Solenoid structure with conductive pillar technology

Patent metadata

Field	Value
Publication number	US-10693432-B2
Application number	US-201815982655-A
Country	US
Kind code	B2
Filing date	May 17, 2018
Priority date	May 17, 2018
Publication date	Jun 23, 2020
Grant date	Jun 23, 2020

Abstract

A three-dimensional (3D) solenoid structure includes a first inductor portion having a first surface and a second surface opposite the first surface. The 3D solenoid structure further includes a first capacitor portion, a first inductor pillar, at least one capacitor pillar, a second inductor portion, a second inductor pillar and a first inductor bonding interface. The first inductor pillar is coupled to the first surface of the first inductor portion. The capacitor pillar(s) is coupled to the first capacitor portion. The second inductor portion includes a first surface and a second surface opposite the first surface. The second inductor pillar is coupled to the first surface of the second inductor portion. The first inductor bonding interface, between the first inductor pillar and the second inductor pillar, couples together the first inductor portion and the second inductor portion.

First claim

What is claimed is:

1. A three-dimensional solenoid structure, comprising:
a first inductor portion including a first surface and a second surface opposite the first surface;
a first capacitor portion;
a first inductor pillar coupled to the first surface of the first inductor portion, the first inductor pillar having a first bonding material at an end away from the first surface;
at least one capacitor pillar coupled to the first capacitor portion;
a second inductor portion including a third surface and a fourth surface opposite the third surface;
a second inductor pillar coupled to the third surface of the second inductor portion, the second inductor pillar having a second bonding material at an end near the first bonding material; and
a first inductor bonding interface between the first inductor pillar and the second inductor pillar to couple the first inductor portion and the second inductor portion, the first inductor bonding interface comprising the first bonding material and the second bonding material.

2. The three-dimensional solenoid structure of claim 1 , further comprising a molding compound in between the first inductor portion and the second inductor portion.

3. The three-dimensional solenoid structure of claim 2 , in which the molding compound comprises epoxy molding compound or capillary underfill material.

4. The three-dimensional solenoid structure of claim 1 , further comprising a glass substrate, in which the second surface of the first inductor portion is on the glass substrate and the first capacitor portion is on the glass substrate.

5. The three-dimensional solenoid structure of claim 1 , in which the first capacitor portion comprises a metal-insulator-metal (MIM) capacitor.

6. The three-dimensional solenoid structure of claim 1 , further comprising a second capacitor portion, at least one capacitor pillar coupled to the second capacitor portion, the first capacitor portion is opposite to the second capacitor portion.

7. The three-dimensional solenoid structure of claim 6 , further comprising a capacitor bonding interface between the at least one capacitor pillar coupled to the first capacitor portion and the at least one capacitor pillar coupled to the second capacitor portion to couple the first capacitor portion and the second capacitor portion.

8. The three-dimensional solenoid structure of claim 1 , further comprising:
a third inductor pillar coupled to the first surface of the first inductor portion;
a fourth inductor pillar coupled to the third surface of the second inductor portion; and
a second inductor bonding interface between the third inductor pillar and the fourth inductor pillar to couple the first inductor portion and the second inductor portion.

9. A method of fabricating a three-dimensional solenoid structure comprising:
fabricating a first inductor portion including a first surface and a second surface opposite the first surface;
fabricating a first capacitor portion;
fabricating a first inductor pillar on the first surface of the first inductor portion, the first inductor pillar having a first bonding material at an end away from the first surface;
fabricating at least one capacitor pillar on the first capacitor portion;
fabricating a second inductor portion including a third surface and a fourth surface opposite the third surface;
fabricating a second inductor pillar on the third surface of the second inductor portion, the second inductor pillar having a second bonding material at an end near the first bonding material; and
bonding the first inductor pillar to the second inductor pillar with the first bonding material and the second bonding material to couple the first inductor portion and the second inductor portion.

10. The method of claim 9 , further comprising depositing a molding compound between the first inductor portion and the second inductor portion.

11. The method of claim 9 , further comprising fabricating a glass substrate, in which the second surface of the first inductor portion is on the glass substrate and the first capacitor portion is on the glass substrate.

12. The method of claim 9 , further comprising fabricating a second capacitor portion, at least one capacitor pillar coupled to the second capacitor portion, the first capacitor portion is opposite to the second capacitor portion.

13. The method of claim 12 , further comprising fabricating a capacitor bonding interface between the at least one capacitor pillar coupled to the first capacitor portion and the at least one capacitor pillar coupled to the second capacitor portion to couple the first capacitor portion and the second capacitor portion.

14. The three-dimensional solenoid structure of claim 9 , further comprising:
fabricating a third inductor pillar coupled to the first surface of the first inductor portion;
fabricating a fourth inductor pillar coupled to the third surface of the second inductor portion; and
bonding the third inductor pillar to the fourth inductor pillar to couple the first inductor portion and the second inductor portion.

15. A three-dimensional solenoid structure, comprising:
a first inductor portion including a first surface and a second surface opposite the first surface;
a first capacitor portion;
a first inductor pillar coupled to the first surface of the first inductor portion, the first inductor pillar having a first bonding material at an end away from the first surface;
at least one capacitor pillar coupled to the first capacitor portion;
a second inductor portion including a third surface and a fourth surface opposite the third surface;
a second inductor pillar coupled to the third surface of the second inductor portion, the second inductor pillar having a second bonding material at an end near the first bonding material; and
means for bonding the first bonding material and the second bonding material to couple the first inductor portion and the second inductor portion.

16. The three-dimensional solenoid structure of claim 15 , further comprising a molding compound between the first inductor portion and the second inductor portion.

17. The three-dimensional solenoid structure of claim 16 , in which the molding compound comprises epoxy molding compound or capillary underfill material.

18. The three-dimensional solenoid structure of claim 15 , further comprising a glass substrate on which the second surface of the first inductor portion and the first capacitor portion the glass substrate reside.

19. The three-dimensional solenoid structure of claim 15 , in which the first capacitor portion comprises a metal-insulator-metal (MIM) capacitor.

20. The three-dimensional solenoid structure of claim 15 , further comprising a second capacitor portion, at least one capacitor pillar coupled to the second capacitor portion, the first capacitor portion is opposite to the second capacitor portion.

Assignees

• Qualcomm Inc
• Qualcommm Incorporated

Inventors

• Park Nosun
• Yun Changhan Hobie
• Kim Jonghae
• Mudakatte Niranjan Sunil
• Yu Xiaoju
• Chen Wei-Chuan

Classifications

• H10W72/072

  of bump connectors · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10W90/728

  between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors · CPC title