Surface-treated copper foil

Patent metadata

Field	Value
Publication number	US-10697082-B1
Application number	US-201916538070-A
Country	US
Kind code	B1
Filing date	Aug 12, 2019
Priority date	Aug 12, 2019
Publication date	Jun 30, 2020
Grant date	Jun 30, 2020

Abstract

The present disclosure relates to an improved, surface-treated copper foil that is resistant to rusting and discoloration. More specifically, the surface-treated copper foil is chromium-free and includes: (a) a copper foil; optionally, (b) a barrier layer on one or both sides of the copper foil, the barrier layer comprising Ni, Zn, Co, Mn, Sn or a mixture thereof; and (c) an organic layer coupled to the one or both sides of the copper foil or one or both barrier layer(s), wherein the sum total of the N, S, and Si elements of the organic layer is more than 5 normalized atomic %.

First claim

The invention claimed is:

1. A chromium-free surface-treated copper foil comprising:
(a) a copper foil; and
(c) an organic layer disposed on the copper foil, wherein the sum total of the N, S, and Si elements of the organic layer is more than 5 normalized atomic %, the normalized atomic % is the calculation using the sum of analyzed C, O, N, S, Si atomic % as the denominator and the analyzed N, S, Si atomic % as the numerator, wherein 59.8>C>36.1 normalized atomic % and 48.7>O>27 normalized atomic %.

2. The chromium-free surface-treated copper foil of claim 1 further comprising (b) a barrier layer between (a) the copper foil and (c) the organic layer, the barrier layer comprising Ni, Zn, Co, Mn, Sn or a mixture thereof.

3. The chromium-free surface-treated copper foil of claim 1 , wherein the copper foil of (a) has nodules on one or both sides of the copper foil.

4. The chromium-free surface-treated copper foil of claim 1 , wherein the copper foil of (a) has a thickness of 1 to 50 μm.

5. The chromium-free surface-treated copper foil of claim 2 , wherein the barrier layer has a thickness of 0.2 to 100 μm.

6. The chromium-free surface-treated copper foil of claim 2 , wherein the copper foil of (a) has nodules on one or both sides of the copper foil.

7. The chromium-free surface-treated copper foil of claim 2 further comprising a second barrier layer and a second organic layer, wherein the barrier layers are disposed on both sides of the copper foil and the organic layers are disposed on the barrier layer.

8. The chromium-free surface-treated copper foil of claim 2 , wherein the organic layer of (c) comprises one or more organic molecules comprising a thermally stable base bearing one or more binding groups configured to bind the barrier layer of (b).

9. The chromium-free surface-treated copper foil of claim 8 , wherein the one or more organic molecules further comprises one or more attachment groups configured to attach to a resin.

10. The chromium-free surface-treated copper foil of claim 8 , wherein the one or more organic molecules is selected from the group consisting of a porphyrin group, a silane group, benzotriazole, triazine trithiol, and a combination thereof.

11. The chromium-free surface-treated copper foil of claim 10 , wherein the one or more organic molecules is selected from the porphyrin group consisting of a porphyrin, a porphyrinic macrocycle, an expanded porphyrin, a contracted porphyrin, a linear porphyrin polymer, a porphyrinic sandwich coordination complex, a porphyrin array and a combination thereof.

12. The chromium-free surface-treated copper foil of claim 10 , wherein the silane group is a tetraorgano-silane.

13. The chromium-free surface-treated copper foil of claim 12 , wherein the tetraorgano-silane is selected from a aminoethyl-aminopropyl-trimethoxysilane, (3-Aminopropyl)trimethoxysilane, (1-[3-(Trimethoxysilyl)propyl]urea), (3-Aminopropyl)triethoxysilane, ((3-Glycidyloxypropyl)trimethoxysilane), (3-Chloropropyl)trimethoxysilane, (3-Glycidyloxypropyl)trimethoxysilane, Dimethyldichlorosilane, 3-(Trimethoxysilyl)propyl methacrylate, Ethyltriacetoxysilane, Triethoxy(isobutyl)silane, Triethoxy(octyl)silane, Tris(2-methoxyethoxy)(vinyl)silane, Chlorotrimethylsilane, Methyltrichlorosilane, Silicon tetrachloride, Tetraethoxysilane, Phenyltrimethoxysilane, Chlorotriethoxysilane, ethylene-trimethoxysilane, and a combination thereof.

14. The chromium-free surface-treated copper foil of claim 8 , wherein the one or more organic molecules is selected from the group consisting of an alkoxysilane having 1 to 20 carbons, a vinylalkoxy silane having 1 to 20 carbons, (meth)acryl silane, and mixtures thereof.

15. The chromium-free surface-treated copper foil of claim 1 , wherein the organic layer of (c) comprises not more than 40 normalized atomic % of O element, based on the total weight of the organic layer.

16. The chromium-free surface-treated copper foil of claim 2 , wherein a weight ratio of Zn to Ni is between 0.8 to 8.

17. The chromium-free surface-treated copper foil of claim 2 , wherein the copper foil of (a) does not comprise nodules and has a deposited-side surface roughness (Rz) of 0.5 to 2.5 μm.

18. The chromium-free surface-treated copper foil of claim 1 having a deterioration rate represented by a change in peel strength represented by the formula:

Deterioration
⁢

⁢
rate
⁢

⁢

(
%
)

=

Normal
⁢

⁢
peel
⁢

⁢
strength

-

Peel
⁢

⁢
strength
⁢

⁢
after
⁢

⁢
moisture
⁢

⁢
absorption

Normal
⁢

⁢
peel
⁢

⁢
strength

*
100
⁢
%

below 20%.

19. The chromium-free surface-treated copper foil of claim 2 having a deterioration rate represented by a change in peel strength represented by the formula:

Deterioration
⁢

⁢
rate
⁢

⁢

(
%
)

=

Assignees

• Chang Chun Petrochemical Co Ltd

Inventors

• Huang Huei-Fang
• Cheng Kuei-Sen
• Chou Jui-Chang

Classifications

• H05K3/384

  by plating · CPC title

• C25D7/0614

  Strips or foils · CPC title

• C25D3/38

  of copper · CPC title

• C09D5/08

  Anti-corrosive paints · CPC title

• Y02E60/10

  Energy storage using batteries · CPC title