Polishing composition
US-2015291850-A1 · Oct 15, 2015 · US
US10669462B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10669462-B2 |
| Application number | US-201515504779-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 10, 2015 |
| Priority date | Sep 17, 2014 |
| Publication date | Jun 2, 2020 |
| Grant date | Jun 2, 2020 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Abrasives, a polishing composition, and a polishing method that can reduce undulation of an outer surface of a resin coating by polishing with reduced occurrence of polishing flaws. The polishing composition includes abrasives of aluminium oxide particles having a specific surface area of 5 m2/g or more and 50 m2/g or less and an average secondary particle diameter of 0.05 μm or more and 4.8 μm or less. This polishing composition can be used for polishing an outer surface of the resin coating.
Opening claim text (preview).
The invention claimed is: 1. A polishing method comprising polishing an outer surface of a resin coating using a polishing composition containing a polishing material including particles of aluminium oxide having a specific surface area of 5 m 2 /g or more and 50 m 2 /g or less and an average secondary particle size of 0.05 μm or more and 4.8 μm or less, wherein the aluminium oxide has an α-phase content of 40% or more. 2. The polishing method according to claim 1 , wherein polishing is performed with a polishing temperature kept at a temperature less than or equal to a glass transition point of a resin constituting the resin coating. 3. The polishing method according to claim 1 , wherein the polishing is performed with a polishing temperature kept at 50° C. or less. 4. The polishing method according to claim 1 , wherein the polishing is performed with a polishing pad having a soft polishing surface. 5. The polishing method according to claim 4 , wherein a first-stage polishing is performed with a second polishing pad having a polishing surface harder than the soft polishing surface of the polishing pad, and thereafter, a second-stage polishing is performed with the polishing pad having the soft polishing surface. 6. The polishing method according to claim 4 , wherein polishing is performed with a compressive force of the polishing surface on the outer surface of the resin coating being kept constant. 7. A coating member in which a surface of a base material is covered with a resin coating, wherein an outer surface of the resin coating is polished using the polishing composition according to claim 1 . 8. A method for producing a coating member in which a surface of a base material is covered with a resin coating, the method comprising the step of polishing an outer surface of the resin coating of the coating member using the polishing composition according to claim 1 . 9. The polishing method according to claim 1 , wherein a content of the polishing material is 0.1 mass % or more and 50 mass % or less.
Abrasive powders, suspensions and pastes for polishing · CPC title
Lapping machines or devices; Accessories (B24B3/00 takes precedence) · CPC title
Anti-slip materials; Abrasives {(products specifically intended for the fabrication of abrasive tools, blocks or papers, or for operations of the kind of sand-blasting and barrelling B24B31/14, B24C1/00; polishing compositions containing abrasive or grinding agents C09G1/02; friction compositions for brakes or clutches F16D69/02; polishing of semi-conductors H10P52/40)} · CPC title
containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} · CPC title
Lapping tools · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.