1 further comprises heating the reflow material above a glass transition temperature for a non-crystalline material or above melting temperature of the reflow material.

5. The method of claim 1 further comprises forming through holes in the bottom surface of the first mold and fluidly coupling the through holes to a pressure source.

6. The method of claim 1 further comprises detaching the unitary three-dimensional microstructure from the first mold after the step of creating a pressure gradient across the reflow material.

7. The method of claim 1 wherein dimensions of the unitary three-dimensional microstructure are less than one centimeter.

8. The method of claim 1 wherein the first mold further includes a dome protruding upward from the bottom surface of the recess, whereby the reflow material reflows around the dome and towards the bottom surface of the first mold, such that the reflow material decreases in thickness from top of the dome moving downwardly toward bottom of the dome.

9. The method of claim 8 wherein the dome is formed with a through hole at center of the dome and the solid member is defined as a rod disposed in the through hole of the dome.

10. The method of claim 1 wherein the reflow material is selected from a group consisting of fused silica, sapphire, ruby, silicon, glass and metal.

11. The method of claim 10 further comprises controlling the pressure gradient across the reflow material independently from heating the reflow material.

12. The method claim 10 further comprises heating the reflow material using a heat source and creating a pressure gradient across the reflow material using a vacuum that differs from the heat source.

13. The method of claim 10 further comprises heating the reflow material above a glass transition temperature for a non-crystalline material or above melting temperature of the reflow material.

14. The method of claim 10 further comprises forming through holes in the bottom surface of the first mold and fluidly coupling the through holes to a pressure source.

15. The method of claim 10 wherein dimensions of the unitary three-dimensional microstructure are less than one centimeter.

16. The method of claim 10 wherein the dome is formed with a through hole at center of the dome and the solid member is defined as a rod disposed in the through hole of the dome.

17. A method for fabricating three-dimensional microstructures, comprising:
providing a first mold having a recess formed in a top surface thereof wherein the recess defines a bottom surface and at least one side surface and a dome protrudes upwardly from the bottom surface of the recess;
placing a solid member into a recess of a first mold, such that the solid member is releasably supported by the first mold;
disposing a substantially planar reflow material on the top surface of the first mold, wherein the reflow material covers the recess and the solid member disposed in the recess;
heating the reflow material while the reflow material is disposed on the first mold;
creating a pressure gradient across the reflow material concurrently with heating the reflow material to thereby reflow the reflow material into contact with the solid member, whereby the reflow material bonds with the solid member to form a unitary three-dimensional microstructure; and
separating the unitary three-dimensional microstructure from the first mold after the step of creating a pressure gradient across the reflow material.

18. A method for fabricating a hemispherical resonator gyroscope, comprising:
providing a first mold having a recess formed in a top surface thereof wherein the recess defines a bottom surface and at least one side surface and a dome protrudes upwardly from the bottom surface of the recess;
placing a solid member into a recess of a first mold, such that the dome is formed with a through hole at center of the dome and the solid member is defined as a rod disposed in the through hole of the dome;
disposing a substantially planar reflow material on the top surface of the first mold, wherein the reflow material covers the recess and the solid member disposed in the recess;
heating the reflow material while the reflow material is disposed on the first mold;
creating a pressure gradient across the reflow material concurrently with heating the reflow material to thereby reflow the reflow material into contact with the solid member, whereby the reflow material bonds with the solid member to form a hemispherical resonator; and
separating the hemispherical resonator from the first mold after the step of creating a pressure gradient across the reflow material.

19. The method of claim 18 further comprises polishing the hemispherical resonator after the step of separating the hemispherical resonator from the first mold.

20. The method of claim 19 further comprises coating an exterior surface of the hemispherical resonator with a metal after the step of polishing the hemispherical resonator.

Assignees

• Univ Michigan Regents

Inventors

• Najafi Khalil
• Nagourney Tal
• Cho Jae Yoong

Classifications

• B81C1/0046

  using stamping, e.g. imprinting (nanoimprinting for making etch masks G03F7/0002) · CPC title

• C03B23/0352

  by suction or blowing out for providing the deformation force to bend the glass sheet · CPC title

• B22D23/06

  Melting-down metal, e.g. metal particles, in the mould · CPC title

• B81B2201/0271

  Resonators; ultrasonic resonators · CPC title

• C03B23/02

  Re-forming glass sheets · CPC title