Thermally conductive polymer composition and thermally conductive molded object
US-2017081579-A1 · Mar 23, 2017 · US
Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed circuit board
US10689496B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10689496-B2 |
| Application number | US-201716063429-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 23, 2017 |
| Priority date | Aug 24, 2016 |
| Publication date | Jun 23, 2020 |
| Grant date | Jun 23, 2020 |
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Abstract
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The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.
First claim
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The invention claimed is: 1. A resin composition comprising: a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) consists of a boron nitride particle aggregate comprising primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate. 2. The resin composition according to claim 1 , wherein the boron nitride particle aggregate has a pillar shape. 3. The resin composition according to claim 1 , wherein a longest diameter in a layering direction of the boron nitride particle aggregate is larger than a longest diameter in a width direction of the boron nitride particle aggregate. 4. The resin composition according to claim 1 , wherein the primary hexagonal boron nitride particles have a component derived from a coupling agent. 5. The resin composition according to claim 1 , wherein a content of the inorganic filler (C) is 1 to 1600 parts by mass based on 100 parts by mass of a resin solid component. 6. The resin composition according to claim 1 , wherein a content of the cyanate compound (A) is 1 to 90 parts by mass based on 100 parts by mass of a resin solid component. 7. The resin composition according to claim 1 , wherein a content of the maleimide compound (B) is 1 to 90 parts by mass based on 100 parts by mass of a resin solid component. 8. The resin composition according to claim 1 , further comprising one or more selected from the group consisting of: a cyanate compound other than the cyanate compound (A) represented by the formula (1) and the cyanate compound (A) represented by the formula (2); an epoxy resin; an oxetane resin; a phenol resin; a benzoxazine compound; and a compound having a polymerizable unsaturated group. 9. A prepreg comprising a base material (D), and the resin composition according to claim 1 , with which the base material (D) is impregnated or coated. 10. A metal foil-clad laminate comprising the prepreg according to claim 9 , and a metal foil disposed on one side or both sides of the prepreg, wherein the metal foil-clad laminate comprises a cured product of the resin composition contained in the prepreg. 11. A resin sheet comprising the resin composition according to claim 1 . 12. A printed circuit board comprising an insulating layer, and a conductor layer formed on a surface of the insulating layer, wherein the insulating layer comprises the resin composition according to claim 1 .
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- What does patent US10689496B2 cover?
- The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of…
- Who is the assignee on this patent?
- Mitsubishi Gas Chemical Co
- What technology area does this patent fall under?
- Primary CPC classification B32B15/08. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jun 23 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).