Hybrid metrology for patterned wafer characterization

Patent metadata

Field	Value
Publication number	US-10712145-B2
Application number	US-201715787789-A
Country	US
Kind code	B2
Filing date	Oct 19, 2017
Priority date	Oct 20, 2016
Publication date	Jul 14, 2020
Grant date	Jul 14, 2020

Abstract

Methods and systems for evaluating the geometric characteristics of patterned structures are presented. More specifically, geometric structures generated by one or multiple patterning processes are measured by two or more metrology systems in accordance with a hybrid metrology methodology. A measurement result from one metrology system is communicated to at least one other metrology systems to increase the measurement performance of the receiving system. Similarly, a measurement result from the receiving metrology system is communicated back to the sending metrology system to increase the measurement performance of the sending system. In this manner, measurement results obtained from each metrology system are improved based on measurement results received from other cooperating metrology systems. In some examples, metrology capability is expanded to measure parameters of interest that were previously unmeasurable by each metrology system operating independently. In other examples, measurement sensitivity is improved and parameter correlation is reduced.

First claim

What is claimed is:

1. A hybrid metrology system comprising:
a first metrology system configured to generate a first amount of measurement data associated with a first measurement site on a semiconductor wafer, wherein the first measurement site includes a patterned metrology target characterized by a plurality of geometric parameters;
a second metrology system different from the first metrology system, wherein the second metrology system generates a second amount of measurement data associated with a measurement of the first measurement site on the semiconductor wafer; and
a computing system configured to:
determine a value of a first geometric parameter associated with the patterned metrology target based on the first amount of measurement data;
determine a value of a second geometric parameter associated with the patterned metrology target based on the second amount of measurement data;
determine a value of a first parameter of interest based on the first amount of measurement data and the value of the second geometric parameter; and
determine a value of a second parameter of interest based on the second amount of measurement data and the value of the first geometric parameter; and
store the values of the first and second parameters of interest in a memory.

2. The hybrid metrology system of claim 1 , wherein the second metrology system is any of a scanning electron microscopy (SEM) system, a transmission electron microscopy (TEM) system, an atomic force microscopy (AFM) system, and an x-ray based metrology system.

3. The hybrid metrology system of claim 1 , further comprising:
a third metrology system different from the first metrology system and the second metrology system, wherein the third metrology system generates a third amount of measurement data associated with a measurement of the first measurement site on the semiconductor wafer, wherein the computing system is further configured to:
determine a value of a third geometric parameter associated with the patterned metrology target based on the third amount of measurement data, wherein the determining of the first parameter of interest is also based on the value of the third geometric parameter;
determine a value of a third parameter of interest based on the third amount of measurement data and the value of the first geometric parameter; and
store the value of the third parameter of interest in a memory.

4. The hybrid metrology system of claim 1 , wherein the determining of the value of the second geometric parameter occurs subsequent to the determining of the value of the first geometric parameter and is based at least in part on the value of the first geometric parameter.

5. The hybrid metrology system of claim 1 , wherein the determining of the value of a first parameter of interest occurs subsequent to the determining of the value of the second geometric parameter and is based at least in part on the value of the second geometric parameter.

6. The hybrid metrology system of claim 1 , wherein the computing system is further configured to reparameterize the first geometric parameter before the determining of the value of a second parameter of interest.

7. The hybrid metrology system of claim 1 , wherein the computing system is further configured to transform the value of the first geometric parameter before the determining of the value of the second parameter of interest.

8. The hybrid metrology system of claim 1 , wherein the
second metrology system generates a third amount of measurement data associated with a measurement of a second measurement site on the semiconductor wafer including an in-die metrology target, wherein the computing system is further configured to determine a value of a third parameter of interest based on the third amount of measurement data, and the values of the first and second geometric parameters.

9. A hybrid metrology system comprising:
a first metrology system configured to generate a first amount of measurement data associated with a first measurement site on a semiconductor wafer, wherein the first measurement site includes a patterned metrology target characterized by a plurality of geometric parameters; and
a second metrology system different from the first metrology system, wherein the second metrology system generates a second amount of measurement data associated with the first measurement site on the semiconductor wafer; and
a non-transitory, computer-readable medium, comprising instructions that, when executed by a computing system, cause the computing system to:
determine a value of a first geometric parameter associated with the patterned metrology target based on the first amount of measurement data;
determine a value of a second geometric parameter associated with the patterned metrology target based on the second amount of measurement data;
determine a value of a first parameter of interest based on the first amount of measurement data and the value of the second geometric parameter; and
determine a value of a second parameter of interest based on the second amount of measurement data and the value of the first geometric parameter.

10. The hybrid metrology system of claim 9 , wherein the first metrology system is an optical metrology system and the second metrology system is any of a scanning electron microscopy (SEM) system, a transmission electron microscopy (TEM) system, an atomic force microscopy (AFM) system, and an x-ray based metrology system.

11. The hybrid metrology system of claim 9 , further comprising:
a third metrology system different from the first and second metrology systems, wherein the third metrology system generates a third amount of measurement data associated with a measurement of the first measurement site on the semiconductor wafer, the non-transitory, computer-readable medium further comprising instructions that, when executed by the computing system, cause the computing system to:
determine a value of a third geometric parameter associated with the patterned metrology target based on the third amount of measurement data, wherein the determining of the first parameter of interest is also based on the value of the third geometric parameter;
determine a value of a third parameter of interest based on the third amount of measurement data and the value of the first geometric parameter.

12. The hybrid metrology system of claim 9 , wherein the determining of the value of the second geometric parameter occurs subsequent to the determining of the value of the first geometric parameter and is based at least in part on the value of the first geometric parameter.

13. The hybrid metrology system of claim 9 , wherein the determining of the value of a first parameter of interest occurs subsequent to the determining of the value of the second geometric parameter and is based at least in part on the value of the second geometric parameter.

14. The hybrid metrology system of claim 9 , wherein the computing system is further configured to reparameterize the first geometric parameter before the determining of the value of a second parameter of interest.

15. The hybrid metrology system of claim 9 , the non-transitory, computer-readable medium further comprising instructions that, when executed by the computing system, cause the computing system to transform the value of the first geometric parameter before the determining of the value of the second parameter of interest.

16. The hybrid metrology system of claim 9 , wherein the
second metrology system generates a third amount of measurement data associated with a measurement of a second measurement site on the se

Assignees

• Kla Tencor Corp

Inventors

• Chen Boxue
• Veldman Andrei
• Kuznetsov Alexander
• Shchegrov Andrei V

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• G01N23/2251

  using incident electron beams, e.g. scanning electron microscopy [SEM] · CPC title

• G01N23/201

  by measuring small-angle scattering · CPC title

• G01N21/956

  Inspecting patterns on the surface of objects {(contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)} · CPC title