Method for conditioning polishing pad and polishing apparatus

Patent metadata

Field	Value
Publication number	US-10730161-B2
Application number	US-201615760590-A
Country	US
Kind code	B2
Filing date	Aug 31, 2016
Priority date	Oct 1, 2015
Publication date	Aug 4, 2020
Grant date	Aug 4, 2020

Abstract

A method for conditioning a polishing pad, which is configured to polish a wafer and attached to a rotatable discoid turntable, by using a conditioning head, the method being characterized by: moving the conditioning head in a radial direction of the turntable to perform the conditioning while rotating the polishing pad attached to the turntable by rotation of the turntable; and controlling a rotational speed of the turntable and a moving speed of the conditioning head in the radial direction of the turntable in correspondence with a distance of the conditioning head from a center of the turntable. Consequently, the method for conditioning a polishing pad which enables appropriately conditioning an entire polishing surface of the polishing pad can be provided.

First claim

The invention claimed is:

1. A method for conditioning a polishing pad by which the polishing pad, which is configured to polish a wafer and attached to a rotatable discoid turntable, is conditioned by using a conditioning head, comprising:
moving the conditioning head in a radial direction of the turntable to perform the conditioning while rotating the polishing pad attached to the turntable by rotation of the turntable; and
controlling a rotational speed of the turntable and a moving speed of the conditioning head in the radial direction of the turntable in correspondence with a distance of the conditioning head from a center of the turntable,
wherein the rotational speed of the turntable and the moving speed of the conditioning head in the radial direction of the turntable are controlled in such a manner that the rotational speed of the turntable meets Expression (1) and a moving operation of the conditioning head in the radial direction of the turntable meets Expressions (2) and (3),
T ( r )= Tr 0 ×( r 0 /r )  (1)

V ( r )=( r 0 /r ) V 0   (2)

D÷Q=n   (3)

wherein “T(r)” represents the rotational speed (rpm) of the turntable when a distance of the conditioning head from the center of the turntable is “r”, “Tr 0 ” represents the rotational speed (rpm) of the turntable at the start of the conditioning, “r 0 ” represents a distance (m) of the conditioning head from the center of the turntable at the start of the conditioning, “r” represents a distance (m) of the conditioning head from the center of the turntable, “V(r)” represents a moving speed (m/sec) of the conditioning head in the radial direction of the turntable when a distance of the conditioning head from the center of the turntable is “r”, “V 0 ” represents a moving speed (m/sec) of the conditioning head in the radial direction of the turntable at the start of the conditioning, “D” represents a size (m) of the conditioning head in the radial direction of the turntable, “Q” represents a distance (m) for which the conditioning head radially moves on the turntable when the turntable makes one rotation, and “n” represents a positive integer.

2. A polishing apparatus comprising a conditioning head for conditioning a polishing pad which is configured to polish a wafer and attached to a rotatable discoid turntable,
wherein the conditioning head is moved in a radial direction of the turntable to perform the conditioning while rotating the polishing pad attached to the turntable by rotation of the turntable, and
the polishing apparatus comprises a control mechanism which controls a rotational speed of the turntable and a moving speed of the conditioning head in the radial direction of the turntable in correspondence with a distance of the conditioning head from a center of the turntable,
wherein the control mechanism controls the rotational speed of the turntable and the moving speed of the conditioning head in the radial direction of the turntable in such a manner that the rotational speed of the turntable meets Expression (1) and a moving operation of the conditioning head in the radial direction of the turntable meets Expressions (2) and (3),
T ( r )= Tr 0 ×( r 0 /r )  (1)

V ( r )=( r 0 /r ) V 0   (2)

D+Q=n   (3)

wherein “T(r)” represents the rotational speed (rpm) of the turntable when a distance of the conditioning head from the center of the turntable is “r”, “Tr 0 ” represents the rotational speed (rpm) of the turntable at the start of the conditioning, “r 0 ” represents a distance (m) of the conditioning head from the center of the turntable at the start of the conditioning, “r” represents a distance (m) of the conditioning head from the center of the turntable, “V(r)” represents a moving speed (m/sec) of the conditioning head in the radial direction of the turntable when a distance of the conditioning head from the center of the turntable is “r”, “V 0 ” represents a moving speed (m/sec) of the conditioning head in the radial direction of the turntable at the start of the conditioning, “D” represents a size (m) of the conditioning head in the radial direction of the turntable, “Q” represents a distance (m) for which the conditioning head radially moves on the turntable when the turntable makes one rotation, and “n” represents a positive integer.

Assignees

• Shinetsu Handotai Kk

Inventors

• Yasuda Taichi
• Sasaki Masanao
• Enomoto Tatsuo
• Sasaki Takuya
• Asai Kazumasa

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B53/00

  Devices or means for dressing or conditioning abrasive surfaces (compensation for grinding wheel abrasion resulting from dressing B24B47/25) · CPC title

• B24B37/107

  in a rotary movement only, about an axis being stationary during lapping · CPC title

• B24B37/08

  for double side lapping · CPC title