Camera module and molded circuit board assembly and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9998644-B1
Application number	US-201715460227-A
Country	US
Kind code	B1
Filing date	Mar 15, 2017
Priority date	Aug 1, 2016
Publication date	Jun 12, 2018
Grant date	Jun 12, 2018

Abstract

A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demolding, so as to prevent damage to the molded base, and to avoid stray light.

First claim

What is claimed is:

1. A camera module, comprising:
at least one lens,
at least one photosensitive element having a photosensitive area portion and a non-photosensitive area portion surrounding said photosensitive area portion, and
at least one molded circuit board assembly, comprising;
at least one circuit board comprising one or more electronic components thereon, wherein said photosensitive element is positioned on said circuit board and electrically connected with said circuit board through one or more connecting elements;
at least one molded base comprising an annular molding body being molded to integrally form with said circuit board through a molding process and having at least one light window formed therein to provide a light path for said photosensitive element and said lens installed on said molded base, wherein said molding body of said molded base has an annular inner side surface which is integrally extended from said circuit board to define said light window positioned between said lens and said photosensitive element such that a light passing through said lens is able to reach the photosensitive element via said light window, wherein at least one portion of said inner side surface is inclinedly extended upwardly and outwardly from said circuit board, wherein said inner side surface of said molding body of said molded base and an optical axis line direction of said camera module define an inclination angle α having an angle range of 3° to 30° for facilitating demoulding in said molding process and avoiding stray light, wherein said molding body of said molded base has an annular outer side surface inclinedly extended upwardly and inwardly from said circuit board, wherein said outer side surface of said molding body of said molded base and said optical axis line direction of said camera module define an inclination angle γ having an angle range of 3° to 45° for facilitating demoulding in said molding process, wherein said molding body of said molded base is integrally molded to embed and enclose said electronic components therein so as to prevent said electronic components being exposed to outside and being contaminated and polluted while a thickness of said molded base is reduced by eliminating the need of providing any additional lens holder to be adhered to said circuit board and the receiving space of such lens holder for said electronic components;
at least an optical filter holder, having a ring shape, supported on top of said molding body of said molded base; and
at least one optical filter mounted on said optical filter holder and positioned above said light window and at least said photosensitive area portion of said photosensitive element to filter said light passing through said lens before reaching said photosensitive element via said light window.

2. The camera module, as recited in claim 1 , wherein a top surface of said molding body of said molded base is a flat surface parallel to said photosensitive area portion of said photosensitive element and said lens and said optical filter are mounted on top of said molding body of said molded base of said molded circuit board assembly.

3. The camera module, as recited in claim 1 , wherein said molded base has a top end and a top groove formed in said top end of said molded base, wherein said inner side surface of said molded base has a first portion inner side surface, a second portion inner side surface and a third portion inner side surface which are successively and integrally extended upwardly and outwardly, wherein said first portion inner side surface is integrally and inclinedly extended from said circuit board, said second portion inner side surface is a horizontal surface extended outwardly between said first and third inner side surfaces, and said third portion inner side surface is integrally and inclinedly extended upwardly and outwardly from said second portion inner side surface, wherein said second portion inner side surface and said third portion inner side surface define said top groove, wherein said optical filter holder is mounted in said top groove so that a thickness of said molded circuit board assembly is further reduced while said optical filter holder is mounted in said top groove and said optical filter is mounted on said optical filter holder without protruding from said molding body of said molded base.

4. The camera module, as recited in claim 3 , wherein said first portion inner side surface of said molded base and an optical axis line direction of said camera module define said inclination angle α having said angle range of 3° to 30° for facilitating said demoulding process, wherein said third portion inner side surface of said molded base and said optical axis line direction of said camera module define an inclination angle β having an angle range of 3° to 30°.

5. The camera module, as recited in claim 1 , wherein said circuit board comprises a base board, wherein at an outer side of at least one outer peripheral surface of said outer side surface of said molding body of said molded base, said base board of said circuit board has a press-fit distance W, wherein a numerical value range of said press-fit distance W is 0.1 to 0.6 mm.

6. The camera module, as recited in claim 4 , wherein said circuit board comprises a base board, wherein at an outer side of at least one outer peripheral surface of said outer side surface of said molding body of said molded base, said base board of said circuit board has a press-fit distance W, wherein a numerical value range of said press-fit distance W is 0.1 to 0.6 mm.

7. The camera module, as recited in claim 1 , wherein a material surface reflectivity of said molded base is less than 5% in a wavelength range of 435 nm to 660 nm.

8. The camera module, as recited in claim 4 , wherein a material surface reflectivity of said molded base is less than 5% in a wavelength range of 435 nm to 660 nm.

9. The camera module, as recited in claim 1 , wherein said molded base further comprises an annular blocking element which is provided on said circuit board and positioned between said circuit board and said molding body.

10. The camera module, as recited in claim 4 , wherein said molded base further comprises an annular blocking element which is provided on said circuit board and positioned between said circuit board and said molding body.

11. The camera module, as recited in claim 4 , wherein said inclination angle α is 3°, said inclination angle γ is 3° and said inclination angle β is 3°, wherein a distance L 1 between an edge of said photosensitive element and a connecting position of said first portion inner side surface of said molding body of said molded base is 0.25 mm, wherein a distance L 2 between a connecting position of said first portion inner side surface and said circuit board and a connecting position of said second portion inner side surface and said third portion inner side surface is 0.21 mm, wherein a distance L 3 between a connecting position of said second portion inner side surface and said third portion inner side surface and a connecting position of said outer side surface of said molding body of said molded base and said circuit board is 1.25 mm, wherein a length L 4 of a top side surface of said molding body of said molded base is 1.18 mm, wherein a distance H 1 from said second portion inner side surface to a top surface of said circuit board is 0.29 mm, wherein a distance from said top side surface of said molding body of said molded base to said top surface of said circuit board is 0.78 mm.

12. The camera module, as recited in claim 4 , wherein said inclination angle α is 15°, said inclination angle γ is 15° and said inclination angle

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Chen Zhenyu
• Guo Nan
• Tanaka Takehiko
• Zhao Bojie
• Deng Zilong

Classifications

• H05K3/284 Primary

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/54 Primary

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title