Abrasives, polishing composition, and polishing method

US10669462B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10669462-B2
Application numberUS-201515504779-A
CountryUS
Kind codeB2
Filing dateSep 10, 2015
Priority dateSep 17, 2014
Publication dateJun 2, 2020
Grant dateJun 2, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Abrasives, a polishing composition, and a polishing method that can reduce undulation of an outer surface of a resin coating by polishing with reduced occurrence of polishing flaws. The polishing composition includes abrasives of aluminium oxide particles having a specific surface area of 5 m2/g or more and 50 m2/g or less and an average secondary particle diameter of 0.05 μm or more and 4.8 μm or less. This polishing composition can be used for polishing an outer surface of the resin coating.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polishing method comprising polishing an outer surface of a resin coating using a polishing composition containing a polishing material including particles of aluminium oxide having a specific surface area of 5 m 2 /g or more and 50 m 2 /g or less and an average secondary particle size of 0.05 μm or more and 4.8 μm or less, wherein the aluminium oxide has an α-phase content of 40% or more. 2. The polishing method according to claim 1 , wherein polishing is performed with a polishing temperature kept at a temperature less than or equal to a glass transition point of a resin constituting the resin coating. 3. The polishing method according to claim 1 , wherein the polishing is performed with a polishing temperature kept at 50° C. or less. 4. The polishing method according to claim 1 , wherein the polishing is performed with a polishing pad having a soft polishing surface. 5. The polishing method according to claim 4 , wherein a first-stage polishing is performed with a second polishing pad having a polishing surface harder than the soft polishing surface of the polishing pad, and thereafter, a second-stage polishing is performed with the polishing pad having the soft polishing surface. 6. The polishing method according to claim 4 , wherein polishing is performed with a compressive force of the polishing surface on the outer surface of the resin coating being kept constant. 7. A coating member in which a surface of a base material is covered with a resin coating, wherein an outer surface of the resin coating is polished using the polishing composition according to claim 1 . 8. A method for producing a coating member in which a surface of a base material is covered with a resin coating, the method comprising the step of polishing an outer surface of the resin coating of the coating member using the polishing composition according to claim 1 . 9. The polishing method according to claim 1 , wherein a content of the polishing material is 0.1 mass % or more and 50 mass % or less.

Assignees

Inventors

Classifications

  • C09K3/1454Primary

    Abrasive powders, suspensions and pastes for polishing · CPC title

  • Lapping machines or devices; Accessories (B24B3/00 takes precedence) · CPC title

  • Anti-slip materials; Abrasives {(products specifically intended for the fabrication of abrasive tools, blocks or papers, or for operations of the kind of sand-blasting and barrelling B24B31/14, B24C1/00; polishing compositions containing abrasive or grinding agents C09G1/02; friction compositions for brakes or clutches F16D69/02; polishing of semi-conductors H10P52/40)} · CPC title

  • containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} · CPC title

  • Lapping tools · CPC title

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What does patent US10669462B2 cover?
Abrasives, a polishing composition, and a polishing method that can reduce undulation of an outer surface of a resin coating by polishing with reduced occurrence of polishing flaws. The polishing composition includes abrasives of aluminium oxide particles having a specific surface area of 5 m2/g or more and 50 m2/g or less and an average secondary particle diameter of 0.05 μm or more and 4.8 μm…
Who is the assignee on this patent?
Fujimi Inc
What technology area does this patent fall under?
Primary CPC classification C09K3/1454. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 02 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).