Method of cutting workpiece

Patent metadata

Field	Value
Publication number	US-10692766-B2
Application number	US-201816008310-A
Country	US
Kind code	B2
Filing date	Jun 14, 2018
Priority date	Jun 15, 2017
Publication date	Jun 23, 2020
Grant date	Jun 23, 2020

Abstract

A method of cutting a workpiece includes forming a guide groove to a depth smaller than the predetermined depth in the workpiece, the guide groove extending from the outer peripheral edge to an end portion of the device area, by causing a cutting blade to cut into the workpiece held on the holding surface of the chuck table from an outer peripheral edge of the workpiece along one of the projected dicing lines; and forming a groove to the predetermined depth in the workpiece along the projected dicing line, the groove extending from the device area beyond an opposite end of the device area to a portion of the outer peripheral extra area, after lowering the cutting blade toward and into the guide groove in the device area and then positioning a cutting edge thereof at the predetermined depth.

First claim

What is claimed is:

1. A method of cutting a plate-shaped workpiece having on a face side thereof a device area that is demarcated by a grid of projected dicing lines into a plurality of subareas where respective devices are formed, and an outer peripheral extra area surrounding the device area, to form cut grooves to a predetermined depth in the device area of the workpiece, comprising:
a holding step of holding the workpiece on a holding surface of a chuck table;
a guide groove forming step of forming a guide groove to a depth smaller than said predetermined depth in the workpiece, said guide groove extending from said outer peripheral edge to an end portion of said device area, by causing a cutting blade to cut into the workpiece held on the holding surface of said chuck table from an outer peripheral edge of the workpiece along one of said projected dicing lines;
after the guide groove forming step, a first retracting step of retracting the cutting blade away from the workpiece by lifting the cutting blade;
after the first retracting step, a device area processing step of forming a groove to said predetermined depth in the workpiece along the projected dicing line, said groove extending from said device area beyond an opposite end of said device area to a portion of said outer peripheral extra area, after lowering the cutting blade toward and into the guide groove in said device area and then positioning a cutting edge thereof at said predetermined depth; and
after the device area processing step, a second retracting step of retracting the cutting blade away from the workpiece by lifting the cutting blade while leaving a portion of said outer peripheral extra area uncut,
wherein surface chippings are prevented by the guide groove from being produced on the workpiece when the cutting blade is lowered toward and into the guide groove at the device area processing step.

2. The method according to claim 1 , further comprising:
before the holding step, a sticking step of sticking a dicing tape to a reverse side of the workpiece,
wherein the workpiece is held on the holding surface of said chuck table through the dicing tape; and
the cutting edge of said cutting blade is caused to cut into the workpiece as far as said dicing tape to form the groove to said predetermined depth, thereby fully severing the workpiece.

Assignees

• Disco Corp

Inventors

• Tanaka Makoto
• Kyo Takatoshi
• Chee Chan Kit

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title