Probe assembly and method for contactless electrical characterization of buried conducting layers
US-2015022223-A1 · Jan 22, 2015 · US
US10705122B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10705122-B2 |
| Application number | US-201716091445-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 21, 2017 |
| Priority date | Apr 8, 2016 |
| Publication date | Jul 7, 2020 |
| Grant date | Jul 7, 2020 |
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Official abstract text for this publication.
Provided is a probe card with which the adjustment of height deviations of needle tip parts of probes and the adjustment of parallelism between the probes and an object to be inspected are simplified. The probe card 1 has: a wiring substrate 2 having wiring 4 therein or on a surface thereof or the like; a plurality of probes 3 ; and a dielectric film 6 . The dielectric film 6 is disposed to be spaced a distance away from a main surface 8 of the wiring substrate 2 at a position spaced away further from the wiring substrate 2 than the needle tip parts 13 of the probes 3 , so that one surface 21 of the dielectric film 6 faces the needle tip parts 13 and faces the main surface 8 that is a probe installation surface of the wiring substrate 2 . The probe card 1 configures a state in which the needle tip parts 13 face an electrode of an object to be inspected with the dielectric film 6 interposed between the probe card 1 and the needle tip parts 13 , during an inspection of the object to be inspected. An inspection signal supplied from an inspection device to the probes 3 is set as an alternating current signal, and the probe card 1 causes capacitive coupling between the needle tip parts 13 and the electrode of the object to be inspected, and transmits the inspection signal.
Opening claim text (preview).
The invention claimed is: 1. A probe card used for testing an object to be inspected having an electrode and for transmitting and receiving an inspection signal to and from the electrode, the probe card comprising: a wiring substrate having wiring; at least one probe having a needle tip part at one end portion and being attached to a main surface of the wiring substrate at the other end portion, the needle tip part being disposed to be spaced a distance away from the main surface of the wiring substrate; and a dielectric film disposed to be spaced a distance away from the main surface of the wiring substrate at a position spaced away further from the wiring substrate than the needle tip part, so as to face the main surface of the wiring substrate and also to face the needle tip part, wherein the needle tip part is disposed so as to face the electrode in a state with the dielectric film interposed between the needle tip part and the electrode, and transmits and receives the inspection signal to and from the electrode, in the state with the dielectric film interposed. 2. The probe card according to claim 1 , wherein the state with the dielectric film interposed is a state where the electrode is in contact with the dielectric film, while the needle tip part is in contact with the dielectric film at a position where the needle tip part faces the electrode. 3. The probe card according to claim 1 , wherein the needle tip part is capacitively coupled with the electrode in the state with the dielectric film interposed between the needle tip part and electrode, thereby transmitting and receiving the inspection signal to and from the electrode. 4. The probe card according to claim 1 , wherein the dielectric film is supported to the wiring substrate so that the distance from the wiring substrate is changeable. 5. The probe card according to claim 1 , wherein at least a part of a peripheral portion of the dielectric film is supported by a supporting member, and the supporting member is attached to the wiring substrate so that the distance between the wiring substrate and the dielectric film is changeable. 6. The probe card according to claim 1 , wherein the dielectric film is configured with a flexible member. 7. The probe card according to claim 2 , wherein the dielectric film is configured with a flexible member. 8. The probe card according to claim 1 , wherein the dielectric film is made of at least one of a paper material and a resin material. 9. The probe card according to claim 6 , wherein the dielectric film is made of at least one of a paper material and a resin material. 10. The probe card according to claim 1 , wherein the probe is a cantilever type probe or a vertical type probe.
Non contact-making probes · CPC title
arranged on a flexible frame or film · CPC title
High frequency probes · CPC title
with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card · CPC title
Contactless testing {(G01R31/66 takes precedence)} · CPC title
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