Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10051167-B2
Application number	US-201715439909-A
Country	US
Kind code	B2
Filing date	Feb 22, 2017
Priority date	Aug 1, 2016
Publication date	Aug 14, 2018
Grant date	Aug 14, 2018

Abstract

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demolding and avoiding stray lights.

First claim

What is claimed is:

1. A camera module, comprising:
at least one lens;
at least one circuit board;
at least one photosensitive element provided on said circuit board; and
at least one molded base which is integrally formed with said circuit board by a molding process, wherein said lens is installed on said molded base and said molded base forms at least one light window which provides a light path for said photosensitive element enabling a light entering said lens reaching said photosensitive element through said light window, wherein said at least one molded base has an inner side surface and at least a portion of said inner side surface is inclinedly extended for facilitating demoulding in said molding process, wherein said at least one circuit board and said at least one molded base integrally form a molded circuit board assembly, wherein said inner side surface of said at least one molded base is integrally and inclinedly extended from said at least one circuit board, wherein said molded circuit board assembly further comprises one or more lens actuator pin grooves, wherein a pin groove wall defining each of said lens actuator pin grooves and a longitudinal line direction of an optical axis of said camera module define a fourth inclination angle for facilitating demoulding, wherein a range of said fourth inclination angle is 3° to 30°.

2. The camera module, as recited in claim 1 , wherein said inner side surface of said at least one molded base is a linearly surface extended from said at least one circuit board, wherein said first inclination angle defined between said inner side surface of said at least one molded base and said longitudinal line direction of said optical axis of said camera module is adapted for avoiding stray lights.

3. The camera module, as recited in claim 2 , wherein said at least one molded base has an outer side surface which is linearly and inclinedly extended from said at least one circuit board, wherein said outer side surface of said at least one molded base and said longitudinal line direction of said optical axis of said camera module define a second inclination angle for facilitating demoulding, wherein a range of said second inclination angle is 3° to 45°.

4. The camera module, as recited in claim 2 , wherein said at least one circuit board comprises a base board and a set of electronic components, wherein said at least one molded base is molded to cover said electronic components.

5. The camera module, as recited in claim 1 , wherein said at least one molded base has an outer side surface which is linearly and inclinedly extended from said at least one circuit board, wherein said outer side surface of said at least one molded base and said longitudinal line direction of said optical axis of said camera module define a second inclination angle for facilitating demoulding, wherein a range of said second inclination angle is 3° to 45°.

6. The camera module, as recited in claim 1 , wherein said at least one molded base has a top end and a top groove formed in said top end, wherein said inner side surface of said at least one molded base is a curved surface having a first portion inner side surface, a second portion inner side surface and a third portion inner side surface which are successively and integrally extended, wherein said first portion inner side surface is integrally and inclinedly extended from said at least one circuit board, and said third portion inner side surface is integrally and inclinedly extended from said second portion inner side surface, wherein said second portion inner side surface and said third portion inner side surface define said top groove.

7. The camera module, as recited in claim 6 , wherein said first portion inner side surface of said molded base and said longitudinal line direction of said optical axis of said camera module define a first inclination angle for facilitating demoulding and avoiding stray lights, wherein a range of said first inclination angle is 3° to 30°, wherein said third portion inner side surface of said molded base and said optical axis line direction of said camera module define a third inclination angle for facilitating demoulding and avoiding stray lights, wherein a range of said third inclination angle is 3° to 30°.

8. The camera module, as recited in claim 7 , wherein said at least one molded base has an outer side surface which is linearly and inclinedly extended from said at least one circuit board, wherein said outer side surface of said at least one molded base comprises a plurality of outer peripheral surfaces arranged along an outer peripheral direction of said at least one molded base, wherein at least one of said outer side surfaces of said at least one molded base and said longitudinal line direction of said optical axis of said camera module define a second inclination angle for facilitating demoulding, wherein a range of said second inclination angle is 3° to 45°.

9. The camera module, as recited in claim 8 , wherein said at least one circuit board comprises a base board and a set of electronic components, wherein said at least one molded base is molded to cover said electronic components.

10. The camera module, as recited in claim 9 , wherein a material surface reflectivity of said at least one molded base is less than 5% in said wavelength range of 435-660 nm.

11. The camera module, as recited in claim 8 , wherein said at least one circuit board comprise a base board, wherein at an outer side of at least one outer peripheral surface of said outer side surface of said at least one molded base, said base board of said at least one circuit board has a press-fit distance, having a numerical value range 0.1-10 mm, adapted to press-fit by at least one dividing block of a molding mould in said molding process.

12. The camera module, as recited in claim 11 , wherein a material surface reflectivity of said at least one molded base is less than 5% in said wavelength range of 435-660 nm.

13. The camera module, as recited in claim 7 , wherein said at least one circuit board comprises a base board and a set of electronic components, wherein said at least one molded base is molded to cover said electronic components.

14. The camera module, as recited in claim 6 , wherein said at least one circuit board comprises a base board and a set of electronic components, wherein said at least one molded base is molded to cover said electronic components.

15. The camera module, as recited in claim 1 , wherein said at least one circuit board comprises a base board and a set of electronic components, wherein said at least one molded base is molded to cover said electronic components.

16. The camera module, as recited in claim 1 , wherein a material surface reflectivity of said at least one molded base is less than 5% in said wavelength range of 435-660 nm.

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Chen Zhenyu
• Guo Nan
• Tanaka Takehiko
• Zhao Bojie
• Deng Zilong

Classifications

• H04N23/57 Primary

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• B29C45/14655 Primary

  connected to or mounted on a carrier, e.g. lead frame · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/54 Primary

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• G02B19/0076

  for use with a detector (G02B19/009, G02B19/0095 take precedence) · CPC title