Resistive soldering method, assembly of antenna and glass, and resistive soldering system

Patent metadata

Field	Value
Publication number	US-10668549-B2
Application number	US-201716301685-A
Country	US
Kind code	B2
Filing date	May 4, 2017
Priority date	May 20, 2016
Publication date	Jun 2, 2020
Grant date	Jun 2, 2020

Abstract

A resistive soldering method, assembly of antenna and glass, and resistive soldering system are provided. The method includes providing glass and an antenna component including a base structure and a cylindrical structure having a hole on a front surface of the base structure; forming solder on a surface to be soldered of the glass or a surface to be soldered of the base structure; resistive soldering the surfaces to be soldered of the glass and the base structure to melt the solder, wherein during the resistive soldering process, first and second electrodes are used to apply pressure and heating current to edge portion on the front surface of the base structure, and a support cylinder is inserted into the hole and applies to the antenna component a pressure for attaching the antenna component to the glass.

First claim

What is claimed is:

1. A resistive soldering method, comprising:
providing a glass and an antenna component which comprises a base structure and a cylindrical structure, wherein the base structure has a first surface to be soldered and a front surface opposite to the first surface to be soldered, and comprises a central portion and an edge portion surrounding the central portion, and the cylindrical structure is located on the central portion on the front surface of the base structure, and has a hole penetrating through a thickness of the cylindrical structure;
forming solder on a second surface to be soldered of the glass and/or the first surface to be soldered of the base structure;
performing a resistive soldering process to the second surface to be soldered of the glass and the first surface to be soldered of the base structure to melt the solder therebetween, wherein during the resistive soldering process, a first electrode and a second electrode are used to apply a first pressure and provide a heating current to the edge portion on the front surface of the base structure, and a support cylinder is inserted into the hole of the cylindrical structure and adapted to apply to the antenna component a second pressure for attaching the antenna component to the glass; and
after the resistive soldering process, performing a cooling treatment to the glass and the antenna component to cool the glass and the antenna component.

2. The method according to claim 1 , wherein during the resistive soldering process, the support cylinder is further adapted to fix the antenna component to the glass.

3. The method according to claim 1 , wherein the support cylinder is further adapted to reduce relative displacement of the antenna component and the glass.

4. The method according to claim 1 , wherein the resistive soldering process comprises: the support cylinder being inserted into the hole of the cylindrical structure to apply to the antenna component the second pressure for attaching the antenna component to the glass; a first electrode and a second electrode being used to apply the first pressure to the edge portion on the front surface of the base structure; and providing the heating current.

5. The method according to claim 4 , wherein the first electrode and the second electrode contact with the edge portion on the front surface of the base structure.

6. The method according to claim 4 , wherein a pre-heating treatment is performed to the glass and the antenna component before the heating current is provided.

7. The method according to claim 6 , wherein a heating temperature in the pre-heating treatment is within a range from 50° C. to 110° C.

8. The method according to claim 1 , wherein a heating current is within a range from 120 A to 150 A.

9. The method according to claim 1 , wherein during the cooling treatment, the first electrode and the second electrode are used to continue applying the first pressure to the edge portion on the front surface of the base structure, and the support cylinder is used to continue applying to the antenna component the second pressure for attaching the antenna component to the glass.

10. The method according to claim 1 , wherein a time period of the resistive soldering process is within a range from 1.5 S to 3 S, and a time period of the cooling treatment is within a range from 4 S to 6 S.

11. The method according to claim 1 , wherein the second pressure applied to the antenna component by the support cylinder is no less than 10N.

12. The method according to claim 1 , wherein during the resistive soldering process, an angle between the first electrode and the front surface of the base structure is not greater than 90°, a distance between the first electrode and the cylindrical structure gradually increases along a direction from a bottom to a top of the hole of the cylindrical structure, an angle between the second electrode and the front surface of the base structure is not greater than 90°, and a distance between the second electrode and the cylindrical structure gradually increases along the direction from the bottom to the top of the hole of the cylindrical structure.

13. The method according to claim 12 , wherein during the resistive soldering process, the angle between the first electrode and the front surface of the base structure is within a range from 45° to 90°, and the angle between the second electrode and the front surface of the base structure is within a range from 45° to 90°.

14. The method according to claim 1 , wherein both the first electrode and the second electrode have a falling wedge-shaped end, and during the resistive soldering process, a tip of the falling wedge-shaped end of the first electrode and a tip of the falling wedge-shaped end of the second electrode contact with the edge portion on the front surface of the base structure.

15. The method according to claim 1 , wherein the material of the support cylinder comprises a ceramic, resinous, metal or alloyed material.

16. The method according to claim 1 , wherein the hole of the cylindrical structure is a through hole, and on a sectional surface parallel with the second surface to be soldered of the glass, a diameter of a first portion of the support cylinder being inserted into the through hole is smaller than a diameter of the through hole.

17. The method according to claim 16 , wherein during the resistive soldering process, the support cylinder inserted into the through hole is in contact with the front surface of the base structure.

18. The method according to claim 16 , wherein during the resistive soldering process, length of the first portion of the support cylinder being inserted into the through hole is smaller than or equal to depth of the through hole, and a top of the through hole is in contact with the support cylinder so that the top of the through hole gets stuck with the support cylinder.

19. The method according to claim 18 , wherein along a direction from a bottom to the top of the hole of the cylindrical structure, a diameter of the first portion of the support cylinder being inserted into the hole gradually increases on a sectional surface parallel with the second surface to be soldered of the glass, and a diameter of a second portion of the support cylinder being contacting with the top of the hole is greater than a diameter of the top of the hole.

20. The method according to claim 18 , wherein the support cylinder comprises a central axial structure and a bump structure on the periphery of the central axial structure, and during the resistive soldering process, a portion of the central axial structure below the bump structure is inserted into the through hole, and a bottom of the bump structure presses against the top of the through hole.

21. The method according to claim 20 , wherein the bump structure is an annular structure surrounding the periphery of the central axial structure, or the bump structure comprises at least two separate bumps.

22. The method according to claim 1 , wherein on a sectional surface parallel with the second surface to be soldered of the glass, the hole of the cylindrical structure has a diameter within a range from 3 centimeters to 5 centimeters, the cylindrical structure has a diameter within a range from 4 centimeters to 8 centimeters, and the base structure has a diameter within a range from 5 centimeters to 10 centimeters.

23. An assembly of antenna and glass, comprising:
an antenna component and a glass, wherein t

Assignees

• Shi Ce
• Yu Shengwen
• Wu Huanhuan
• Saint Gobain

Inventors

• Shi Ce
• Yu Shengwen
• Wu Huanhuan

Classifications

• B23K2103/52

  Ceramics · CPC title

• B23K2103/04

  Steel {or steel} alloys · CPC title

• B23K2103/02

  Iron or ferrous alloys · CPC title

• B23K2103/54

  Glass · CPC title

• B23K1/0004 Primary

  Resistance soldering · CPC title