3D pillar inductor

Patent metadata

Field	Value
Publication number	US-9368564-B2
Application number	US-201414229317-A
Country	US
Kind code	B2
Filing date	Mar 28, 2014
Priority date	Mar 28, 2014
Publication date	Jun 14, 2016
Grant date	Jun 14, 2016

Abstract

Base pads are spaced by a pitch on a support surface. Conducting members, optionally Cu or other metal pillars, extend up from the base pads to top pads. A top pad interconnector connects the top pads in a configuration establishing an inductor current path between the base pads.

First claim

What is claimed is:

1. A three-dimensional (3D) inductor, comprising:
a first base pad and a second base pad, spaced by a pitch, arranged on a given base pad support surface;
a first conducting member having a base aligned with and coupled to the first base pad, and having a top at a height above the first base pad;
a second conducting member having a base aligned with and coupled to the second base pad, and a top at the height above the second base pad;
a first top pad arranged on a given top pad support surface above and facing the given base pad support surface, aligned with the first base pad and coupled to the top of the first conducting member;
a second top pad on the given top pad support surface, aligned with the second base pad and coupled to the top of the second conducting member; and
a top pad interconnector aligned with a linear axis on the given top pad support surface, the top pad interconnector coupling the first top pad to the second top pad;
wherein the height and the pitch of the first conducting member and the second conducting member are configured wherein a meander current path establishes an inductor approximating a meander inductor having two arms with an arm length corresponding to the height and an arm spacing corresponding to the pitch, having the first base pad as a first terminal and the second base pad as a second terminal.

2. The 3D inductor of claim 1 , wherein the first conducting member, the first top pad, the top pad interconnector, the second top pad and the second conducting member establish the meander current path, from the first base pad to the second base pad, within a plan normal to the given base pad support surface.

3. The 3D inductor of claim 1 , wherein the first conducting member is a metal first pillar and the second conducting member is a metal second pillar.

4. The 3D inductor of claim 3 , wherein the metal first pillar is a first copper (Cu) pillar and the metal second pillar is a second Cu pillar.

5. The 3D inductor of claim 1 , wherein the first conducting member is a first solder ball, having a base that is solder bonded to the first base pad, and a top that is solder bonded to the first top pad, and the second conducting member is a second solder ball, having a base that is solder bonded to the second base pad, and a top that is solder bonded to the second top pad.

6. A three-dimensional (3D) inductor, comprising:
a first base pad and a second base pad, spaced by a pitch, arranged on a given base pad support surface;
a first conducting member having a base aligned with and coupled to the first base pad, and having a top at a height above the first base pad;
a second conducting member having a base aligned with and coupled to the second base pad, and a top at the height above the second base pad;
a first top pad arranged on a given top pad support surface above and facing the given base pad support surface, aligned with the first base pad and coupled to the top of the first conducting member;
a second top pad on the given top pad support surface, aligned with the second base pad and coupled to the top of the second conducting member; and
a first top pad interconnector aligned with a linear axis on the given top pad support surface, the top pad interconnector coupling the first top pad to the second top pad;
a third base pad and a fourth base pad on the given base pad support surface, the first base pad, the second base pad, the third base pad and the fourth base pad aligned along a linear axis and spaced from one another by the pitch;
a base pad interconnector on the given base pad support surface coupling the first base pad and the second base pad;
a third conducting member, aligned with and coupled to the third base pad, and a fourth conducting member aligned with and coupled to the fourth base pad, the third conducting member and the fourth conducting member having the height;
a third top pad on the given top pad support surface, aligned with and coupled to a top of the third conducting member, and a fourth top pad on the given top pad support surface, aligned with and coupled to a top of the fourth conducting member; and
a second top pad interconnector on the given top pad support surface, coupling the third top pad to the fourth top pad.

7. The 3D inductor of claim 6 , wherein the first conducting member, the first top pad, the first top pad interconnector, the second conducting member, the second base pad, the base pad interconnector, the third base pad, the third conducting member, the third top pad, the second top pad interconnector, the fourth top pad, and the fourth conducting member establish a meander current path, from the first base pad to the fourth base pad, within a reference plane normal to a plane of the given base pad support surface.

8. The 3D inductor of claim 7 , wherein the height and the pitch of the first conducting member, the second conducting member, the third conducting member and the fourth conducting member are configured wherein the meander current path establishes an inductor approximating a meander inductor having four arms with an arm length corresponding to the height and an arm spacing corresponding to the pitch.

9. The 3D inductor of claim 8 , wherein the first conducting member is a metal first pillar, the second conducting member is a metal second pillar, the third conducting member is a metal third pillar, and the fourth conducting member is a metal fourth pillar.

10. The 3D inductor of claim 9 , wherein the metal first pillar, the metal second pillar, the metal third pillar, and the metal fourth pillar are formed of copper.

11. The 3D inductor of claim 6 , wherein the first conducting member is a first solder ball, having a base that is solder bonded to the first base pad, and a top that is solder bonded to the first top pad, the second conducting member is a second solder ball, having a base that is solder bonded to the second base pad, and a top that is solder bonded to the second top pad, the third conducting member is a third solder ball, having a base that is solder bonded to the third base pad, and a top that is solder bonded to the third top pad, and the fourth conducting member is a fourth solder ball, having a base that is solder bonded to the fourth base pad, and a top that is solder bonded to the fourth top pad.

12. The 3D inductor of claim 11 , wherein the first solder ball, the first top pad, the first top pad interconnector, the second solder ball, the second base pad, the base pad interconnector, the third base pad, the third solder ball, the third top pad, the second top pad interconnector, the fourth top pad, and the fourth solder ball establish a meander current path, from the first base pad to the fourth base pad, within a reference plane normal to a plane of the given base pad support surface.

13. The 3D inductor of claim 12 , wherein the height of the first solder ball, the second solder ball, the third solder ball and the fourth solder ball, and the pitch are configured wherein the meander current path establishes an inductor approximating a meander inductor having four arms with an arm length corresponding to the height and an arm spacing corresponding to the pitch.

14. The 3D inductor of claim 13 , further comprising:
a lower substrate having a top surface including the given base pad support surface; and
a top support structure having a bottom surface including the given top pad support surface.

15. The 3D inductor of claim 6 , wherein the base pad interconnector is a first base pad interconnector, wherein the 3D inductor further comprises:
a fifth base pad and a sixth base pad on the

Assignees

• Qualcomm Inc

Inventors

• Zuo Chengjie
• Kim Jonghae
• Kim Daeik Daniel
• Yun Changhan Hobie
• Velez Mario Francisco

Classifications

• H10W90/728

  between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/234

  Cross-sectional shape, i.e. in side view · CPC title

• H10W72/232

  Plan-view shape, i.e. in top view · CPC title

• H10W72/075

  of bond wires · CPC title