Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10708480-B2
Application number	US-201816028367-A
Country	US
Kind code	B2
Filing date	Jul 5, 2018
Priority date	Aug 1, 2016
Publication date	Jul 7, 2020
Grant date	Jul 7, 2020

Abstract

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

First claim

What is claimed is:

1. A camera module, comprising:
at least one lens;
at least one circuit board;
at least one photosensitive element provided on said circuit board; and
at least one molded base which is integrally formed with said circuit board by a molding process, wherein said lens is installed on said molded base and said molded base forms at least one light window which provides a light path for said photosensitive element enabling a light entering said lens reaching said photosensitive element through said light window, wherein said molded base has an inner side surface and at least a portion of said inner side surface is inclinedly extended for facilitating demoulding in said molding process, wherein said at least one circuit board and said at least one molded base integrally form a molded circuit board assembly which comprises one or more lens actuator pin grooves defined by a pin groove wall, wherein said pin groove wall and a longitudinal line direction of an optical axis of said camera module define a fourth inclination angle having a range of 3° to 30° for facilitating demoulding.

2. The camera module, as recited in claim 1 , wherein said inner side surface of said molded base is integrally and inclinedly extended from said circuit board.

3. A camera module, comprising:
at least one lens;
at least one circuit board;
at least one photosensitive element provided on said circuit board; and
at least one molded base which is integrally formed with said circuit board by a molding process, wherein said lens is installed on said molded base and said molded base forms at least one light window which provides a light path for said photosensitive element enabling a light entering said lens reaching said photosensitive element through said light window, wherein said molded base has an inner side surface and at least a portion of said inner side surface is inclinedly extended for facilitating demoulding in said molding process, wherein said at least one molded base is integrally formed with said circuit board and said photosensitive element to form a molded photosensitive assembly, wherein said inner side surface of said at least one molded base is integrally extended to at least a portion of a non-photosensitive area portion of said photosensitive element, wherein the non-photosensitive area portion of said photosensitive element is formed on a top surface thereof, wherein said inner side surface is an inclined successive surface inclinedly extended from said non-photosensitive area portion of said top surface of said photosensitive element upwardly, wherein said inner side surface of said at least one molded base and a longitudinal line direction of an optical axis of said camera module define a first inclination angle for facilitating demoulding and avoiding stray lights, wherein a range of said first inclination angle α 10° to 80°.

4. The camera module, as recited in claim 3 , wherein said photosensitive element is electrically conducted with said circuit board by a set of lead wires, wherein when a wire bonding direction of said lead wires is from said photosensitive element to said circuit board, a range of said first inclination angle is 10 to 55°.

5. The camera module, as recited in claim 3 , wherein said photosensitive element is electrically conducted with said circuit board by a set of lead wires, wherein when a wire bonding direction of said lead wires is from said circuit board to said photosensitive element, a range of said first inclination angle is 10° to 88°.

6. The camera module, as recited in claim 3 , wherein molded base has an outer side surface which is linearly extended from said circuit board, wherein said outer side surface of said at least one molded base and said longitudinal line direction of said optical axis of said camera module define a second inclination angle for facilitating demoulding, wherein a range of said second inclination angle is 3° to 45°.

7. A camera module, comprising:
at least one lens;
at least one circuit board;
at least one photosensitive element provided on said circuit board; and
at least one molded base which is integrally formed with said circuit board by a molding process, wherein said lens is installed on said molded base and said molded base forms at least one light window which provides a light path for said photosensitive element enabling a light entering said lens reaching said photosensitive element through said light window, wherein said molded base has an inner side surface and at least a portion of said inner side surface is inclinedly extended for facilitating demoulding in said molding process, wherein said at least one molded base is integrally formed with said circuit board and said photosensitive element to form a molded photosensitive assembly, wherein said inner side surface of said at least one molded base is integrally extended to at least a portion of a non-photosensitive area portion of said photosensitive element, wherein said molded base has an outer side surface which is linearly extended from said circuit board, wherein said outer side surface of said at least one molded base and a longitudinal line direction of an optical axis of said camera module define a second inclination angle for facilitating demoulding, wherein a range of said second inclination angle is 3° to 45°.

8. A camera module, comprising:
at least one lens;
at least one circuit board;
at least one photosensitive element provided on said circuit board; and
at least one molded base which is integrally formed with said circuit board by a molding process, wherein said lens is installed on said molded base and said molded base forms at least one light window which provides a light path for said photosensitive element enabling a light entering said lens reaching said photosensitive element through said light window, wherein said molded base has an inner side surface and at least a portion of said inner side surface is inclinedly extended for facilitating demoulding in said molding process, wherein said at least one molded base is integrally formed with said circuit board and said photosensitive element to form a molded photosensitive assembly, wherein said inner side surface of said at least one molded base is integrally extended to at least a portion of a non-photosensitive area portion of said photosensitive element, wherein said molded base has a top end and a top groove is formed at said top end, wherein said non-photosensitive area portion of said photosensitive element is provided on a top surface thereof, wherein said inner side surface of said at least one molded base is a curved extending inner surface which comprises a first portion inner side surface, a second portion inner side surface and a third portion inner side surface which are successively and integrally extended, wherein said first portion inner side surface is integrally and inclinedly extended from said non-photosensitive area portion of said top surface of said photosensitive element, and said third portion inner side surface is integrally and inclinedly extended from said second portion inner side surface, wherein said second portion inner side surface and said third portion inner side surface define said top groove, wherein said first portion inner side surface of said molded base and a longitudinal line direction of an optical axis of said camera module define a first inclination angle for facilitating demoulding and avoiding stray lights, wherein a range of said first inclination angle is 10° to 80°, wherein said third portion inner side surface of said molded base and said longitudinal line direction of said optical axis of said camera module define a second inclination angle for facilitating demoulding and avoiding stray lights, wherein a range

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Chen Zhenyu
• Guo Nan
• Tanaka Takehiko
• Zhao Bojie
• Deng Zilong

Classifications

• B29C45/14655 Primary

  connected to or mounted on a carrier, e.g. lead frame · CPC title

• H04N23/54 Primary

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/57 Primary

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H10F39/806

  Optical elements or arrangements associated with the image sensors · CPC title