Resin composition for packaging and printed circuit board using the same

Patent metadata

Field	Value
Publication number	US-2016353570-A1
Application number	US-201615136231-A
Country	US
Kind code	A1
Filing date	Apr 22, 2016
Priority date	May 29, 2015
Publication date	Dec 1, 2016
Grant date	—

Abstract

A resin composition for packaging, an insulating film and a printed circuit board manufactured with the resin composition, and a method of manufacturing a printed circuit board with the resin composition are provided. The resin composition for packaging includes an epoxy resin, and inorganic filler particles dispersed in the epoxy resin, and an aspect ratio of the inorganic filler particles is 1.0 or more and 3.0 or less.

First claim

What is claimed is:

1 . A resin composition for packaging, comprising:
an epoxy resin; and inorganic filler particles dispersed in the epoxy resin, wherein an aspect ratio of the inorganic filler particles is 1.0 or more and 3.0 or less.

2 . The resin composition for packaging of claim 1 , wherein the resin composition has an inorganic filler particle content of 15% or less based on a total volume of the resin composition.

3 . The resin composition for packaging of claim 1 , wherein an aspect ratio of the inorganic filler particles is approximately 2.0, and the resin composition has an inorganic filler particle content of 15% or less based on a total volume of the resin composition.

4 . The resin composition for packaging of claim 1 , wherein an aspect ratio of the inorganic filler particles is approximately 3.0, and the resin composition has an inorganic filler particle content of 7% or less based on a total volume of the resin composition.

5 . The resin composition for packaging of claim 1 , wherein an aspect ratio of the inorganic filler particles is 1.5 or more and 2.5 or less, and the resin composition has an inorganic filler particle content of 5% or more and 15% or less based on a total volume of the resin composition.

6 . The resin composition for packaging of claim 1 , wherein the inorganic filler particles are substantially uniformly dispersed within the resin composition.

7 . The resin composition for packaging of claim 1 , wherein the inorganic filler particles have a columnar shape with one end being circular.

8 . The resin composition for packaging of claim 1 , wherein the inorganic filler particles have a columnar shape with one end having an oval shape.

9 . The resin composition for packaging of claim 1 , wherein the inorganic filler particles have a pipe shape.

10 . The resin composition for packaging of claim 1 , wherein the inorganic filler particles comprise at least one selected from the group consisting of silica, glass, calcium carbonate.

11 . A printed circuit board comprising:
an insulating film manufactured using a resin composition for packaging, the resin composition comprising an epoxy resin and inorganic filler particles dispersed in the epoxy resin, an aspect ratio of the inorganic filler particles being 1.0 or more and 3.0 or less; and a conductive wire formed on the insulating film.

12 . The printed circuit board of claim 9 , wherein the conductive wire protrudes into a surface of the insulating film by forming a depression, and
a ratio c/a is equal to or less than ½, wherein a width of a lower part of the depression at which the conductive wire protrudes into one surface of the insulating film is a, and a length of the inorganic filler particles is c.

13 . A method of manufacturing a printed circuit board, the method comprising:
forming an insulating film using a resin composition, the resin composition comprising an epoxy resin and inorganic filler particles dispersed in the epoxy resin, an aspect ratio of the inorganic filler particles being 1.0 or more and 3.0 or less; and forming a conductive wire to contact the insulating film.

14 . The method of claim 13 , wherein the forming of the insulating film comprises molding the insulating film to have a depression, and
the forming of the conductive wire comprises filling the depression with a conductive material.

15 . The method of claim 14 , wherein at least a portion of inorganic filler particles disposed at an interface between the insulating film and the conductive wire filled in the depression embeds into both the insulating film and the conductive wire.

Assignees

• Samsung Electro Mech

Inventors

• Lee Sung Chul

Classifications

• H05K2201/0248

  Needles or elongated particles; Elongated cluster of chemically bonded particles · CPC title

• H05K2201/0376

  Flush conductors, i.e. flush with the surface of the printed circuit · CPC title

• C08K2003/265

  Calcium, strontium or barium carbonate · CPC title

• C08K3/013

  Fillers, pigments or reinforcing additives · CPC title

• C08K7/00

  Use of ingredients characterised by shape · CPC title